IEC 62047-15-2015 Semiconductor devices - Micro-electromechanical devices - Part 15 Test method of bonding strength between PDMS and glass《半导体器件 微型机电装置 第15部分 PDMS和玻璃之间粘结强度的试验方法》.pdf

《IEC 62047-15-2015 Semiconductor devices - Micro-electromechanical devices - Part 15 Test method of bonding strength between PDMS and glass《半导体器件 微型机电装置 第15部分 PDMS和玻璃之间粘结强度的试验方法》.pdf》由会员分享，可在线阅读，更多相关《IEC 62047-15-2015 Semiconductor devices - Micro-electromechanical devices - Part 15 Test method of bonding strength between PDMS and glass《半导体器件 微型机电装置 第15部分 PDMS和玻璃之间粘结强度的试验方法》.pdf（26页珍藏版）》请在麦多课文档分享上搜索。

1、 IEC 62047-15 Edition 1.0 2015-03 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Micro-electromechanical devices Part 15: Test method of bonding strength between PDMS and glass Dispositifs semiconducteurs Dispositifs microlectromcaniques Partie 15: Mthode dessai de la rsistance de

2、 collage entre PDMS et verre IEC 62047-15:2015-03(en-fr) colour inside THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2015 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or

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18、ue International (IEV) en ligne. Glossaire IEC - std.iec.ch/glossary Plus de 60 000 entres terminologiques lectrotechniques, en anglais et en franais, extraites des articles Termes et Dfinitions des publications IEC parues depuis 2002. Plus certaines entres antrieures extraites des publications des

19、CE 37, 77, 86 et CISPR de lIEC. Service Clients - webstore.iec.ch/csc Si vous dsirez nous donner des commentaires sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 62047-15 Edition 1.0 2015-03 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Micro-el

20、ectromechanical devices Part 15: Test method of bonding strength between PDMS and glass Dispositifs semiconducteurs Dispositifs microlectromcaniques Partie 15: Mthode dessai de la rsistance de collage entre PDMS et verre INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATI

21、ONALE ICS 31.080.99 ISBN 978-2-8322-2291-1 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vo

22、us avez obtenu cette publication via un distributeur agr. colour inside 2 IEC 62047-15:2015 IEC 2015 CONTENTS FOREWORD . 3 1 Scope 5 2 Normative references 5 3 Terms and definitions 5 4 Testing method 6 4.1 Visual test . 6 4.1.1 General . 6 4.1.2 Equipment . 6 4.1.3 Procedure 6 4.1.4 Visual test res

23、ults 6 4.2 Bonding strength test 6 4.2.1 General . 6 4.2.2 Sample preparation . 7 4.2.3 Procedure 7 4.2.4 Result of blister test . 8 4.3 Contact angle measurement . 8 4.3.1 General . 8 4.3.2 Equipment . 8 4.3.3 Procedure 8 4.3.4 Result of test . 9 4.4 Hermeticity test . 9 4.4.1 General . 9 4.4.2 Equ

24、ipment . 9 4.4.3 Procedure 10 4.4.4 Result of test . 10 Bibliography 11 Figure 1 Blister mask . 7 Figure 2 PDMS blister 8 Figure 3 Contact angle measurement of water drop on PDMS 9 Figure 4 Test set-up for hermeticity 10 Table 1 Result of visual test . 6 IEC 62047-15:2015 IEC 2015 3 INTERNATIONAL EL

25、ECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES MICRO-ELECTROMECHANICAL DEVICES Part 15: Test method of bonding strength between PDMS and glass FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical c

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35、ication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all s

36、uch patent rights. International Standard IEC 62047-15 has been prepared by subcommittee 47F: Micro- electromechanical systems, of IEC technical committee 47: Semiconductor devices. The text of this standard is based on the following documents: FDIS Report on voting 47F/208/FDIS 47F/213/RVD Full inf

37、ormation on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. 4 IEC 62047-15:2015 IEC 2015 A list of all parts in the IEC 62047 series, published under t

38、he general title Semiconductor devices Micro-electromechanical devices, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to t

39、he specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. IMPORTANT The colour inside logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding

40、of its contents. Users should therefore print this document using a colour printer. IEC 62047-15:2015 IEC 2015 5 SEMICONDUCTOR DEVICES MICRO-ELECTROMECHANICAL DEVICES Part 15: Test method of bonding strength between PDMS and glass 1 Scope This part of IEC 62047 describes test method for bonding stre

41、ngth between poly dimethyl siloxane (PDMS) and glass. Silicone-based rubber, PDMS, is used for building of chip-based microfluidic devices fabricated using lithography and replica moulding processes. The problem of bonding strength is mainly for high pressure applications as in the case of certain p

42、eristaltic pump designs where an off chip compressed air supply is used to drive the fluids in micro channels created by a twin layer, one formed by bondage between glass with replica moulded PDMS and another between PDMS and PDMS. Also, in case of systems having pneumatic microvalves, a relatively

43、high level of bonding particularly between two replica moulded layers of PDMS becomes quite necessary. Usually there is a leakage and debonding phenomena between interface of bonded areas, which causes unstability and shortage of lifetime for MEMS devices. This standard specifies general procedures

44、on bonding test of PDMS and glass chip. 2 Normative references The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the

45、referenced document (including any amendments) applies. IEC 62047-9, Semiconductor devices Micro-electromechanical devices Part 9: Wafer to wafer bonding strength measurement for MEMS 3 Terms and definitions For the purposes of this document, the following terms and definitions apply. 3.1 complete b

46、onded area bonded wafer without void areas 3.2 hydrophilic physical property of a molecule that can bond with water (H 2 O) through hydrogen bonding Note 1 to entry: A definition of the term “molecule“ can be found on this page: http:/en.wikipedia.org/wiki/Molecule. Note 2 to entry: A definition of

47、“hydrogen bond“ can be found on this page: http:/en.wikipedia.org/wiki/Hydrogen_bonding. 3.3 hydrophobic property that tend to be non-polar molecules which form aggregates of like molecules in water and analogous intramolecular interactions 6 IEC 62047-15:2015 IEC 2015 3.4 PDMS silicone-based rubber

48、 poly dimethyl siloxane having a chemical formula of (H 3 C) 3 SiOSi(CH 3 ) 2 O n Si(CH 3 ) 34 Testing method 4.1 Visual test 4.1.1 General The visual test should be performed to confirm whether substantial other bonding tests are required. Visual test is a simple qualitative test method. Optical eq

49、uipment shall be used to evaluate the bonding interface of glass to PDMS and PDMS to PDMS. 4.1.2 Equipment One or a few equipments of optical microscope, scanning acoustic microscope, scanning electron microscope (SEM), transmittion electron microscope (TEM) and infra-red (IR) or optical camera can be used. 4.1.3 Procedure The procedure is as follows: a) to observe bonding conditions using the o