IEC 60748-22-1997 Semiconductor devices - Integrated circuits - Part 22 Sectional specification for film integrated circuits and hybrid film integrated circuits.pdf

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1、- STDmIEC b07LI8-22-ENGL 1777 IPII i8;11187L 061111385 1172 NORME CE1 INTERNATIONALE IEC INTERNATIONAL 60748122 STANDARD QC 760200 Deuxime dition Second edition 1997-04 Dispositifs semiconducteurs - Circuits intgrs - Partie 22: Specification intermdiaire pour les circuits intgrs couches et les circu

2、its integres hybrides couches sur la base des procedures dagrment de savoir-faire Semiconductor devices - Integrated circuits - Part 22: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures Numro de rfrence Refere

3、nce number CEMEC 60748-22: 1997 Validit de la prsente publication Le contenu technique des publications de la CE1 est cons- tamment revu par la CE1 afin quil reflte ltat actuel de la technique. Des renseignements relatifs la date de reconfirmation de la publication sont disponibles auprs du Bureau C

4、entral de la CEI. Les renseignements relatifs ces rvisions, ltablis- sement des ditions rvises et aux amendements peuvent tre obtenus auprs des Comits nationaux de la CE1 et dans les documents ci-dessous: Bulletin de la CE1 0 Annuaire de la CE1 Publi annuellement Catalogue des publications de la CE1

5、 Publi annuellement et mis jour rgulirement Terminologie En ce qui conceme la terminologie gnrale, le lecteur se reportera la CE1 50 Vocabulaire Electrotechnique Inter- national (VEI), qui se prsente sous forme de chapitres spars traitant chacun dun sujet dfini. Des dtails complets sur le VE1 peuven

6、t tre obtenus sur demande. Voir galement le dictionnaire multilingue de la CEI. Les termes et dfinitions figurant dans la prsente publi- cation ont t soit tirs du VEI, soit spcifiquement approuvs aux fins de cette publication. Symboles graphiques et littraux Pour les symboles graphiques, les symbole

7、s littraux et les signes dusage gnral approuvs par la CEI, le lecteur consultera: - la CE1 27: Symboles littraux utiliser en lectrotechnique; - la CE1 417: Symboles graphiques utilisables sur le matriel. Index, relev et compilation des feuilles individuelles; - la CE1 617: Symboles graphiques pour s

8、chmas; et pour les appareils lectromdicaux, - la CE1 878: Symboles graphiques pour quipements lectriques en pratique mdicale. Les symboles et signes contenus dans la prsente publi- cation ont t soit tirs de la CE1 27, de la CE1 417, de la CE1 617 effou de la CE1 878, soit spcifiquement approuvs aux

9、fins de cette publication. Publications de la CE1 tablies par le mme comit dtudes Lattention du lecteur est attire sur les listes figurant la fin de cette publication, qui numrent les publications de la CE1 prpares par le comit dtudes qui a tabli la prsente publication. Validity of this publication

10、The technical content of IEC publications is kept under constant review by the IEC, thus ensuring that the content reflects current technology. Information relating to the date of the reconfirmation of the publication is available from the IEC Central Office. Information on the revision work, the is

11、sue of revised editions and amendments may be obtained from IEC National Committees and from the following IEC sources: IEC Bulletln IEC Yearbook Catalogue of IEC publications Published yearly Published yearly with regular updates Terminology For general terminology, readers are referred to IEC 50:

12、International lectrotechnical Vocabulary (I EV), which is issued in the form of separate chapters each dealing with a specific field. Full details of the IEV will be supplied on request. See also the IEC Multilingual Dictionary. The terms and definitions contained in the present publi- cation have e

13、ither been taken from the IEV or have been specifically approved for the purpose of this publication. Graphical and letter symbols For graphical symbols, and letter symbols and signs approved by the IEC for general use, readers are referred to publications: - IEC 27: Letter symbols to be used in ele

14、ctrical technology; - IEC 417: Graphical symbols for use on equipment. Index, survey and compilation of the single sheets; - I EC 61 7: Graphical symbols for diagrams; and for medical electrical equipment, - equipment in medical practice. IEC 878: Graphical symbols for electromedical The symbols and

15、 signs contained in the present publication have either been taken from IEC 27, IEC 417, IEC 617 and/or IEC 878, or have been specifically approved for the purpose of this publication. IEC publications prepared by the same technical committee The attention of readers is drawn to the end pages of thi

16、s publication which list the IEC publications issued by the technical committee which has prepared the present publication. f I STD-IEC b0748-22-ENLL 1997 4844872 Ob44187 7b5 NORME INTERNATIONALE INTERNATIONAL STANDARD CE1 IEC 60748-22 QC 760200 Deuxime edition Second edition 1997-04 Dispositifs sem

17、iconducteurs - Circuits intgrs - Partie 22: Spcification intermdiaire pour les circuits intgrs couches et les circuits intgrs hybrides couches sur la base des procdures dagrment de savoir-faire Semiconductor devices - Integrated circuits - Part 22: Sectional specification for film integrated circuit

18、s and hybrid film integrated circuits on the basis of the capability approval procedures O IEC 1997 Droits de reproduction rservs - Copyright - all rights resewed Aucune partie de cette publication ne peut any IEC National Committee interested in the subject dealt with may participate in this prepar

19、atory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. The IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two orga

20、nizations. The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested National Committees. The documents produced have the form

21、 of recommendations for international use and are published in the form of standards, technical reports or guides and they are accepted by the National Committees in that sense. In order to promote international unification, IEC National Committees undertake to apply IEC International Standards tran

22、sparently to the maximum extent possible in their national and regional standards. Any divergence between the IEC Standard and the corresponding national or regional standard shall be clearly indicated in the latter. The IEC provides no marking procedure to indicate its approval and cannot be render

23、ed responsible for any equipment declared to be in conformity with one of its standards. Attention is drawn to the possibility that some of the elements of this International Standard may be the subject of patent rights. The IEC shall not be held responsible for identifying any or all such patent ri

24、ghts. International Standard IEC 60748-22 has been prepared by subcommittee 47A: Integrated circuits, of IEC technical committee 47: Semiconductor devices. This second edition cancels and replaces the first edition published in 1992 and constitutes a technical revision. This standard is a sectional

25、specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures. The text of this standard is based on the following documents: Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. The QC number that appears on the front cover of this publication is the specification number in the IEC Quality Assessment System for Electronic Components (IECQ). Annexes A, Band C form an integral part of this standard.