IEC 61188-1-1-1997 Printed boards and printed board assemblies - Design and use - Part 1-1 Generic requirements - Flatness considerations for electronic assembl.pdf

《IEC 61188-1-1-1997 Printed boards and printed board assemblies - Design and use - Part 1-1 Generic requirements - Flatness considerations for electronic assembl.pdf》由会员分享，可在线阅读，更多相关《IEC 61188-1-1-1997 Printed boards and printed board assemblies - Design and use - Part 1-1 Generic requirements - Flatness considerations for electronic assembl.pdf（36页珍藏版）》请在麦多课文档分享上搜索。

1、NORME INTERNATIONALE CEI IEC INTERNATIONAL STANDARD 6118811 Premiredition Firstedition 199708 Cartesimprimesetcartesimprimesquipes Conceptionetutilisation Partie11: Prescriptionsgnriques Considrationsconcernantlaplanit densembleslectroniques Printedboardsandprintedboardassemblies Designanduse Part11

2、: Genericrequirements Flatnessconsiderationsforelectronicassemblies Numroderfrence Referencenumber CEI/IEC6118811:1997Numrosdespublications LespublicationsdelaCEIsontnumrotespartirde 60000dsle1erjanvier1997. Publicationsconsolides Lesversionsconsolidesdecertainespublicationsde laCEIincorporantamende

3、mentssontdisponibles.Par exemple,lesnumrosddition1.0,1.1et1.2 indiquentrespectivementlapublicationdebase,la publicationdebaseincorporantlamendement1,etla publicationdebaseincorporantlesamendements1 et2. Validitdelaprsentepublication LecontenutechniquedespublicationsdelaCEIest constammentrevuparlaCEI

4、afinquilreflteltat actueldelatechnique. Desrenseignementsrelatifsladatede reconfirmationdelapublicationsontdisponiblesdans leCataloguedelaCEI. Lesrenseignementsrelatifscesrvisions,ltablis sementdesditionsrvisesetauxamendements peuventtreobtenusauprsdesComitsnationauxde laCEIetdanslesdocumentscidesso

5、us: BulletindelaCEI AnnuairedelaCEI Accsenligne* CataloguedespublicationsdelaCEI Publiannuellementetmisjourrgulirement (Accsenligne)* Terminologie,symbolesgraphiques etlittraux Encequiconcernelaterminologiegnrale,lelecteur sereporteralaCEI60050: VocabulaireElectro techniqueInternational (VEI). Pourl

6、essymbolesgraphiques,lessymboleslittraux etlessignesdusagegnralapprouvsparlaCEI,le lecteurconsulteralaCEI60027: Symboleslittraux utiliserenlectrotechnique,laCEI60417:Symboles graphiquesutilisablessurlematriel.Index,relevet compilationdesfeuillesindividuelles, etlaCEI60617: Symbolesgraphiquespourschm

7、as. PublicationsdelaCEItabliespar lemmecomitdtudes Lattentiondulecteurestattiresurleslistesfigurant lafindecettepublication,quinumrentles publicationsdelaCEIprparesparlecomit dtudesquiatablilaprsentepublication. * Voiradressesitewebsurlapagedetitre. Numbering Asfromthe1stJanuary1997allIECpublication

8、sare issuedwithadesignationinthe60000series. Consolidatedpublications ConsolidatedversionsofsomeIECpublications includingamendmentsareavailable.Forexample, editionnumbers1.0,1.1and1.2refer,respectively,to thebasepublication,thebasepublication incorporatingamendment1andthebasepublication incorporatin

9、gamendments1and2. Validityofthispublication ThetechnicalcontentofIECpublicationsiskeptunder constantreviewbytheIEC,thusensuringthatthe contentreflectscurrenttechnology. Informationrelatingtothedateofthereconfirmationof thepublicationisavailableintheIECcatalogue. Informationontherevisionwork,theissue

10、ofrevised editionsandamendmentsmaybeobtainedfrom IEC NationalCommitteesandfromthefollowing IECsources: IECBulletin IECYearbook Onlineaccess* CatalogueofIECpublications Publishedyearlywithregularupdates (Onlineaccess)* Terminology,graphicalandletter symbols Forgeneralterminology,readersarereferredto

11、IEC60050:InternationalElectrotechnicalVocabulary (IEV). Forgraphicalsymbols,andlettersymbolsandsigns approvedbytheIECforgeneraluse,readersare referredtopublicationsIEC60027: Lettersymbolsto beusedinelectricaltechnology ,IEC60417: Graphical symbolsforuseonequipment.Index,surveyand compilationofthesin

12、glesheets andIEC60617: Graphicalsymbolsfordiagrams. IECpublicationspreparedbythesame technicalcommittee Theattentionofreadersisdrawntotheendpagesof thispublicationwhichlisttheIECpublicationsissued bythetechnicalcommitteewhichhaspreparedthe presentpublication. * Seewebsiteaddressontitlepage.NORME INT

13、ERNATIONALE CEI IEC INTERNATIONAL STANDARD 6118811 Premiredition Firstedition 199708 Cartesimprimesetcartesimprimesquipes Conceptionetutilisation Partie11: Prescriptionsgnriques Considrationsconcernantlaplanit densembleslectroniques Printedboardsandprintedboardassemblies Designanduse Part11: Generic

14、requirements Flatnessconsiderationsforelectronicassemblies CommissionElectrotechniqueInternationale InternationalElectrotechnicalCommission Pourprix,voircatalogueenvigueur Forprice,seecurrentcatalogue IEC1997Droitsdereproductionrservs Copyrightallrightsreserved Aucunepartiedecettepublicationnepeuttr

15、ereproduiteni utilisesous quelqueformequecesoitetparaucun procd,lectroniqueoumcanique,ycomprislaphoto copieetlesmicrofilms,sanslaccordcritdelditeur. Nopartofthispublicationmaybereproducedorut ilizedin anyformorbyanymeans,electronicormechanical, includingphotocopyingandmicrofilm,withoutpermissionin w

16、ritingfromthepublisher. InternationalElectrotechnicalCommission 3,ruedeVarembGeneva,Switzerland Telefax:+41229190300 email:inmailiec.ch IECwebsitehttp:/www.iec.ch CODEPRIX PRICECODE L2 6118811CEI:1997 SOMMAIRE Pages AVANTPROPOS. . 4 INTRODUCTION. 6 Articles 1Domaine dapplication 8 2Rfrence normative

17、 8 3 Prescriptionsdebase . 8 3.1Conception. 8 3.2 Fabricationdecartesrigides 8 3.3Assemblage. 10 3.4Utilisation 10 4 DfautsdeplanitMatriaudebasecuivrrigide 10 4.1Causes. 10 4.2 Prventionetcorrection . 12 4.3 Mthodesdessaietprescriptions 12 5 DfautsdeplanitCartesimprimesrigidesnonquipes 12 5.1Causes.

18、 12 5.2 Prvention 16 5.3Rectification 16 5.4 Prescriptionsrelativeslaplanit 16 5.5 Mthodesdemesure . 18 6 DfautsdeplanitCartesimprimesquipesrigides. 18 6.1Causes. 18 6.2Prvention 20 6.3Correction. 20 7 Problmeslisauplacementdescomposantsmontsensurface. 20 7.1 Placementdescomposants(assemblage) 20 7.

19、2 Prescriptionsconcernantlesmachinesdeplacement. 20 8 Dfautsdeplanitenservice . 22 9 Rsumdesmesuresprventives. 22 10 Rsumdesactionscorrectives 226118811IEC:1997 3 CONTENTS Page FOREWORD . 5 INTRODUCTION. 7 Clause 1Scope . 9 2Normative reference . 9 3Basic requirements. 9 3.1Design 9 3.2 Rigidboardma

20、nufacture 9 3.3Assembly 11 3.4Use. 11 4 DeviationsfromflatnessRigidcoppercladbasematerial 11 4.1Causes. 11 4.2 Preventionandcorrection 13 4.3 Testmethodsandrequirements 13 5 DeviationsfromflatnessUnassembledrigidprintedboards. 13 5.1Causes. 13 5.2Prevention 17 5.3Rectification 17 5.4 Requirementsfor

21、flatness 17 5.5Measurement methods 19 6 DeviationsfromflatnessRigidprintedboardassemblies . 19 6.1Causes. 19 6.2Prevention 21 6.3Correction. 21 7 Problemsassociatedwithplacementofsurfacemountedcomponents 21 7.1 Placementofcomponents(assembly). 21 7.2 Requirementsfor“pickandplace“machines 21 8 Deviat

22、ionsfromflatnessinservice .2 3 9Prevention summary. . 23 10 Correctiveactionsummary. 234 6118811CEI:1997 COMMISSIONLECTROTECHNIQUEINTERNATIONALE _ CARTESIMPRIMESETCARTESIMPRIMESQUIPES CONCEPTIONETUTILISATION Partie11:Prescriptionsgnriques Considrationsconcernantlaplanitdensembleslectroniques AVANTPR

23、OPOS 1) LaCEI(CommissionElectrotechniqueInternationale)estuneorganisationmondialedenormalisationcompose delensembledescomitslectrotechniquesnationaux(ComitsnationauxdelaCEI).LaCEIapourobjetde favoriserlacooprationinternationalepourtouteslesquestionsdenormalisationdanslesdomainesde llectricitetdellec

24、tronique.Aceteffet,laCEI,entreautresactivits,publiedesNormesinternationales. Leurlaborationestconfiedescomitsdtudes,auxtravauxdesquelstoutComitnationalintressparle sujettraitpeutparticiper.Lesorganisationsinternationales,gouvernementalesetnongouvernementales,en liaisonaveclaCEI,participentgalementau

25、xtravaux.LaCEIcollaboretroitementaveclOrganisation InternationaledeNormalisation(ISO),selondesconditionsfixesparaccordentrelesdeuxorganisations. 2) LesdcisionsouaccordsofficielsdelaCEIconcernantlesquestionstechniquesreprsentent,danslamesure dupossibleunaccordinternationalsurlessujetstudis,tantdonnqu

26、elesComitsnationauxintresss sontreprsentsdanschaquecomitdtudes. 3) Lesdocumentsproduitsseprsententsouslaformederecommandationsinternationales.Ilssontpublis commenormes,rapportstechniquesouguidesetagrscommetelsparlesComitsnationaux. 4) Danslebutdencouragerlunificationinternationale,lesComitsnationaux

27、delaCEIsengagentappliquerde faontransparente,danstoutelamesurepossible,lesNormesinternationalesdelaCEIdansleursnormes nationalesetrgionales.ToutedivergenceentrelanormedelaCEIetlanormenationaleourgionale correspondantedoittreindiqueentermesclairsdanscettedernire. 5) LaCEInafixaucuneprocdureconcernant

28、lemarquagecommeindicationdapprobationetsaresponsabilit nestpasengagequandunmatrielestdclarconformelunedesesnormes. 6) LattentionestattiresurlefaitquecertainsdeslmentsdelaprsenteNormeinternationalepeuventfaire lobjetdedroitsdepropritintellectuelleoudedroitsanalogues.LaCEInesauraittretenuepour respons

29、abledenepasavoiridentifidetelsdroitsdepropritetdenepasavoirsignalleurexistence. LaNormeinternationaleCEI6118811attablieparlecomitdtudes52delaCEI: Circuitsimprims. Letextedecettenormeestissudesdocumentssuivants: FDIS Rapportdevote 52/721/FDIS 52/738/RVD Lerapportdevoteindiqudansletableaucidessusdonne

30、touteinformationsurlevoteayant aboutilapprobationdecettenorme.6118811IEC:1997 5 INTERNATIONALELECTROTECHNICALCOMMISSION _ PRINTEDBOARDSANDPRINTEDBOARDASSEMBLIES DESIGNANDUSE Part11:Genericrequirements Flatnessconsiderationsforelectronicassemblies FOREWORD 1) TheIEC(InternationalElectrotechnicalCommi

31、ssion)isaworldwideorganizationforstandardizationcomprising allnationalelectrotechnicalcommittees(IECNationalCommittees).TheobjectoftheIECistopromote internationalcooperationonallquestionsconcerningstandardizationintheelectricalandelectronicfields.To thisendandinadditiontootheractivities,theIECpublis

32、hesInternationalStandards.Theirpreparationis entrustedtotechnicalcommittees;anyIECNationalCommitteeinterestedinthesubjectdealtwithmay participateinthispreparatorywork.International,governmentalandnongovernmentalorganizationsliaising withtheIECalsoparticipateinthispreparation.TheIECcollaboratesclosel

33、ywiththeInternationalOrganization forStandardization(ISO)inaccordancewithconditionsdeterminedbyagreementbetweenthetwo organizations. 2) TheformaldecisionsoragreementsoftheIEContechnicalmattersexpress,asnearlyaspossible,an internationalconsensusofopinionontherelevantsubjectssinceeachtechnicalcommitte

34、ehasrepresentation fromallinterestedNationalCommittees. 3) Thedocumentsproducedhavetheformofrecommendationsforinternationaluseandarepublishedintheform ofstandards,technicalreportsorguidesandtheyareacceptedbytheNationalCommitteesinthatsense. 4) Inordertopromoteinternationalunification,IECNationalComm

35、itteesundertaketoapplyIECInternational Standardstransparentlytothemaximumextentpossibleintheirnationalandregionalstandards.Any divergencebetweentheIECStandardandthecorrespondingnationalorregionalstandardshallbeclearly indicatedinthelatter. 5) TheIECprovidesnomarkingproceduretoindicateitsapprovalandc

36、annotberenderedresponsibleforany equipmentdeclaredtobeinconformitywithoneofitsstandards. 6) AttentionisdrawntothepossibilitythatsomeoftheelementsofthisInternationalStandardmaybethesubject ofpatentrights.TheIECshallnotbeheldresponsibleforidentifyinganyorallsuchpatentrights. InternationalStandardIEC61

37、18811hasbeenpreparedbyIECtechnicalcommittee52: Printedcircuits. Thetextofthisstandardisbasedonthefollowingdocuments: FDIS Reportonvoting 52/721/FDIS 52/738/RVD Fullinformationonthevotingfortheapprovalofthisstandardcanbefoundinthereporton votingindicatedintheabovetable.6 6118811CEI:1997 INTRODUCTION

38、Lestechniquesrelativesauxcartesimprimesrigidesexigentundegrlevdeplanitau niveaudessubstratsetdesensemblesor,ilexisteplusieurscausespossiblesdedistorsion. Touteslespersonnesimpliques,unstadequelconque,danslaconception,lafabricationet lutilisationdoiventtreconscientesdesproblmespotentielsetdoiventlesc

39、omprendre.Ilest primordialquellesportentuneattentionparticulireauxfacteursquellesmatrisent. LetableaucidessousfaitrfrenceauxtroismthodesdessaiindiquesdanslaCEI611892. Listedecontrledesmthodesdessaisdecourbure etdevrillagepourmatriaux Paramtre Condition CEI611892 Essain Courbure Courbure Vrillage Vri

40、llage Tellequrception Aprstraitement Tellequrception Aprstraitement 2M01 2M02 2M01 2M046118811IEC:1997 7 INTRODUCTION Rigidprintedboardtechnologydemandsahighdegreeofflatnessinsubstratesand assembliesanddistortionmayresultfromanumberofcauses.Allindividualsinvolvedatany stageofdesign,manufactureanduse

41、shallbeawareofandunderstandthepotential problems.Itisessentialthattheypayspecificattentiontothosefactorsundertheircontrol. ThefollowingtableshowsthereferencestothethreetestmethodsgiveninIEC611892. Bowandtwisttestmethodchecklistformaterials Parameter Condition IEC611892 TestNo. Bow Bow Twist Twist As

42、received Afterprocessing Asreceived Afterprocessing 2M01 2M02 2M01 2M048 6118811CEI:1997 CARTESIMPRIMESETCARTESIMPRIMESQUIPES CONCEPTIONETUTILISATION Partie11:Prescriptionsgnriques Considrationsconcernantlaplanitdensembleslectroniques 1 Domainedapplication LaprsentepartiedelaCEI61188dcritlesfacteursdterminantlaplanitdecartes imprimesrigidesetdeleursensembles.Lobjectifdelaprsentenormeconsisteinformerle concepteur,lefabricant,lassembleuretlutilisateurdecar