BS PD IEC TS 62239-1-2015 Process management for avionics Management plan Preparation and maintenance of an electronic components management plan《航空电子设备过程管理 管理计划 电子组件管理计划的.pdf
《BS PD IEC TS 62239-1-2015 Process management for avionics Management plan Preparation and maintenance of an electronic components management plan《航空电子设备过程管理 管理计划 电子组件管理计划的.pdf》由会员分享,可在线阅读,更多相关《BS PD IEC TS 62239-1-2015 Process management for avionics Management plan Preparation and maintenance of an electronic components management plan《航空电子设备过程管理 管理计划 电子组件管理计划的.pdf(82页珍藏版)》请在麦多课文档分享上搜索。
1、BSI Standards Publication Process management for avionics Management plan Part 1: Preparation and maintenance of an electronic components management plan PD IEC/TS 62239-1:2015National foreword This Published Document is the UK implementation of IEC/TS 62239-1:2015. It supersedes PD IEC/TS 62239-1:2
2、012 which is now withdrawn. The UK participation in its preparation was entrusted to Technical Committee GEL/107, Process management for avionics. A list of organizations represented on this committee can be obtained on request to its secretary. This publication does not purport to include all the n
3、ecessary provisions of a contract. Users are responsible for its correct application. The British Standards Institution 2015. Published by BSI Standards Limited 2015 ISBN 978 0 580 87989 0 ICS 03.100.50; 31.020; 49.060 Compliance with a British Standard cannot confer immunity from legal obligations.
4、 This Published Document was published under the authority of the Standards Policy and Strategy Committee on 30 April 2015. Amendments/corrigenda issued since publication Date Text affected PUBLISHED DOCUMENT PD IEC/TS 62239-1:2015 IEC TS 62239-1 Edition 2.0 2015-04 TECHNICAL SPECIFICATION Process m
5、anagement for avionics Management plan Part 1: Preparation and maintenance of an electronic components management plan INTERNATIONAL ELECTROTECHNICAL COMMISSION ICS 03.100.50; 31.020; 49.060 ISBN 978-2-8322-2608-7 Registered trademark of the International Electrotechnical Commission Warning! Make su
6、re that you obtained this publication from an authorized distributor. colour inside PD IEC/TS 62239-1:2015 2 IEC TS 62239-1:2015 IEC 2015 CONTENTS FOREWORD . 4 INTRODUCTION . 6 1 Scope 7 2 Normative references 7 3 Terms, definitions and abbreviations . 7 3.1 Terms and definitions 8 3.2 Abbreviations
7、 12 4 Technical requirements . 13 4.1 General . 13 4.2 Component selection 14 4.2.1 General 14 4.2.2 Application conditions for use 14 4.2.3 Availability and durability . 14 4.2.4 Additional performance 14 4.2.5 Component identification . 14 4.3 Component application . 15 4.3.1 General 15 4.3.2 Elec
8、tromagnetic compatibility (EMC) 15 4.3.3 Derating and stress analysis 15 4.3.4 Thermal analysis 16 4.3.5 Mechanical analysis . 17 4.3.6 Testing, testability, and maintainability . 17 4.3.7 Avionics radiation environment 18 4.3.8 Management of lead-free termination finish and soldering 18 4.3.9 Count
9、erfeited, fraudulent and recycled component avoidance 18 4.3.10 Moisture and corrosion 19 4.3.11 Additional customer related application requirements 19 4.4 Component qualification 19 4.4.1 General 19 4.4.2 Minimum component qualification requirements . 20 4.4.3 Original component manufacturer quali
10、ty management 20 4.4.4 Original component manufacturer process management approval 20 4.4.5 Demonstration of component qualification 20 4.4.6 Qualification of components from a supplier that is not qualified 22 4.4.7 Distributor process management approval . 22 4.4.8 Subcontractor assembly facility
11、quality and process management approval 23 4.5 Continuous component quality assurance . 23 4.5.1 General quality assurance requirements 23 4.5.2 On-going component quality assurance . 23 4.5.3 Plan owner in-house continuous monitoring . 24 4.5.4 Component design and manufacturing process change moni
12、toring 24 4.6 Component dependability 25 4.6.1 General 25 4.6.2 Component availability and associated risk assessment 25 4.6.3 Component obsolescence 25 PD IEC/TS 62239-1:2015IEC TS 62239-1:2015 IEC 2015 3 4.6.4 Proactive measures . 26 4.6.5 Component obsolescence awareness 26 4.6.6 Reporting . 26 4
13、.6.7 Semiconductor reliability and wear out . 26 4.6.8 Reliability assessment . 26 4.7 Component compatibility with the equipment manufacturing process 27 4.8 Component data . 27 4.8.1 General 27 4.8.2 Minimum component data requirements . 28 4.9 Configuration control . 28 4.9.1 General 28 4.9.2 Alt
14、ernative components 29 4.9.3 Alternative sources 29 4.9.4 Equipment change documentation . 29 4.9.5 Customer notifications and approvals 29 4.9.6 Focal organization . 30 5 Plan administration requirements . 30 5.1 Plan organization 30 5.2 Plan terms and definitions . 30 5.3 Plan focal point . 30 5.3
15、.1 Primary interface . 30 5.3.2 Plan focal point responsibilities 30 5.4 Plan references. 30 5.5 Plan applicability . 30 5.6 Plan implementation . 31 5.6.1 ECMP compliance 31 5.6.2 Plan objectives 31 5.6.3 Plan owner subcontracted activities . 31 5.7 Plan acceptance . 31 5.8 Plan maintenance . 31 An
16、nex A (informative) Requirement matrix for IEC TS 62239-1 32 Annex B (informative) Typical qualification requirements and typical component minimum qualification requirements 53 Annex C (informative) Semiconductor reliability and wear out 57 Annex D (informative) Guidelines for environmental protect
17、ion techniques and for comparison of components specifications . 58 Bibliography 73 Figure 1 Suspect components perimeter 19 Table A.1 Requirements matrix 32 Table B.1 Typical qualification requirements and typical component minimum qualification requirements . 54 Table D.1 Environmental protection
18、techniques to be considered during the avionics design process . 58 Table D.2 Guidelines for the comparison of internationally available component specifications Microcircuits 63 PD IEC/TS 62239-1:2015 4 IEC TS 62239-1:2015 IEC 2015 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ PROCESS MANAGEMENT FOR
19、AVIONICS MANAGEMENT PLAN Part 1: Preparation and maintenance of an electronic components management plan FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The
20、object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specific
21、ations (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental organizations l
22、iaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters exp
23、ress, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Commi
24、ttees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC Nation
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