IEC TR 62258-7-2007 Semiconductor die products - Part 7 XML schema for data exchange《半导体压模产品.第7部分 数据交换用可扩展标记语言(XML)计划》.pdf

《IEC TR 62258-7-2007 Semiconductor die products - Part 7 XML schema for data exchange《半导体压模产品.第7部分 数据交换用可扩展标记语言(XML)计划》.pdf》由会员分享，可在线阅读，更多相关《IEC TR 62258-7-2007 Semiconductor die products - Part 7 XML schema for data exchange《半导体压模产品.第7部分 数据交换用可扩展标记语言(XML)计划》.pdf（30页珍藏版）》请在麦多课文档分享上搜索。

1、 IEC/TR 62258-7 Edition 1.0 2007-08 TECHNICAL REPORT Semiconductor die products Part 7: XML schema for data exchange IEC/TR 62258-7:2007(E) THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2007 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may

2、 be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or IECs member National Committee in the country of the requester. If you have any questions about IEC copyright or have an enquiry ab

3、out obtaining additional rights to this publication, please contact the address below or your local IEC member National Committee for further information. IEC Central Office 3, rue de Varemb CH-1211 Geneva 20 Switzerland Email: inmailiec.ch Web: www.iec.ch About the IEC The International Electrotech

4、nical Commission (IEC) is the leading global organization that prepares and publishes International Standards for all electrical, electronic and related technologies. About IEC publications The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you

5、have the latest edition, a corrigenda or an amendment might have been published. Catalogue of IEC publications: www.iec.ch/searchpub The IEC on-line Catalogue enables you to search by a variety of criteria (reference number, text, technical committee,). It also gives information on projects, withdra

6、wn and replaced publications. IEC Just Published: www.iec.ch/online_news/justpub Stay up to date on all new IEC publications. Just Published details twice a month all new publications released. Available on-line and also by email. Electropedia: www.electropedia.org The worlds leading online dictiona

7、ry of electronic and electrical terms containing more than 20 000 terms and definitions in English and French, with equivalent terms in additional languages. Also known as the International Electrotechnical Vocabulary online. Customer Service Centre: www.iec.ch/webstore/custserv If you wish to give

8、us your feedback on this publication or need further assistance, please visit the Customer Service Centre FAQ or contact us: Email: csciec.ch Tel.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC/TR 62258-7 Edition 1.0 2007-08 TECHNICAL REPORT Semiconductor die products Part 7: XML schema for data exchan

9、ge INTERNATIONAL ELECTROTECHNICAL COMMISSION U ICS 31.080.99 PRICE CODE ISBN 2-8318-9289-9 2 TR 62258-7 IEC:2007(E) CONTENTS FOREWORD.3 INTRODUCTION.5 1 Scope.6 2 Normative references6 3 Definitions 6 4 General 7 5 Data exchange .7 Annex A (normative) XML schema8 Annex B (informative) XML example.19

10、 Bibliography26 TR 62258-7 IEC:2007(E) 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DIE PRODUCTS Part 7: XML schema for data exchange FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnica

11、l committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Te

12、chnical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, govern

13、mental and non- governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions o

14、r agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for internationa

15、l use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to

16、promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly i

17、ndicated in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall att

18、ach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fee

19、s) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publicati

20、on. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. The main task of IEC technical committees is to prepare International Standards. Howeve

21、r, a technical committee may propose the publication of a technical report when it has collected data of a different kind from that which is normally published as an International Standard, for example “state of the art“. IEC 62258-7, which is a technical report, has been prepared by IEC technical c

22、ommittee 47: Semiconductor devices. The text of this technical report is based on the following documents: Enquiry draft Report on voting 47/1887/DTR 47/1897/RVC Full information on the voting for the approval of this Technical Report can be found in the report on voting indicated in the above table

23、. 4 TR 62258-7 IEC:2007(E) This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts in the IEC 62258 series, under the general title Semiconductor die products, can be found on the IEC website. Further parts may be added as required. The committee has

24、decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised editi

25、on, or amended. A bilingual version of this publication may be issued at a later date. TR 62258-7 IEC:2007(E) 5 INTRODUCTION This technical report is based on the work carried out in the ESPRIT 4 thFramework project GOODDIE which resulted in the publication of the ES 59008 series of European specifi

26、cations. Organizations that helped prepare this report included the ESPRIT ENCAST and IST ENCASIT projects, the Die Products Consortium, JEITA, JEDEC and ZVEI. 6 TR 62258-7 IEC:2007(E) SEMICONDUCTOR DIE PRODUCTS Part 7: XML schema for data exchange 1 Scope IEC/TR 62258-7, which is a technical report

27、, has been developed to facilitate the production, supply and use of semiconductor die products, including: wafers; singulated bare die; die and wafers with attached connection structures; minimally or partially encapsulated die and wafers. This report contains an XML schema that describes the eleme

28、nts needed for data exchange and that will allow the implementation of the requirements of IEC 62258-1, IEC 62258-5 and IEC 62258-6, as well as providing an exchange structure that is complementary to those defined in IEC 62258-2. It is also complementary to and compatible with the questionnaire in

29、IEC/TR 62258-4. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60050

30、(all parts), International Electrotechnical Vocabulary IEC 62258-1: Semiconductor die products Part 1: Requirements for procurement and use IEC 62258-2: Semiconductor die products Part 2: Exchange data formats IEC/TR 62258-4: Semiconductor die products Part 4: Questionnaire for die users and supplie

31、rs IEC 62258-5: Semiconductor die products Part 5 Requirements for information concerning electrical simulation IEC 62258-6: Semiconductor die products Part 6 Requirements for information concerning thermal simulation 3 Terms and definitions For the purposes of this document, relevant terms, which a

32、re defined in IEC 60050, together with additional terms and acronyms as given in IEC 62258-1, apply. TR 62258-7 IEC:2007(E) 7 4 General The schema given in this technical report complies with Version 1.0 (Third edition) of the Extensible Markup Language (XML) as defined by the World Wide Web Consort

33、ium (W3C). Links to the XML standard are given in the bibliography. To comply with IEC 62258-1, that standard requires that suppliers of die devices shall furnish information that is necessary and sufficient for users of die devices at all stages of design, procurement, manufacture and test of produ

34、cts containing them. The schema in Annex A defines an exchange mechanism for structuring such information using an XML representation and as such is intended as an aid to compliance with the standard. Whilst it is expected that much of the information supplied will be in the public domain and availa

35、ble from such sources as manufacturers data sheets, neither the standard nor the schema places an obligation on a supplier to make information public. Any information that a supplier considers to be proprietary or commercially sensitive may be supplied under the terms of a non-disclosure agreement.

36、5 Data exchange The schema in Annex A implements all the entities as defined by IEC 62258-2 for the DDX format. In addition, it includes additional entities extending the range of that data as follows: expansion of data on organisations (manufacturer, supplier etc.) to include addresses and contacts

37、; sub-division of some entities to make their values clearer. Annex B contains an example of an XML file based on the schema using a fictitious example similar to that employed in IEC 62258-2, and extended to cover additional data requirements. It is possible that software may be available for conve

38、rsion of data produced using the spreadsheet associated with IEC/TR 62258-4 into this format. In any case, a wide range of tools is available commercially for handling and processing XML files. The electronic form of the schema contained in this technical report may be downloaded from the IEC websit

39、e. The copyright conditions applying to the use of the electronic file are those that apply to IEC database standards, which permit the use of such information in electronic form for bona-fide e-commerce but do not permit its sale to third parties or other commercial use. 8 TR 62258-7 IEC:2007(E) An

40、nex A (normative) XML schema In electronic form, for use by the example file shown in Annex B, the file containing this schema is assumed to have the name DDXschema.xsd TR 62258-7 IEC:2007(E) 9 10 TR 62258-7 IEC:2007(E) TR 62258-7 IEC:2007(E) 11 12 TR 62258-7 IEC:2007(E) TR 62258-7 IEC:2007(E) 13 14

41、 TR 62258-7 IEC:2007(E) TR 62258-7 IEC:2007(E) 15 16 TR 62258-7 IEC:2007(E) TR 62258-7 IEC:2007(E) 17 18 TR 62258-7 IEC:2007(E) TR 62258-7 IEC:2007(E) 19 Annex B (informative) XML example Annex B is based on a fictitious example for a quad two-input NAND gate and illustrates many of the features of

42、the schema. 2006-02-13 DDXconvert version 4.0 1.2 GOOD-DIE database Initial issue A bare_die 74ACT00 Mask T Fuzziwuzz Logic Ltd 74ACT00 Quad two-input advanced CMOS NAND gate micrometre top 356 CMOS silicon Al 175 Die, wafer 356 CONN Vcc 1 PADR1 20 TR 62258-7 IEC:2007(E) 28 T_1 1 A1 I T_2 2 B1 I T_3

43、 3 Y1 O T_4 4 A2 I T_5 5 B2 I T_6 6 TR 62258-7 IEC:2007(E) 21 Y2 O T_7 7 GND G T_8 8 Y3 O T_9 9 B3 I T_10 10 A3 I T_11 11 Y4 O T_12 12 22 TR 62258-7 IEC:2007(E) B4 I T_13 13 A4 I T_14 14 VCC V G_1 G_2 G_3 G_4 G_5 TR 62258-7 IEC:2007(E) 23 G_6 G_7 G_8 SP74ACT00.MOD 1997-09-17 pSpice 4.0.1 2G6 24 TR 6

44、2258-7 IEC:2007(E) SP74ACT00.S 1998-11-05 Spectre 4.2.1, 1992 2G6, Level-3 7995FID1.JIF 25Cel Vcc=5V IECQ None No changes planned TR 62258-7 IEC:2007(E) 25 Temperature 25Cel and mobile phone application MIL-HDBK 217E Maximum 150Cel for 2s Six months at 25Cel and 50%RH 26 TR 62258-7 IEC:2007(E) Bibli

45、ography Extensible Markup Language (XML) 1.0 (Third Edition): W3C Recommendation 04 February 2004 is available at http:/www.w3.org/TR/2004/REC-xml-20040204 XSL Transformations (XSLT) Version 1.0: W3C Recommendation 16 November 1999 is available at http:/www.w3.org/TR/1999/REC-xslt-19991116 _ INTERNATIONAL ELECTROTECHNICAL COMMISSION 3, rue de Varemb P.O. Box 131 CH-1211 Geneva 20 Switzerland Tel: + 41 22 919 02 11 Fax: + 41 22 919 03 00 infoiec.ch www.iec.ch