ISO IEC 7810 AMD 1-2009 Identification cards - Physical characteristics - Amendment 1 Criteria for cards containing integrated circuits《识别卡 物理特性 修改件1 含有集成电路的卡片标.pdf

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1、 Reference number ISO/IEC 7810:2003/Amd.1:2009(E) ISO/IEC 2009INTERNATIONAL STANDARD ISO/IEC 7810 Third edition 2003-11-01 AMENDMENT 1 2009-12-15 Identification cards Physical characteristics AMENDMENT 1: Criteria for cards containing integrated circuits Cartes didentification Caractristiques physiq

2、ues AMENDEMENT 1: Critres pour les cartes contenant des circuits intgrs ISO/IEC 7810:2003/Amd.1:2009(E) PDF disclaimer This PDF file may contain embedded typefaces. In accordance with Adobes licensing policy, this file may be printed or viewed but shall not be edited unless the typefaces which are e

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5、roblem relating to it is found, please inform the Central Secretariat at the address given below. COPYRIGHT PROTECTED DOCUMENT ISO/IEC 2009 All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical

6、, including photocopying and microfilm, without permission in writing from either ISO at the address below or ISOs member body in the country of the requester. ISO copyright office Case postale 56 CH-1211 Geneva 20 Tel. + 41 22 749 01 11 Fax + 41 22 749 09 47 E-mail copyrightiso.org Web www.iso.org

7、Published in Switzerland ii ISO/IEC 2009 All rights reservedISO/IEC 7810:2003/Amd.1:2009(E) ISO/IEC 2009 All rights reserved iiiForeword ISO (the International Organization for Standardization) and IEC (the International Electrotechnical Commission) form the specialized system for worldwide standard

8、ization. National bodies that are members of ISO or IEC participate in the development of International Standards through technical committees established by the respective organization to deal with particular fields of technical activity. ISO and IEC technical committees collaborate in fields of mu

9、tual interest. Other international organizations, governmental and non-governmental, in liaison with ISO and IEC, also take part in the work. In the field of information technology, ISO and IEC have established a joint technical committee, ISO/IEC JTC 1. International Standards are drafted in accord

10、ance with the rules given in the ISO/IEC Directives, Part 2. The main task of the joint technical committee is to prepare International Standards. Draft International Standards adopted by the joint technical committee are circulated to national bodies for voting. Publication as an International Stan

11、dard requires approval by at least 75 % of the national bodies casting a vote. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. ISO and IEC shall not be held responsible for identifying any or all such patent rights. Amendment 1 to

12、 ISO/IEC 7810:2003 was prepared by Joint Technical Committee ISO/IEC JTC 1, Information technology, Subcommittee SC 17, Cards and personal identification. It reflects a transfer of certain physical requirements from integrated circuit card standards (primarily ISO/IEC 14443-1). ISO/IEC 7810:2003/Amd

13、.1:2009(E) ISO/IEC 2009 All rights reserved 1Identification cards Physical characteristics AMENDMENT 1: Criteria for cards containing integrated circuits Page v, Introduction Add the following after list item 6: “7. Criteria for cards containing certain types of integrated circuit have been added.”

14、Page 1, Clause 3 Add the following to the list of normative references: ISO/IEC 10373-3, Identification cards Test methods Part 3: Integrated circuit cards with contacts and related interface devices ISO/IEC 10373-6, Identification cards Test methods Part 6: Proximity cards ISO/IEC 10373-7, Identifi

15、cation cards Test methods Part 7: Vicinity cards Page 6 Add the following new clause after 8.14: 9 Criteria for cards containing integrated circuits The following characteristics only apply to cards containing integrated circuits (ICs). 9.1 X-rays The card shall continue to operate as intended after

16、 exposure of any card surface to medium-energy X-radiation as described in the test methods in ISO/IEC 10373-1, with energy in the range of 70 keV to 140 keV, of a cumulative dose of 0,1 Gy per year. NOTE This corresponds to approximately twice the maximum acceptable dose to which humans may be expo

17、sed annually. 9.2 Dynamic bending stress When subjected to a total of 1 000 bending cycles, the card shall remain testably functional and shall not show any cracked part after testing the card in accordance with the test methods described in ISO/IEC 10373-1. 9.3 Dynamic torsional stress When subject

18、ed to a total of 1 000 torsion cycles, the card shall remain testably functional and shall not show any cracked part after testing in accordance with the test methods described in ISO/IEC 10373-1. ISO/IEC 7810:2003/Amd.1:2009(E) 2 ISO/IEC 2009 All rights reserved9.4 Static electricity 9.4.1 Contact

19、IC cards The card shall not be damaged in normal use by a person charged with static electricity. The performance of the card shall not be degraded by exposure to a static discharge in accordance with the test methods described in ISO/IEC 10373-3 between any contact and ground of a voltage of 2 kV t

20、hrough a resistance of 1 500 ohm from a capacitor of 100 pF. 9.4.2 Contactless IC cards The card shall continue to operate as intended after testing in accordance with the static electricity test methods described in ISO/IEC 10373-6 and ISO/IEC 10373-7 with a test voltage of 6 kV. NOTE The referenced test methods will eventually be moved to ISO/IEC 10373-1. 9.5 Operating temperature The card shall operate as intended over an ambient temperature range of 0 C to 50 C. ISO/IEC 7810:2003/Amd.1:2009(E) ICS 35.240.15 Price based on 2 pages ISO/IEC 2009 All rights reserved