IEC 61191-1-2013 Printed board assemblies - Part 1 Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount an.pdf

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1、 IEC 61191-1 Edition 2.0 2013-05 INTERNATIONAL STANDARD NORME INTERNATIONALE Printed board assemblies Part 1: Generic specification Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies Ensembles de cartes imprimes Partie 1: Spcification

2、 gnrique Exigences relatives aux ensembles lectriques et lectroniques brass utilisant les techniques de montage en surface et associes IEC 61191-1:2013 THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2013 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this pub

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16、des commentaires sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 61191-1 Edition 2.0 2013-05 INTERNATIONAL STANDARD NORME INTERNATIONALE Printed board assemblies Part 1: Generic specification Requirements for soldered electrical and electronic assemblies using surf

17、ace mount and related assembly technologies Ensembles de cartes imprimes Partie 1: Spcification gnrique Exigences relatives aux ensembles lectriques et lectroniques brass utilisant les techniques de montage en surface et associes INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE

18、INTERNATIONALE X ICS 31.190; 31.240 PRICE CODE CODE PRIX ISBN 978-2-83220-810-6 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. At

19、tention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. 2 61191-1 IEC:2013 CONTENTS FOREWORD . 6 1 Scope . 8 2 Normative references . 8 3 Terms and definitions . 9 4 General requirements . 10 4.1 Order of precedence 10 4.1.1 General remark . 10 4.1.2 Conflict 1

20、0 4.1.3 Conformance documentation . 10 4.2 Interpretation of requirements . 10 4.3 Classification . 11 4.4 Defects and process indicators 11 4.5 Process control requirements 11 4.6 Requirements flowdown 11 4.7 Physical designs . 12 4.7.1 Design requirements 12 4.7.2 New designs 12 4.7.3 Existing des

21、igns 12 4.8 Visual aids 12 4.9 Proficiency of personnel 12 4.9.1 Design proficiency . 12 4.9.2 Manufacturing proficiency 12 4.10 Electrostatic discharge (ESD) 12 4.11 Facilities 13 4.11.1 General . 13 4.11.2 Environmental controls 13 4.11.3 Temperature and humidity . 13 4.11.4 Lighting . 13 4.11.5 F

22、ield conditions . 13 4.11.6 Clean rooms 13 4.12 Assembly tools and equipment 13 4.12.1 General . 13 4.12.2 Process control 14 5 Materials requirements . 14 5.1 Overview . 14 5.2 Solder . 14 5.3 Flux . 14 5.4 Solder paste 15 5.5 Preform solder . 15 5.6 Adhesives . 15 5.7 Cleaning agents 15 5.7.1 Gene

23、ral . 15 5.7.2 Cleaning agents selection 15 5.8 Polymeric coatings 15 5.8.1 General . 15 61191-1 IEC:2013 3 5.8.2 Solder resists and localized maskants . 15 5.8.3 Conformal coating and encapsulants . 15 5.8.4 Spacers (permanent and temporary) 16 5.9 Chemical strippers. 16 5.10 Heat shrinkable solder

24、ing devices . 16 6 Components and printed board requirements . 16 6.1 General . 16 6.2 Solderability 16 6.2.1 Parts solderability 16 6.2.2 Reconditioning . 16 6.2.3 Solderability testing of ceramic boards 16 6.3 Solderability maintenance . 17 6.3.1 General . 17 6.3.2 Preconditioning 17 6.3.3 Gold em

25、brittlement of solder joints 17 6.3.4 Tinning of non-solderable parts . 17 6.4 Solder purity maintenance . 18 6.5 Lead preparation . 18 6.5.1 General . 18 6.5.2 Lead forming . 19 6.5.3 Lead forming limits 19 7 Assembly process requirements . 19 7.1 Overview . 19 7.2 Cleanliness . 19 7.3 Part marking

26、s and reference designations . 19 7.4 Solder connection contours . 19 7.5 Moisture traps . 19 7.6 Thermal dissipation . 20 8 Assembly soldering requirements . 20 8.1 General . 20 8.2 General . 20 8.2.1 Soldering process 20 8.2.2 Machine maintenance 20 8.2.3 Handling of parts . 20 8.2.4 Preheating .

27、20 8.2.5 Carriers . 20 8.2.6 Hold down of surface mount leads . 20 8.2.7 Heat application. 21 8.2.8 Cooling 21 8.3 Reflow soldering 21 8.3.1 Requirements 21 8.3.2 Process development for reflow soldering 21 8.3.3 Flux application . 21 8.3.4 Solder application 21 8.4 Mechanized immersion soldering (n

28、on-reflow) . 22 8.4.1 General . 22 8.4.2 Process development for mechanized immersion soldering . 22 8.4.3 Drying/degassing . 23 8.4.4 Holding fixtures and materials . 23 4 61191-1 IEC:2013 8.4.5 Flux application . 23 8.4.6 Solder bath 23 8.5 Manual/hand soldering 23 8.5.1 Requirements 23 8.5.2 Non-

29、reflow manual soldering . 24 8.5.3 Reflow manual soldering 24 9 Cleanliness requirements . 25 9.1 General . 25 9.2 Equipment and material compatibility 25 9.3 Pre-soldering cleaning . 25 9.4 Post-soldering cleaning . 25 9.4.1 General . 25 9.4.2 Ultrasonic cleaning 25 9.5 Cleanliness verification 26

30、9.5.1 General . 26 9.5.2 Visual inspection . 26 9.5.3 Testing 26 9.6 Cleanliness criteria 26 9.6.1 General . 26 9.6.2 Particulate matter 26 9.6.3 Flux residues and other ionic or organic contaminants . 26 9.6.4 Cleaning option . 27 9.6.5 Test for cleanliness . 27 9.6.6 Rosin residues on cleaned boar

31、d assemblies 27 9.6.7 Ionic residues (instrument method) 28 9.6.8 Ionic residues (manual method) . 28 9.6.9 Surface insulation resistance (SIR) 28 9.6.10 Other contamination 28 10 Assembly requirements 28 10.1 General . 28 10.2 Acceptance requirements 28 10.2.1 Process control 28 10.2.2 Corrective a

32、ction limits 29 10.2.3 Control limit determination . 29 10.3 General assembly requirements 29 10.3.1 Assembly integrity . 29 10.3.2 Assembly damage . 29 10.3.3 Markings 30 10.3.4 Flatness (bow and twist) 30 10.3.5 Solder connection 30 10.3.6 Interfacial connections . 31 11 Coating and encapsulation

33、. 31 11.1 Detail requirements . 31 11.2 Conformal coating . 32 11.2.1 Coating instructions . 32 11.2.2 Application 32 11.2.3 Performance requirements. 33 11.2.4 Rework of conformal coating . 34 11.2.5 Conformal coating inspection . 34 61191-1 IEC:2013 5 11.3 Encapsulation 34 11.3.1 Encapsulation ins

34、tructions . 34 11.3.2 Application 34 11.3.3 Performance requirements. 34 11.3.4 Rework of encapsulant material . 34 11.3.5 Encapsulant inspection 34 12 Rework and repair 35 12.1 General . 35 12.2 Rework of unsatisfactory soldered electrical and electronic assemblies . 35 12.3 Repair . 36 12.4 Post r

35、ework/repair cleaning . 36 13 Product quality assurance 37 13.1 System requirements . 37 13.2 Inspection methodology . 37 13.2.1 Verification inspection . 37 13.2.2 Visual inspection . 37 13.2.3 Sampling inspection 38 13.3 Process control . 38 13.3.1 System details . 38 13.3.2 Defect reduction 38 13

36、.3.3 Variance reduction. 39 14 Other requirements . 39 14.1 Health and safety 39 14.2 Special manufacturing requirements 39 14.2.1 Manufacture of devices incorporating magnetic windings . 39 14.2.2 High-frequency applications . 39 14.2.3 High-voltage or high-power applications 39 14.3 Guidance on re

37、quirement flowdown . 39 15 Ordering data . 39 Annex A (normative) Requirements for soldering tools and equipment . 41 Annex B (normative) Qualification of fluxes 43 Annex C (normative) Quality assessment . 44 Bibliography 46 Figure 1 Solder contact angle 30 Figure 2 Solder wetting of plated through-

38、holes without leads 31 Figure 3 Coating conditions . 33 Table 1 Solder contamination limits; maximum contaminant limit (percentage by weight) 18 Table 2 Electrical and electronic assembly defects 36 Table 3 Magnification requirements . 37 6 61191-1 IEC:2013 INTERNATIONAL ELECTROTECHNICAL COMMISSION

39、_ PRINTED BOARD ASSEMBLIES Part 1: Generic specification Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all

40、 national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Tec

41、hnical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory wo

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46、cation shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by indepen

47、dent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any pe

48、rsonal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative r

49、eferences cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61191-1 has been prepared by IEC technical committee 91: Elec