IEC 62047-1-2016 Semiconductor devices - Micro-electromechanical devices - Part 1 Terms and definitions《半导体装置.微型机电装置.第1部分 术语和定义》.pdf

《IEC 62047-1-2016 Semiconductor devices - Micro-electromechanical devices - Part 1 Terms and definitions《半导体装置.微型机电装置.第1部分 术语和定义》.pdf》由会员分享，可在线阅读，更多相关《IEC 62047-1-2016 Semiconductor devices - Micro-electromechanical devices - Part 1 Terms and definitions《半导体装置.微型机电装置.第1部分 术语和定义》.pdf（70页珍藏版）》请在麦多课文档分享上搜索。

1、 IEC 62047-1 Edition 2.0 2016-01 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Micro-electromechanical devices Part 1: Terms and definitions Dispositifs semiconducteurs Dispositifs microlectromcaniques Partie 1: Termes et dfinitions IEC 62047-1:2016-01(en-fr) THIS PUBLICATION IS

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10、ce a month by email. Electropedia - www.electropedia.org The worlds leading online dictionary of electronic and electrical terms containing 20 000 terms and definitions in English and French, with equivalent terms in 15 additional languages. Also known as the International Electrotechnical Vocabular

11、y (IEV) online. IEC Glossary - std.iec.ch/glossary 65 000 electrotechnical terminology entries in English and French extracted from the Terms and Definitions clause of IEC publications issued since 2002. Some entries have been collected from earlier publications of IEC TC 37, 77, 86 and CISPR. IEC C

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16、hed - webstore.iec.ch/justpublished Restez inform sur les nouvelles publications IEC. Just Published dtaille les nouvelles publications parues. Disponible en ligne et aussi une fois par mois par email. Electropedia - www.electropedia.org Le premier dictionnaire en ligne de termes lectroniques et lec

17、triques. Il contient 20 000 termes et dfinitions en anglais et en franais, ainsi que les termes quivalents dans 15 langues additionnelles. Egalement appel Vocabulaire Electrotechnique International (IEV) en ligne. Glossaire IEC - std.iec.ch/glossary 65 000 entres terminologiques lectrotechniques, en

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19、lication ou si vous avez des questions contactez-nous: csciec.ch. IEC 62047-1 Edition 2.0 2016-01 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Micro-electromechanical devices Part 1: Terms and definitions Dispositifs semiconducteurs Dispositifs microlectromcaniques Partie 1: Ter

20、mes et dfinitions INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE ICS 31.080.99 ISBN 978-2-8322-3099-2 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you

21、obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. 2 IEC 62047-1:2016 IEC 2016 CONTENTS FOREWORD . 3 1 Scope 5 2 Terms and definitions 5 2.1 General terms and definitions . 5 2.2 Terms and definit

22、ions relating to science and engineering 6 2.3 Terms and definitions relating to materials science . 7 2.4 Terms and definitions relating to functional element 7 2.5 Terms and definitions relating to machining technology 12 2.6 Terms and definitions relating to bonding and assembling technology . 19

23、 2.7 Terms and definitions relating to measurement technology . 21 2.8 Terms and definitions relating to application technology . 23 Annex A (informative) Standpoint and criteria in editing this glossary . 27 A.1 Guidelines for selecting terms . 27 A.2 Guidelines for writing the definitions . 27 A.3

24、 Guidelines for writing the notes . 27 Annex B (informative) Clause cross-references of IEC 62047-1:2005 and IEC 62047- 1:2015 28 Bibliography 32 Table B.1 Clause cross-reference of IEC 62047-1: 2005 and IEC 62047-1:2015 28 IEC 62047-1:2016 IEC 2016 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMI

25、CONDUCTOR DEVICES MICRO-ELECTROMECHANICAL DEVICES Part 1: Terms and definitions FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promo

26、te international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (

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32、n of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of thi

33、s publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or ind

34、irect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for t

35、he correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 62047-1 has been pre

36、pared by subcommittee 47F: Micro- electromechanical systems, of IEC technical committee 47: Semiconductor devices. This second edition cancels and replaces the first edition published in 2005. This edition constitutes a technical revision. This edition includes the following significant technical ch

37、anges with respect to the previous edition: a) removal of ten terms; b) revision of twelve terms; c) addition of sixteen new terms. 4 IEC 62047-1:2016 IEC 2016 The text of this standard is based on the following documents: FDIS Report on voting 47F/232/FDIS 47F/238/RVD Full information on the voting

38、 for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts in the IEC 62047 series, published under the general title Semiconductor devices Micro-electr

39、omechanical devices, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publicat

40、ion will be reconfirmed, withdrawn, replaced by a revised edition, or amended. IEC 62047-1:2016 IEC 2016 5 SEMICONDUCTOR DEVICES MICRO-ELECTROMECHANICAL DEVICES Part 1: Terms and definitions 1 Scope This part of IEC 62047 defines terms for micro-electromechanical devices including the process of pro

41、duction of such devices. 2 Terms and definitions For the purposes of this document, the following terms and definitions apply. 2.1 General terms and definitions 2.1.1 micro-electromechanical device microsized device, in which sensors, actuators, transducers, resonators, oscillators, mechanical compo

42、nents and/or electric circuits are integrated Note 1 to entry: Related technologies are extremely diverse from fundamental technologies such as design, material, processing, functional element, system control, energy supply, bonding and assembly, electric circuit, and evaluation to basic science suc

43、h as micro-science and engineering as well as thermodynamics and tribology in a micro-scale. If the devices constitute a system, it is sometimes called as MEMS which is an acronym standing for “micro-electromechanical systems“ 2.1.2 MST microsystem technology technology to realize microelectrical, o

44、ptical and machinery systems and even their components by using micromachining Note 1 to entry: The term MST is mostly used in Europe. Note 2 to entry: This note applies to the French language only. 2.1.3 micromachine 2.1.3.1 micromachine, miniaturized device, the components of which are several mil

45、limetres or smaller in size Note 1 to entry: Various functional device (such as a sensor that utilizes the micromachine technology) is included. 2.1.3.2 micromachine, microsystem that consists of an integration of micromachine devices Note 1 to entry: A molecular machine called a nanomachine is incl

46、uded. 6 IEC 62047-1:2016 IEC 2016 2.2 Terms and definitions relating to science and engineering 2.2.1 micro-science and engineering science and engineering for the microscopic world of MEMS Note 1 to entry: When mechanical systems are miniaturized, various physical parameters change. Two cases preva

47、il: 1) these changes can be predicted by extrapolating the changes of the macro-world, and 2) the peculiarity of the microscopic world becomes apparent and extrapolation is not possible. In the latter case, it is necessary to establish new theoretical and empirical equations for the explanation of p

48、henomena in the microscopic world. Moreover, new methods of analysis and synthesis to deal with engineering problems must be developed. Materials science, fluid dynamics, thermodynamics, tribology, control engineering, and kinematics can be systematized as micro-sciences and engineering supporting m

49、icromechatronics. 2.2.2 scale effect change in effect on the objects behaviour or properties caused by the change in the objects dimension Note 1 to entry: The volume of an object is proportional to the third power of its dimension, while the surface area is proportional to the second power. As a result, the effect of surface force becomes larger than that of the body force in the microscopic world. For example, the