IEC 61189-5-2006 Test methods for electrical materials interconnection structures and assemblies - Part 5 Test methods for printed board assemblies《电气材料、互连结构和组件的试验方法.第5部分 印制电路板组件的试验方法》.pdf

《IEC 61189-5-2006 Test methods for electrical materials interconnection structures and assemblies - Part 5 Test methods for printed board assemblies《电气材料、互连结构和组件的试验方法.第5部分 印制电路板组件的试验方法》.pdf》由会员分享，可在线阅读，更多相关《IEC 61189-5-2006 Test methods for electrical materials interconnection structures and assemblies - Part 5 Test methods for printed board assemblies《电气材料、互连结构和组件的试验方法.第5部分 印制电路板组件的试验方法》.pdf（126页珍藏版）》请在麦多课文档分享上搜索。

1、 IEC 61189-5 Edition 1.0 2006-08 INTERNATIONAL STANDARD NORME INTERNATIONALE Test methods for electrical materials, interconnection structures and assemblies Part 5: Test methods for printed board assemblies Mthodes dessai pour les matriaux lectriques, les structures dinterconnexion et les ensembles

2、 Partie 5: Mthodes dessai des assemblages de cartes circuit imprim IEC 61189-5:2006 THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2006 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means,

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6、le Comit national de la CEI de votre pays de rsidence. IEC Central Office 3, rue de Varemb CH-1211 Geneva 20 Switzerland Email: inmailiec.ch Web: www.iec.ch About the IEC The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes International

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15、e 20 000 termes et dfinitions en anglais et en franais, ainsi que les termes quivalents dans les langues additionnelles. Egalement appel Vocabulaire Electrotechnique International en ligne. Service Clients: www.iec.ch/webstore/custserv/custserv_entry-f.htm Si vous dsirez nous donner des commentaires

16、 sur cette publication ou si vous avez des questions, visitez le FAQ du Service clients ou contactez-nous: Email: csciec.ch Tl.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC 61189-5 Edition 1.0 2006-08 INTERNATIONAL STANDARD NORME INTERNATIONALE Test methods for electrical materials, interconnection s

17、tructures and assemblies Part 5: Test methods for printed board assemblies Mthodes dessai pour les matriaux lectriques, les structures dinterconnexion et les ensembles Partie 5: Mthodes dessai des assemblages de cartes circuit imprim INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNI

18、QUE INTERNATIONALE XB ICS 31.180 PRICE CODE CODE PRIX ISBN 2-8318-9830-7 2 61189-5 IEC:2006 CONTENTS FOREWORD.4 INTRODUCTION.6 1 Scope.7 2 Normative references .7 3 Accuracy, precision and resolution .8 3.1 Accuracy .8 3.2 Precision.8 3.3 Resolution.9 3.4 Report.9 3.5 Students t distribution.10 3.6

19、Suggested uncertainty limits10 4 Catalogue of approved test methods 11 5 P: Preparation/conditioning test methods11 5.1 Test 5P01: Test-board design guideline.11 5.2 Test 5P02: Standard mounting process for CSP/BGA packages 11 6 V: Visual test methods11 7 D: Dimensional test methods 11 8 C: Chemical

20、 test methods.11 8.1 Test 5C01: Corrosion, flux.11 9 M: Mechanical test methods .14 9.1 Test 5M01: Peel test method for test-board land .14 10 E: Electrical test methods.14 10.1 Test 5E01: Changes of the surface insulation resistance caused by fluxes14 10.2 Test 5E02: Surface insulation resistance,

21、assemblies .21 11 N: Environmental test methods.29 11.1 Test 5N01: Reflow solderability test for soldering joint.29 11.2 Test 5N02: Resistance to reflow solderability of test board30 11.3 Test 5N03: Solderability test for test board land 30 12 X Miscellaneous test methods 30 12.1 Test 5X01: Liquid f

22、lux activity, wetting balance method 30 12.2 Test 5X02: Paste flux viscosity T-Bar spindle method 34 12.3 Test 5X03: Spread test, liquid or extracted solder flux, solder paste and extracted cored wires or preforms.34 12.4 Test 5X04: Solder paste viscosity T-Bar spin spindle method (applicable to 300

23、 Pas to 1 600 Pas) .37 12.5 Test 5X05: Solder paste viscosity T-Bar spindle method (applicable to 300 Pas)39 12.6 Test 5X06: Solder paste viscosity Spiral pump method (applicable to 300 Pas to 1 600 Pas) 41 12.7 Test 5X07: Solder paste viscosity Spiral pump method (applicable to 300 Pas).43 12.8 Tes

24、t 5X08: Solder paste Slump test45 12.9 Test 5X09: Solder paste Solder ball test 48 12.10 Test 5X10: Solder paste Tack test .50 12.11 Test 5X11: Solder paste Wetting test.52 12.12 Test 5X12: Flux residues Tackiness after drying54 61189-5 IEC:2006 3 12.13 Test 5X13: Spitting of flux-cored wire solder.

25、55 12.14 Test 5X14: Solder pool test.58 Bibliography60 Figure 1 Surface insulation resistance pattern .15 Figure 2 Connector arrangement17 Figure 3 Specimen orientation in test chamber.18 Figure 4 Test method 5E0223 Figure 5 Resistor verification coupon .24 Figure 6 Resistor verification board with

26、protective cover.25 Figure 7 Test specimen location with respect to chamber air flow 25 Figure 8 Wetting balance apparatus.32 Figure 9 Wetting balance curve33 Figure 10 Slump test stencil thickness, 0,20 mm46 Figure 11 Slump test stencil thickness, 0,10 mm47 Figure 12 Solder-ball test evaluation50 F

27、igure 13 Solder wetting examples 53 Figure 14 Test apparatus for spitting test.57 Table 1 Students t distribution.10 Table 2 Coupons for surface insulation resistance (SIR) testing.16 Table 3 Qualification test report .21 Table 4 Suggested test conditions .27 Table 5 Typical spread areas defined in

28、mm 2 35 Table 6 Example of a test report on solder paste .39 Table 7 Example of a test report on solder paste .41 Table 8 Example of test report on solder paste 43 Table 9 Example of test report on solder paste 45 Table 10 Example of a test report Stencil thickness, 0,2 mm.48 Table 11 Example of a t

29、est report Stencil thickness, 0,1 mm.48 4 61189-5 IEC:2006 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES Part 5: Test methods for printed board assemblies FOREWORD 1) The International Electrotechnical Commission (IEC) is

30、 a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to

31、other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in t

32、he subject dealt with may participate in this preparatory work. International, governmental and non- governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with condit

33、ions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC Natio

34、nal Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way

35、 in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC

36、Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All users should en

37、sure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of

38、 any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the r

39、eferenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. In

40、ternational Standard IEC 61189-5 has been prepared by IEC technical committee 91: Electronic assembly technology. This bilingual version, published in 2008-05, corresponds to the English version. The text of this standard is based on the following documents: FDIS Report on voting 91/608/FDIS 91/619/

41、RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. The French version of this standard has not been voted upon. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. 61189-5 IEC:2006 5

42、 This standard is to be used in conjunction with the following parts of IEC 61189: Part 1: General test methods and methodology Part 2: Test methods for materials for interconnection structures Part 3: Test methods for interconnection structures (printed boards) Part 4: Test methods for electronic c

43、omponents assembling characteristics (under consideration) Part 6: Test methods for materials used in electronic assemblies and also the following standard: IEC 60068 series: Environmental testing The committee has decided that the contents of this publication will remain unchanged until the mainten

44、ance result date indicated on the IEC website under http:/webstore.iec.ch in the data related to the specific publication. At this date, the publication will be reconfirmed; withdrawn; replaced by a revised edition, or amended. 6 61189-5 IEC:2006 INTRODUCTION IEC 61189 relates to test methods for pr

45、inted boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. The standard is divided into separate parts, covering information for the designer and the test methodology engineer or technician. Each part has a specific f

46、ocus; methods are grouped according to their application and numbered sequentially as they are developed and released. In some instances test methods developed by other TCs (for example, TC 104) have been reproduced from existing IEC standards in order to provide the reader with a comprehensive set

47、of test methods. When this situation occurs, it will be noted on the specific test method; if the test method is reproduced with minor revision, those paragraphs that are different are identified. This part of IEC 61189 contains test methods for evaluating printed board assemblies. The methods are s

48、elf-contained, with sufficient detail and description so as to achieve uniformity and reproducibility in the procedures and test methodologies. The tests shown in this standard are grouped according to the following principles: P: preparation/conditioning methods V: visual test methods D: dimensiona

49、l test methods C: chemical test methods M: mechanical test methods E: electrical test methods N: environmental test methods X: miscellaneous test methods To facilitate reference to the tests, to retain consistency of presentation, and to provide for future expansion, each test is identified by a number (assigned sequentially) added to the prefix