IEC 61182-2-2-2012 Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2 Sectional requirements for implementatio.pdf

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1、 IEC 61182-2-2 Edition 1.0 2012-04 INTERNATIONAL STANDARD NORME INTERNATIONALE Printed board assembly products Manufacturing description data and transfer methodology Part 2-2: Sectional requirements for implementation of printed board fabrication data description Produits pour cartes imprimes quipe

2、s Donnes descriptives de fabrication et mthodologie de transfert Partie 2-2: Exigences intermdiaires pour la mise en uvre de cartes imprimes Description des donnes de fabrication IEC61182-2-2:2012 colourinsideTHIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2012 IEC, Geneva, Switzerland All rights

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16、Clients - webstore.iec.ch/csc Si vous dsirez nous donner des commentaires sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 61182-2-2 Edition 1.0 2012-04 INTERNATIONAL STANDARD NORME INTERNATIONALE Printed board assembly products Manufacturing description data and tr

17、ansfer methodology Part 2-2: Sectional requirements for implementation of printed board fabrication data description Produits pour cartes imprimes quipes Donnes descriptives de fabrication et mthodologie de transfert Partie 2-2: Exigences intermdiaires pour la mise en uvre de cartes imprimes Descrip

18、tion des donnes de fabrication INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE X ICS 31.180 PRICE CODE CODE PRIX ISBN 978-2-88912-058-1 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internatio

19、nale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. colourinside 2 61182-2-2 IEC:2012 CONTENTS FOREWORD . 4 1 Scope . 6 2 Normative references . 6 3 Terms and defin

20、itions . 6 4 General principles 7 4.1 Requirements 7 4.2 Interpretation . 7 4.3 Categories and content . 8 5 General rules 9 5.1 Overview . 9 5.2 File content descriptions 10 5.3 Logistic descriptions 10 5.4 File history descriptions . 10 5.4.1 General . 10 5.4.2 HistoryRecord use case Initial desig

21、n release . 11 5.4.3 Supply chain modifications 12 5.4.4 OEM reviews modifications HistoryRecord update 14 5.5 BOM (board fabrication materials) . 14 5.6 AVL (board material suppliers) 16 5.7 Documentation layers 16 5.7.1 General . 16 5.7.2 Documentation layer restrictions 16 5.7.3 Reference to docu

22、mentation 17 5.7.4 Step usage 18 5.7.5 Set 19 5.8 Design for excellence (Dfx) analysis 19 5.8.1 General . 19 5.8.2 DfxMeasurement . 19 5.9 Miscellaneous image layers . 19 5.9.1 General . 19 5.9.2 Step usage 20 5.10 Packages and land patterns 20 5.10.1 General . 20 5.10.2 Step usage for component pac

23、kages and land patterns . 20 5.10.3 Land pattern details . 21 5.11 Solder mask and legend layers 21 5.11.1 General . 21 5.11.2 Solder mask details . 21 5.11.3 Legend details . 21 5.11.4 Step usage for solder mask and legend layers . 22 5.12 Drilling and routing (tooling) layers 22 5.12.1 General . 2

24、2 5.12.2 Drilling details 22 5.12.3 Routing details 22 5.12.4 Step usage for drilling and routing . 23 5.13 Net list. 23 61182-2-2 IEC:2012 3 5.13.1 General . 23 5.13.2 Step usage for net list 24 5.14 Outer conductive layers . 24 5.14.1 General . 24 5.14.2 Outer conductive layer details . 24 5.14.3

25、Step usage for outer conductive layers 24 5.15 Inner conductive layers . 25 5.15.1 Requirement 25 5.15.2 Inner conductive layer details 25 5.15.3 Step usage for inner conductive layers 25 5.16 Board construction 25 5.16.1 Requirement 25 5.16.2 Board construction details . 26 5.16.3 Step usage for bo

26、ard construction . 26 6 Modeling 26 6.1 General . 26 6.2 Information models 27 7 Report generators 28 7.1 IEC 61182-2-2 format 28 7.2 Hole usage report 29 7.3 Pad usage report . 29 7.4 Conductor usage report . 29 8 Glossary . 29 Annex A (normative) Printed board fabrication schema 30 Bibliography 42

27、 Figure 1 Board fabrication data relationship . 9 Figure 2 HistoryRecord use case . 11 Figure 3 Documentation package grade requirements 18 Figure 4 Fabrication steps data model example . 27 Figure 5 IPC-2584 UML data model . 28 Table 1 Function relationship of an IEC 61182-2-2 fabrication file 8 Ta

28、ble 2 Bom restrictions 15 Table 3 Recommended reference designators for printed board material . 15 Table 4 Avl restrictions 16 Table 5 Documentation layer restrictions . 17 Table 6 General descriptions of documentation layer functions 17 Table 7 Relationship to documentation standard 18 Table 8 Mis

29、cellaneous layer restrictions . 20 4 61182-2-2 IEC:2012 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY Part 2-2: Sectional requirements for implementation of printed board fabrication data description FOREWORD 1) Th

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40、of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61182-2-2 has been prepared by IEC technical committee 91: Electronics assembly technology. The text of this standa

41、rd is based on the following documents: FDIS Report on voting 91/1025/FDIS 91/1038/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part

42、 2. 61182-2-2 IEC:2012 5 The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, with

43、drawn, replaced by a revised edition, or amended. IMPORTANT The “colour inside” logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this publication using a colour

44、printer. 6 61182-2-2 IEC:2012 PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY Part 2-2: Sectional requirements for implementation of printed board fabrication data description 1 Scope This part of IEC 61182 provides the information on the manufacturing require

45、ments used for fabricating printed boards. This standard determines the XML schema details, defined in the generic standard IEC 61182-2 and some of the sectional standards that are required to accomplish the focused tasks. When other standards are invoked, their requirements become a mandatory part

46、of the fabrication details as defined in the IEC 61182-2. The IEC 61182-2 contains all the requirements necessary to build an electronic product. The cardinality indicated in the IEC 61182-2 may be superseded by a restriction of an attribute (enumerated string ID) or indication of a requirement that

47、 is noted as being optional in the generic standard. However, this standard renders the requirement mandatory based on the supply chain communication need. In order to assist the users of this standard, all the applicable XML schema elements that apply to the board fabrication function are listed in

48、 Annex A. The list is grouped by topics and shows the absolute path for the elements that pertain to the focus of this standard. If the parent element is not present no children are considered in the implementation either. However, all attributes identified for a particular element follow the cardin

49、ality of the IEC 61182-2, unless a restriction is stated in this standard. 2 Normative references The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 6019