IEC 62137-1-5-2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5 Mechanical shear fatigue te.pdf

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1、 IEC 62137-1-5 Edition 1.0 2009-02 INTERNATIONAL STANDARD NORME INTERNATIONALE Surface mounting technology Environmental and endurance test methods for surface mount solder joints Part 1-5: Mechanical shear fatigue test Technologie du montage en surface Mthodes dessais denvironnement et dendurance d

2、es joints brases montes en surface Partie 1-5: Essai de fatigue par cisaillement mcanique IEC 62137-1-5:2009 THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2009 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in a

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16、s donner des commentaires sur cette publication ou si vous avez des questions, visitez le FAQ du Service clients ou contactez-nous: Email: csciec.ch Tl.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC 62137-1-5 Edition 1.0 2009-02 INTERNATIONAL STANDARD NORME INTERNATIONALE Surface mounting technology E

17、nvironmental and endurance test methods for surface mount solder joints Part 1-5: Mechanical shear fatigue test Technologie du montage en surface Mthodes dessais denvironnement et dendurance des joints brases montes en surface Partie 1-5: Essai de fatigue par cisaillement mcanique INTERNATIONAL ELEC

18、TROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE S ICS 31.190 PRICE CODE CODE PRIX ISBN 2-8318-1028-5 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale 2 62137-1-5 IEC:2009 CONTENTS FOREWORD.3 INTRODU

19、CTION.5 1 Scope.6 2 Normative references .7 3 Terms and definitions .8 4 Test equipment and materials.8 4.1 Test equipment for mechanical shear fatigue testing .8 4.2 Test substrate .8 4.3 Solder alloy .9 4.4 Solder paste9 4.5 Reflow soldering equipment 9 5 Mounting 9 6 Test conditions.10 6.1 Pre-tr

20、eatment 10 6.2 Test procedures 10 6.3 Judging criteria10 7 Items to be included in the test report.11 8 Items to be given in the product specification .11 Annex A (normative) Mechanical shear fatigue test equipment.12 Annex B (normative) Mechanical shear fatigue test procedure .15 Annex C (informati

21、ve) Evaluation of mechanical properties of a single solder joint by mechanical shear fatigue test .17 Bibliography21 Figure 1 Image drawing on evaluation area of joint strength.6 Figure 2 Schematic illustrations of thermomechanical and mechanical fatigue for solder joints 7 Figure 3 A typical temper

22、ature profile taken by reflow soldering equipment10 Figure A.1 Sample structures of shear fatigue jig.13 Figure B.1 Example of set-up for electrical resistance measuring.16 Figure C.1 Schematic illustration of the single solder joint for mechanical fatigue testing 18 Figure C.2 Schematic illustratio

23、n of fixing jig for soldering of the single solder joint .18 Figure C.3 Schematic illustration of the shear fatigue jig19 Figure C.4 Relationship between reaction forces and the number of cycles during a fatigue test20 Figure C.5 Relationship between the displacement range and fatigue life 20 62137-

24、1-5 IEC:2009 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SURFACE MOUNTING TECHNOLOGY ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINTS Part 1-5: Mechanical shear fatigue test FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for stan

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34、sable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 62137-1-5

35、 has been prepared by IEC technical committee 91: Electronics assembly technology. The text of this standard is based on the following documents: FDIS Report on voting 91/826/FDIS 91/841/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicat

36、ed in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. 4 62137-1-5 IEC:2009 A list of all parts of the IEC 62137 series, under the general title Surface mounting technology Environmental and endurance test methods for surface mount solder joints,

37、can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be

38、reconfirmed, withdrawn, replaced by a revised edition, or amended. 62137-1-5 IEC:2009 5 INTRODUCTION The mechanical properties of lead-free solder joints between leads and lands on a printed wiring board are not the same with tin-lead-containing solder joints, due to their solder compositions. Thus,

39、 it becomes important to test the mechanical properties of solder joints of different alloys. 6 62137-1-5 IEC:2009 SURFACE MOUNTING TECHNOLOGY ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINTS Part 1-5: Mechanical shear fatigue test 1 Scope The test method described in this pa

40、rt of IEC 62137 applies to area array packages, such as BGA. This test method is designed to evaluate the fatigue life of the solder joints between component leads and lands on a substrate as shown in Figure 1. A temperature cyclic approach is generally used to evaluate the reliability of solder joi

41、nts. Another method is to mechanically cycle the solder joints to shorten the testing time rather than to produce the strains by changing temperatures. The methodology is the imposition of shear deformation on the solder joints by mechanical displacement instead of relative displacement generated by

42、 CTE (coefficient of thermal expansion) mismatch, as shown in Figure 2. In place of the temperature cycle test, the mechanical shear fatigue predicts the reliability of the solder joints under repeated temperature change conditions by mechanically cycling the solder joints. In this test method, the

43、evaluation requires first to mount the surface mount component on the substrate by reflow soldering, then cyclic mechanical shear deformation is applied to the solder joints until fracture of the solder joints occurs. The properties of the solder joints (for example solder alloy, substrate, mounted

44、device or design, etc.) are evaluated to assist in improving the strength of the solder joints. NOTE This test, however, does not measure the strength of the electronic components. The test method to evaluate the robustness of the joint to a board is described in IEC 60068-2-21. Component Enlarge Ev

45、aluation area Plated layers Substrate land Intermetallic compound layers Solder Substrate Component land Substrate IEC 232/09 Figure 1 Image drawing on evaluation area of joint strength 62137-1-5 IEC:2009 7 Solder Thermomechanical fatigue Package Solder Mechanical fatigue Package Mechanical loading

46、Mechanical loading d/2 d/2 L + d d = L ( substrate package ) T d/2 d/2 L + d L L IEC 233/09 IEC 234/09 Key d Relative displacement T Temperature range Coefficient of thermal expansion Figure 2 Schematic illustrations of thermomechanical and mechanical fatigue for solder joints 2 Normative references

47、 The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60068-1, Environmental testing Part 1: Gener

48、al and guidance IEC 61188-5 (all parts), Printed boards and printed board assemblies Design and use IEC 60194, Printed board design, manufacture and assembly Terms and definitions IEC 61190-1-2:2007, Attachment materials for electronic assembly Part 1-2: Requirements for soldering pastes for high-qu

49、ality interconnects in electronics assembly IEC 61190-1-3, Attachment materials for electronic assembly Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications IEC 61249-2-7:2002, Materials for printed boards and other interconnecting structures Part 2-7: Reinforced base m