IEC 62047-20-2014 Semiconductor devices - Micro-electromechanical devices - Part 20 Gyroscopes《半导体器件 微型机电装置 第20部分 陀螺仪》.pdf

《IEC 62047-20-2014 Semiconductor devices - Micro-electromechanical devices - Part 20 Gyroscopes《半导体器件 微型机电装置 第20部分 陀螺仪》.pdf》由会员分享，可在线阅读，更多相关《IEC 62047-20-2014 Semiconductor devices - Micro-electromechanical devices - Part 20 Gyroscopes《半导体器件 微型机电装置 第20部分 陀螺仪》.pdf（112页珍藏版）》请在麦多课文档分享上搜索。

1、 IEC 62047-20 Edition 1.0 2014-06 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Micro-electromechanical devices Part 20: Gyroscopes Dispositifs semiconducteurs Dispositifs microlectromcaniques Partie 20: Gyroscopes IEC 62047-20:2014-06(en-fr) colour inside THIS PUBLICATION IS COP

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19、er des commentaires sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 62047-20 Edition 1.0 2014-06 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Micro-electromechanical devices Part 20: Gyroscopes Dispositifs semiconducteurs Dispositifs microlectr

20、omcaniques Partie 20: Gyroscopes INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE XA ICS 31.080.99 PRICE CODE CODE PRIX ISBN 978-2-8322-1667-5 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Inte

21、rnationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. colour inside 2 IEC 62047-20:2014 IEC 2014 CONTENTS FOREWORD . 4 1 Scope 6 2 Normative references 6 3 Term

22、s and definitions 6 4 Essential ratings and characteristics 6 4.1 Categorization of gyro . 6 4.2 Absolute maximum ratings 7 4.3 Normal operating rating 8 4.4 Characteristics 8 5 Measuring methods . 10 5.1 Scale factor 10 5.1.1 Purpose . 10 5.1.2 Measuring circuit (circuit diagram) . 10 5.1.3 Measuri

23、ng principle . 12 5.1.4 Measurement procedures 21 5.1.5 Specified conditions . 23 5.2 Cross axis sensitivity 24 5.2.1 Purpose . 24 5.2.2 Measuring circuit (circuit diagram) . 24 5.2.3 Principle of measurement 25 5.2.4 Precautions to be observed during the measurements of the angular rate applied . 2

24、7 5.2.5 Measurement procedures 27 5.2.6 Specified conditions . 27 5.3 Bias 28 5.3.1 Purpose . 28 5.3.2 Measuring circuit . 28 5.3.3 Principle of measurement 30 5.3.4 Measurement procedures 35 5.3.5 Specified conditions . 37 5.4 Output noise . 38 5.4.1 Purpose . 38 5.4.2 Measuring circuit . 38 5.4.3

25、Principle of measurement 39 5.4.4 Precautions during measurement . 40 5.4.5 Measurement procedures 40 5.4.6 Specified conditions . 43 5.5 Frequency band 43 5.5.1 Purpose . 43 5.5.2 Measuring circuit . 43 5.5.3 Principle of measurement 45 5.5.4 Precautions during measurement . 47 5.5.5 Measurement pr

26、ocedure 47 5.5.6 Specified conditions . 49 5.6 Resolution 49 5.6.1 Purpose . 49 IEC 62047-20:2014 IEC 2014 3 5.6.2 Measuring circuit . 49 5.6.3 Principle of measurement 49 5.6.4 Measurement procedures 50 5.6.5 Specified conditions . 51 Annex A (informative) Accuracy of measured value of gyro charact

27、eristics 52 A.1 General . 52 A.2 Angle and angular rate 52 A.3 Example of angular deviation occurring after calibration 52 Bibliography 53 Figure 1 Example of measuring circuit . 11 Figure 2 Example of wiring configuration 12 Figure 3 Example of measurement data when the angular rate is applied 13 F

28、igure 4 Example of scale factor data at each temperature 15 Figure 5 Example of relationship between scale factor and scale factor temperature coefficient at each temperature . 16 Figure 6 Example of measurement of ratiometric error for the scale factor . 17 Figure 7 Example measurement of scale fac

29、tor stability . 19 Figure 8 Example of measurement of scale factor symmetry 20 Figure 9 Measuring circuit for cross axis sensitivity 25 Figure 10 Principle of measurement for cross axis sensitivity . 26 Figure 11 Measuring circuit 1 for bias 29 Figure 12 Measuring circuit 2 for bias 30 Figure 13 Exa

30、mple measurement of ratiometric error for bias 32 Figure 14 Bias temperature sensitivity and bias hysteresis. 34 Figure 15 Bias linear acceleration sensitivity 35 Figure 16 Output noise measuring system . 39 Figure 17 Example of wiring configuration for output noise. 39 Figure 18 Frequency power spe

31、ctrums. 40 Figure 19 Angular random walk 41 Figure 20 Bias instability and Allan variance curve . 42 Figure 21 Measuring circuit for frequency response . 44 Figure 22 Example of wiring configuration for frequency response . 45 Figure 23 Frequency response characteristics . 46 Figure 24 Gain peak res

32、ponse characteristics 46 Figure 25 Calibration of frequency response 48 Table 1 Categories of gyro . 7 Table 2 Absolute maximum ratings 7 Table 3 Normal operating ratings . 8 Table 4 Characteristics 9 Table 5 Specified condition for measurement of scale factor 23 Table 6 Specified conditions for the

33、 measurement of bias 37 Table 7 Specified condition for the measurement of frequency band 49 Table 8 Specified condition for the measurement of resolution . 51 4 IEC 62047-20:2014 IEC 2014 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES MICRO-ELECTROMECHANICAL DEVICES Part 20: Gyro

34、scopes FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization

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44、possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 62047-20 has been prepared by subcommittee 47F: Micro- electromechanical systems, of IEC 47:

45、Semiconductor devices. The text of this standard is based on the following documents: FDIS Report on voting 47F/188/FDIS 47F/191/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted i

46、n accordance with the ISO/IEC Directives, Part 2. IEC 62047-20:2014 IEC 2014 5 A list of all parts in the IEC 62047 series, published under the general title Semiconductor devices Micro-electromechanical devices, can be found on the IEC website. The committee has decided that the contents of this pu

47、blication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. IMPORTANT The colour inside l

48、ogo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer. 6 IEC 62047-20:2014 IEC 2014 SEMICONDUCTOR DEVICES MICRO-ELECTROMECHANICAL

49、DEVICES Part 20: Gyroscopes 1 Scope This part of IEC 62047 specifies terms and definitions, ratings and characteristics, and measuring methods of gyroscopes. Gyroscopes are primarily used for consumer, general industries and aerospace applications. MEMS and semiconductor lasers are widely used for device technology of gyroscopes. Hereafter, gyroscope is