BS PD IEC PAS 61249-8-5-2014 Qualification and performance specification of permanent solder mask and flexible cover materials《永久焊接面罩和柔性覆盖材料的性能规格和合格鉴定》.pdf

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1、BSI Standards Publication Qualification and performance specification of permanent solder mask and flexible cover materials PD IEC/PAS 61249-8-5:2014National foreword This Published Document is the UK implementation of IEC/PAS 61249-8-5:2014. The UK participation in its preparation was entrusted to

2、Technical Com- mittee EPL/501, Electronic assembly technology any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental organizations liaising with the IEC also participate in this preparation. IEC coll

3、aborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion

4、on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensur

5、e that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to

6、the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification

7、 bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attac

8、h to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees)

9、 and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication

10、. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. A PAS is a technical specification not fulfilling the requirements for a standard, but ma

11、de available to the public. IEC PAS 61249-8-5, submitted by IPC has been processed by IEC technical committee 91: Electronics assembly technology. It is based on IPC-SM-840E. It is published as a double- logo PAS. The structure and editorial rules used in this PAS reflect the practice of the organiz

12、ation which submitted it. The text of this PAS is based on the following document: This PAS was approved for publication by the P-members of the committee concerned as indicated in the following document Draft PAS Report on voting 91/1157/PAS 91/1174/RVD Following publication of this PAS, the techni

13、cal committee or subcommittee concerned may transform it into an International Standard. PD IEC/PAS 61249-8-5:2014IEC PAS 61249-8-5:2014 IEC 2014 3 This PAS shall remain valid for an initial maximum period of 3 years starting from the publication date. The validity may be extended for a single perio

14、d up to a maximum of 3 years, at the end of which it shall be published as another type of normative document, or shall be withdrawn. PD IEC/PAS 61249-8-5:2014IPC-SM-840E 2010 - December Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials Supersedes IPC-

15、SM-840D April 2007 A standard developed by IPC Association Connecting Electronics Industries PD IEC/PAS 61249-8-5:2014The Principles of Standardization In May 1995 the IPCs Technical Activities Executive Committee (TAEC) adopted Principles of Standardization as a guiding principle of IPCs standardiz

16、ation efforts. Standards Should: Show relationship to Design for Manufacturability (DFM) and Design for the Environment (DFE) Minimize time to market Contain simple (simplied) language Just include spec information Focus on end product performance Include a feedback system on use and problems for fu

17、ture improvement Standards Should Not: Inhibit innovation Increase time-to-market Keep people out Increase cycle time Tell you how to make something Contain anything that cannot be defended with data Notice IPC Standards and Publications are designed to serve the public interest through eliminating

18、mis- understandings between manufacturers and purchasers, facilitating interchangeability and improve- ment of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existence of such Standards and Publications shall not in any

19、 respect preclude any member or nonmember of IPC from manufacturing or selling products not conforming to such Standards and Publication, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than IPC members, whether the standard is to be used either

20、 domestically or internationally. Recommended Standards and Publications are adopted by IPC without regard to whether their adop- tion may involve patents on articles, materials, or processes. By such action, IPC does not assume any liability to any patent owner, nor do they assume any obligation wh

21、atever to parties adopting the Recommended Standard or Publication. Users are also wholly responsible for protecting them- selves against all claims of liabilities for patent infringement. IPC Position Statement on Specification Revision Change It is the position of IPCs Technical Activities Executi

22、ve Committee that the use and implementation of IPC publications is voluntary and is part of a relationship entered into by customer and supplier. When an IPC publication is updated and a new revision is published, it is the opinion of the TAEC that the use of the new revision as part of an existing

23、 relationship is not automatic unless required by the contract. The TAEC recommends the use of the latest revision. Adopted October 6, 1998 Why is there a charge for this document? Your purchase of this document contributes to the ongoing development of new and updated industry standards and publica

24、tions. Standards allow manufacturers, customers, and suppliers to understand one another better. Standards allow manufacturers greater efficiencies when they can set up their processes to meet industry standards, allowing them to offer their customers lower costs. IPC spends hundreds of thousands of

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28、 Copyright 2010. IPC, Bannockburn, Illinois, USA. All rights reserved under both international and Pan-American copyright conventions. Any copying, scanning or other reproduction of these materials without the prior written consent of the copyright holder is strictly prohibited and constitutes infri

29、ngement under the Copyright Law of the United States. PD IEC/PAS 61249-8-5:2014IPC-SM-840E Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials Developed by the Solder Mask Performance Task Group (5-33B) of the Cleaning and Coating Committee (5-30) and th

30、e Covercoat Materials Task Group (D-13B) of the Flexible Circuits Committee (D-10) of IPC Users of this publication are encouraged to participate in the development of future revisions. Contact: IPC 3000 Lakeside Drive, Suite 309S Bannockburn, Illinois 60015-1249 Tel 847 615.7100 Fax 847 615.7105 Su

31、persedes: IPC-SM-840D - April 2007 IPC-SM-840C - Amendment 1 - June 2000 IPC-SM-840C - January 1995 IPC-SM-840B - May 1988 IPC-SM-840A - July 1983 IPC-SM-840 - November 1977 PD IEC/PAS 61249-8-5:2014This Page Intentionally Left BlankAcknowledgment Anydocumentinvolvingacomplextechnologydrawsmaterialf

32、romavastnumberofsources.Whiletheprincipalmembers oftheSolderMaskPerformanceTaskGroup(5-33B)oftheCleaningandCoatingCommittee(5-30)andtheCovercoatMate- rialsTaskGroup(D-13B)oftheFlexibleCircuitsCommittee(D-10)areshownbelow,itisnotpossibletoincludeallofthose whoassistedintheevolutionofthisstandard.Toea

33、chofthem,themembersofIPCextendtheirgratitude. FlexibleCircuits Committee SolderMaskPerformance TaskGroup CovercoatMaterials TaskGroup Chair DouglasO.Pauls RockwellCollins Vice-Chair DeboraL.Obitz TraceLaboratories-East Chair DavidA.Vaughan TaiyoAmerica,Inc. Vice-Chair DouglasO.Pauls RockwellCollins

34、Chair SteveA.Musante RaytheonMissileSystems TechnicalLiaisonsofthe IPCBoardofDirectors PeterBigelow IMIInc. SammyYi AptinaImagingCorporation SolderMaskPerformanceTaskGroupandCovercoatMaterialsTaskGroup GregoryBartlett,TeledynePrinted CircuitTechnologies JohnBauer,RockwellCollins MichaelBeauchesne,Am

35、phenolPrinted Circuits,Inc. JoshuaCiviello,DefenseSupplyCenter Columbus MarkFinstad,FlexibleCircuit Technologies,Inc. ThomasF.Gardeski,GeminiSciences MarcGoudreau,VulcanFlexCircuit Corporation RussellGriffith,FlexibleCircuitsInc. MichaelJ.Jawitz,BoeingSatellite DevelopmentCenter NickKoop,MincoProduc

36、tsInc. KarinLaBerge,MicrotekLaboratories JohnLeschisin,MincoProductsInc. AnneLomonte,DraegerMedical Systems,Inc. DuaneB.Mahnke,DBMahnke Consulting ThomasMcCarthy,TaconicAdvanced DielectricDivision RogerJ.Miedico,RaytheonCompany WilliamOrtloff,RaytheonCompany RobertSheldon,PioneerCircuitsInc. TerrySh

37、epler,Electro-Materials,Inc. DouglasJ.Sober,KanekaTexas Corporation BrentSweitzer,MultekFlexible Circuits,Inc. SteveJ.Vetter,NSWCCrane ClarkF.Webster,ALLFlexLLC MiouYamaoka,MeikoElectronicsCo. Ltd. December2010 IPC-SM-840E iii PD IEC/PAS 61249-8-5:2014ThisPageIntentionallyLeftBlank IPC-SM-840E Decem

38、ber2010 iv PD IEC/PAS 61249-8-5:2014TableofContents 1 SCOPEANDDESIGNATION1 1.1 Scope.1 1.2 Purpose1 1.3 Classes.1 1.4 Presentation2 1.5 TermsandDefinitions.2 1.5.1 AsAgreedBetweenUserandSupplier (AABUS).2 1.5.2 Blistering2 1.5.3 Chalking(CuredSolderMaskorCover Material)2 1.5.4 ColorChange(CuredSolde

39、rMaskorCover Material)2 1.5.5 CoC.2 1.5.6 Covercoat.2 1.5.7 Coverfilm.2 1.5.8 CoverMaterial2 1.5.9 Crazing(ConformalorSolderMaskorCover Material)2 1.5.10 Delamination(CuredSolderMaskorCover Material)2 1.5.11 FTIR2 1.5.12 Liquefaction(CuredSolderMaskorCover Material)3 1.5.13 Peeling(CuredSolderMask)3

40、 1.5.14 SAC3053 1.5.15 Softening(CuredSolderMaskorCover Material)3 1.5.16 SolderMask.3 1.5.17 Swelling(CuredSolderMaskorCover Material)3 1.5.18 Tackiness(SolderMaskorCoverMaterial).3 1.5.19 Wicking(SolderMaskorCovercoat)3 1.6 RevisionLevelChanges.3 2 APPLICABLEDOCUMENTS3 2.1 IPC3 2.2 UnderwritersLab

41、oratories4 2.3 ASTM4 2.4 PrecedenceofDocuments4 3 REQUIREMENTS4 3.1 Qualification/Conformance4 3.1.1 MaterialQualificationandConformance.4 3.1.2 PrintedBoardProcessQualificationand Assessment.5 3.1.3 Requalification5 3.2 Materials5 3.2.1 FormulationChange5 3.2.2 Compatibility5 3.2.3 ShelfLife.7 3.2.

42、4 Color7 3.2.5 Cure.7 3.2.6 Non-Nutrient7 3.3 VisualRequirements.7 3.3.1 Appearance.7 3.3.2 Discoloration(MetallicSurfaces)7 3.3.3 Discoloration(SolderMaskorCover Material)7 3.4 DimensionalRequirements7 3.4.1 SolderMaskorCoverMaterialThickness.7 3.5 PhysicalRequirements.7 3.5.1 PencilHardness7 3.5.2

43、 Adhesion7 3.5.3 Machinability8 3.5.4 Flexibility.9 3.6 ChemicalRequirements.9 3.6.1 ResistancetoFabricationSolvents,Cleaning AgentsandFluxes.9 3.6.2 HydrolyticStability.9 3.6.3 Flammability9 3.7 SolderingRequirements.9 3.7.1 Solderability.9 3.7.2 ResistancetoTin-LeadSolder9 3.7.3 ResistancetoLeadFr

44、eeSolder.10 3.8 ElectricalRequirements.10 3.8.1 DielectricStrength10 3.8.2 InsulationResistance.10 3.9 EnvironmentalRequirements.10 3.9.1 MoistureandInsulationResistance.10 3.9.2 ElectrochemicalMigration.10 3.9.3 ThermalShock10 4 QUALITYASSURANCEPROVISIONS11 4.1 ResponsibilityforTesting/Inspection11

45、 4.1.1 InitialQualificationTesting11 4.1.2 TestorInspectionFacilities11 4.2 QualificationInspection.11 4.2.1 SampleSize11 4.2.2 InspectionRoutine11 4.2.3 Failures11 4.3 QualityConformanceTesting/Inspection.11 4.3.1 Testing/InspectionofProductforDelivery11 4.4 PreparationofSpecimensforTest.12 4.4.1 StandardLaboratoryConditions.12 4.4.2 SpecimenSelection.13 4.4.3 Coating13 4.4.4 Number14 December2010 IPC-SM-840E v PD IEC/PAS 61249-8-5:2014