IEC 60748-23-5-2003 Semiconductor devices - Integrated circuits - Part 23-5 Hybrid integrated circuits and film structures Manufacturing line certification Proc.pdf
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1、INTERNATIONAL STANDARD IEC 60748-23-5 QC 165000-5 First edition 2003-10 Semiconductor devices Integrated circuits Part 23-5: Hybrid integrated circuits and film structures Manufacturing line certification Procedure for qualification approval Dispositifs semiconducteurs Circuits intgrs Partie 23-5: C
2、ircuits intgrs hybrides et structures par films Certification de la ligne de fabrication Procdure dhomologation Reference number IEC 60748-23-5:2003(E)Publication numbering As from 1 January 1997 all IEC publications are issued with a designation in the 60000 series. For example, IEC 34-1 is now ref
3、erred to as IEC 60034-1. Consolidated editions The IEC is now publishing consolidated versions of its publications. For example, edition numbers 1.0, 1.1 and 1.2 refer, respectively, to the base publication, the base publication incorporating amendment 1 and the base publication incorporating amendm
4、ents 1 and 2. Further information on IEC publications The technical content of IEC publications is kept under constant review by the IEC, thus ensuring that the content reflects current technology. Information relating to this publication, including its validity, is available in the IEC Catalogue of
5、 publications (see below) in addition to new editions, amendments and corrigenda. Information on the subjects under consideration and work in progress undertaken by the technical committee which has prepared this publication, as well as the list of publications issued, is also available from the fol
6、lowing: IEC Web Site (www.iec.ch) Catalogue of IEC publications The on-line catalogue on the IEC web site (www.iec.ch/searchpub) enables you to search by a variety of criteria including text searches, technical committees and date of publication. On-line information is also available on recently iss
7、ued publications, withdrawn and replaced publications, as well as corrigenda. IEC Just Published This summary of recently issued publications (www.iec.ch/online_news/ justpub) is also available by email. Please contact the Customer Service Centre (see below) for further information. Customer Service
8、 Centre If you have any questions regarding this publication or need further assistance, please contact the Customer Service Centre: Email: custserviec.ch Tel: +41 22 919 02 11 Fax: +41 22 919 03 00 INTERNATIONAL STANDARD IEC 60748-23-5 QC 165000-5 First edition 2003-10 Semiconductor devices Integra
9、ted circuits Part 23-5: Hybrid integrated circuits and film structures Manufacturing line certification Procedure for qualification approval Dispositifs semiconducteurs Circuits intgrs Partie 23-5: Circuits intgrs hybrides et structures par films Certification de la ligne de fabrication Procdure dho
10、mologation IEC 2003 Copyright - all rights reserved No part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from the publisher. International Electrotechnical Commission, 3, r
11、ue de Varemb, PO Box 131, CH-1211 Geneva 20, Switzerland Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmailiec.ch Web: www.iec.ch V For price, see current catalogue PRICE CODE Commission Electrotechnique Internationale International Electrotechnical Commission 2 60748-23-5 IEC:2003
12、(E) CONTENTS FOREWORD 3 1 Scope 5 2 Normative references. 5 3 Terms and definitions. 5 4 Qualification approval procedures 5 4.1 General 5 4.2 Marking 5 4.3 Validity of release for delivery 6 4.4 Application for qualification approval . 6 4.5 Structural similarity . 6 4.6 Materials, piece-parts and
13、added components. 6 4.7 Initial qualification approval. 6 4.8 Granting of qualification approval 7 4.9 Maintenance of qualification approval 7 4.10 Procedure in the event of a failure in a periodic test 8 4.11 Withdrawal of qualification approval 8 5 Qualification-product assessment level schedules
14、9 6 Blank detail specification.28 6.1 General .28 6.2 FRONT PAGE FOR COMPONENTS ASSESSED BY QUALIFICATION APPROVAL29 6.3 GENERAL DATA30 6.4 Inspection requirements.3160748-23-5 IEC:2003(E) 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES INTEGRATED CIRCUITS Part 23-5: Hybrid integ
15、rated circuits and film structures Manufacturing line certification Procedure for qualification approval FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The
16、object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specific
17、ations (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental organizations l
18、iaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters exp
19、ress, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Commi
20、ttees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC Nation
21、al Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC provides no m
22、arking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, serv
23、ants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publicati
24、on, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility
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