IEC 61163-2-1998 Reliability stress screening - Part 2 Electronic components《可靠性应力筛选 第2部分 电子元器件》.pdf

《IEC 61163-2-1998 Reliability stress screening - Part 2 Electronic components《可靠性应力筛选 第2部分 电子元器件》.pdf》由会员分享，可在线阅读，更多相关《IEC 61163-2-1998 Reliability stress screening - Part 2 Electronic components《可靠性应力筛选 第2部分 电子元器件》.pdf（78页珍藏版）》请在麦多课文档分享上搜索。

1、NORME INTERNATIONALE CEI IEC INTERNATIONAL STANDARD 611632 Premiredition Firstedition 199811 Dverminagesouscontraintes Partie2: Composantslectroniques Reliabilitystressscreening Part2: Electroniccomponents Numroderfrence Referencenumber CEI/IEC611632:1998Numrosdespublications Depuisle1erjanvier1997,

2、lespublicationsdelaCEI sontnumrotespartirde60000. Publicationsconsolides Lesversionsconsolidesdecertainespublicationsde laCEIincorporantlesamendementssontdisponibles. Parexemple,lesnumrosddition1.0,1.1et1.2 indiquentrespectivementlapublicationdebase,la publicationdebaseincorporantlamendement1,etla p

3、ublicationdebaseincorporantlesamendements1 et2. Validitdelaprsentepublication LecontenutechniquedespublicationsdelaCEIest constammentrevuparlaCEIafinquilreflteltat actueldelatechnique. Desrenseignementsrelatifsladatede reconfirmationdelapublicationsontdisponiblesdans leCataloguedelaCEI. Lesrenseigne

4、mentsrelatifsdesquestionsltudeet destravauxencoursentreprisparlecomittechnique quiatablicettepublication,ainsiquelalistedes publicationstablies,setrouventdanslesdocumentsci dessous: SitewebdelaCEI* CataloguedespublicationsdelaCEI Publiannuellementetmisjourrgulirement (Catalogueenligne)* Bulletindela

5、CEI DisponiblelafoisausitewebdelaCEI*et commepriodiqueimprim Terminologie,symbolesgraphiques etlittraux Encequiconcernelaterminologiegnrale,lelecteur sereporteralaCEI60050: VocabulaireElectro techniqueInternational (VEI). Pourlessymbolesgraphiques,lessymboleslittraux etlessignesdusagegnralapprouvspa

6、rlaCEI,le lecteurconsulteralaCEI60027: Symboleslittraux utiliserenlectrotechnique,laCEI60417:Symboles graphiquesutilisablessurlematriel.Index,relevet compilationdesfeuillesindividuelles, etlaCEI60617: Symbolesgraphiquespourschmas. * Voiradressesitewebsurlapagedetitre. Numbering Asfrom1January1997all

7、IECpublicationsare issuedwithadesignationinthe60000series. Consolidatedpublications ConsolidatedversionsofsomeIECpublications includingamendmentsareavailable.Forexample, editionnumbers1.0,1.1and1.2refer,respectively,to thebasepublication,thebasepublication incorporatingamendment1andthebasepublicatio

8、n incorporatingamendments1and2. Validityofthispublication ThetechnicalcontentofIECpublicationsiskeptunder constantreviewbytheIEC,thusensuringthatthe contentreflectscurrenttechnology. Informationrelatingtothedateofthereconfirmationof thepublicationisavailableintheIECcatalogue. Informationonthesubject

9、sunderconsiderationand workinprogressundertakenbythetechnical committeewhichhaspreparedthispublication,aswell asthelistofpublicationsissued,istobefoundatthe followingIECsources: IECwebsite* CatalogueofIECpublications Publishedyearlywithregularupdates (Onlinecatalogue)* IECBulletin Availablebothatthe

10、IECwebsite*andasa printedperiodical Terminology,graphicalandletter symbols Forgeneralterminology,readersarereferredto IEC60050:InternationalElectrotechnicalVocabulary (IEV). Forgraphicalsymbols,andlettersymbolsandsigns approvedbytheIECforgeneraluse,readersare referredtopublicationsIEC60027: Lettersy

11、mbolsto beusedinelectricaltechnology ,IEC60417: Graphical symbolsforuseonequipment.Index,surveyand compilationofthesinglesheets andIEC60617: Graphicalsymbolsfordiagrams. * Seewebsiteaddressontitlepage.NORME INTERNATIONALE CEI IEC INTERNATIONAL STANDARD 611632 Premiredition Firstedition 199811 Dvermi

12、nagesouscontraintes Partie2: Composantslectroniques Reliabilitystressscreening Part2: Electroniccomponents CommissionElectrotechniqueInternationale InternationalElectrotechnicalCommission Pourprix,voircatalogueenvigueur Forprice,seecurrentcatalogue IEC1998Droitsdereproductionrservs Copyrightallright

13、sreserved Aucunepartiedecettepublicationnepeuttrereproduiteni utilisesous quelqueformequecesoitetparaucun procd,lectroniqueoumcanique,ycomprislaphoto copieetlesmicrofilms,sanslaccordcritdelditeur. Nopartofthispublicationmaybereproducedorut ilizedin anyformorbyanymeans,electronicormechanical, includi

14、ngphotocopyingandmicrofilm,withoutpermissionin writingfromthepublisher. InternationalElectrotechnicalCommission 3,ruedeVarembGeneva,Switzerland Telefax:+41229190300 email:inmailiec.ch IECwebsitehttp:/www.iec.ch CODEPRIX PRICECODE V2 611632CEI:1998 SOMMAIRE Pages AVANTPROPOS 4 INTRODUCTION . 6 Articl

15、es 1Domaine dapplication. 8 2Rfrences normatives 8 3Dfinitions. 1 0 4Procdure. 12 4.1Gnralits 12 4.2 Dfinitionduprogramme 16 4.3 Etablirlecontactentrelesdeuxpartiesimpliques. 18 4.4 Identifierlesdfectuositsetlesmodesdedfaillancepossibles pourchaquecomposant . 18 4.5 Choisirlestypes,lesniveauxetlesqu

16、encementdecontraintesutiliser pourprovoquerlesdfaillances 18 4.6 Dterminerladureduprocessusdedverminagesouscontraintes 20 4.7 Analysermathmatiquementlesrsultatsdelessaiinitial 20 4.8 Raliserlanalysedesdfaillances . 20 4.9 Raliserdessquencesdecontraintessurlescomposants 22 4.10 Dterminerlescritresder

17、ejetoudacceptation 22 4.11 Dvelopperlaboucledactionscorrectives . 22 4.12 Fournirunretourdinformationauxfabricantsdecomposants. 26 4.13 Arrterleprocessusdedverminagesouscontraintes . 26 Figure1 Processusdedverminagesouscontraintesdescomposants (diagrammegnral) . 14 Figure2 Processusdactionscorrectiv

18、es. 24 AnnexeA(informative)Exemplesdoutilspouridentifierlesmcanismesdedfaillances danslescomposantslectroniques . 28 AnnexeB(informative) Analysedesdonnes 32 AnnexeC(informative) Exemplesdapplicationsdesprocessusdedverminage souscontraintes 52611632IEC:1998 3 CONTENTS Page FOREWORD . 5 INTRODUCTION

19、. 7 Clause 1Scope. 9 2Normative references 9 3Definitions. 1 1 4Procedure. 13 4.1General 13 4.2Programme definition. 17 4.3 Establishcontactbetweenthetwopartiesinvolved. 19 4.4 Identifythepossibleflawsandfailuremodesforeachcomponent. 19 4.5 Selectstresstypes,stresslevelsandstresssequencetobeusedin o

20、rdertoprecipitatefailures. 19 4.6 Determinethedurationofthereliabilitystressscreeningprocess . 21 4.7 Mathematicallyanalyzeinitialtestresults 21 4.8 Performfailureanalysis 21 4.9 Performstresssequenceonthecomponents . 23 4.10 Determineapprovalorrejectioncriteria 23 4.11 Developclosedloopcorrectiveac

21、tionprocess 23 4.12 Providefeedbacktothecomponentmanufacturers. 27 4.13 Discontinuethereliabilitystressscreeningprocess 27 Figure1 Componentreliabilityscreeningprocess(generalflowchart) . 15 Figure2 Correctiveactionprocess 25 AnnexA(informative) Examplesoftoolsforidentifyingfailuremechanisms inelect

22、roniccomponents 29 AnnexB(informative) Dataanalysis 33 AnnexC(informative) Examplesofapplicationsofreliabilitystressscreeningprocesses. 534 611632CEI:1998 COMMISSIONLECTROTECHNIQUEINTERNATIONALE _ DVERMINAGESOUSCONTRAINTES Partie2:Composantslectroniques AVANTPROPOS 1) LaCEI(CommissionElectrotechniqu

23、eInternationale)estuneorganisationmondialedenormalisationcompose delensembledescomitslectrotechniquesnationaux(ComitsnationauxdelaCEI).LaCEIapourobjetde favoriserlacooprationinternationalepourtouteslesquestionsdenormalisationdanslesdomainesde llectricitetdellectronique.Aceteffet,laCEI,entreautresact

24、ivits,publiedesNormesinternationales. Leurlaborationestconfiedescomitsdtudes,auxtravauxdesquelstoutComitnationalintressparle sujettraitpeutparticiper.Lesorganisationsinternationales,gouvernementalesetnongouvernementales,en liaisonaveclaCEI,participentgalementauxtravaux.LaCEIcollaboretroitementaveclO

25、rganisation InternationaledeNormalisation(ISO),selondesconditionsfixesparaccordentrelesdeuxorganisations. 2) LesdcisionsouaccordsofficielsdelaCEIconcernantlesquestionstechniquesreprsentent,danslamesure dupossibleunaccordinternationalsurlessujetstudis,tantdonnquelesComitsnationauxintresss sontreprsen

26、tsdanschaquecomitdtudes. 3) Lesdocumentsproduitsseprsententsouslaformederecommandationsinternationales.Ilssontpublis commenormes,rapportstechniquesouguidesetagrscommetelsparlesComitsnationaux. 4) Danslebutdencouragerlunificationinternationale,lesComitsnationauxdelaCEIsengagentappliquerde faontranspa

27、rente,danstoutelamesurepossible,lesNormesinternationalesdelaCEIdansleursnormes nationalesetrgionales.ToutedivergenceentrelanormedelaCEIetlanormenationaleourgionale correspondantedoittreindiqueentermesclairsdanscettedernire. 5) LaCEInafixaucuneprocdureconcernantlemarquagecommeindicationdapprobationet

28、saresponsabilit nestpasengagequandunmatrielestdclarconformelunedesesnormes. 6) LattentionestattiresurlefaitquecertainsdeslmentsdelaprsenteNormeinternationalepeuventfaire lobjetdedroitsdepropritintellectuelleoudedroitsanalogues.LaCEInesauraittretenuepour responsabledenepasavoiridentifidetelsdroitsdep

29、ropritetdenepasavoirsignalleurexistence. LaNormeinternationaleCEI611632attablieparlecomitdtudes56delaCEI:Sret defonctionnement. Letextedecettenormeestissudesdocumentssuivants: FDIS Rapportdevote 56/636/FDIS 56/642/RVD Lerapportdevoteindiqudansletableaucidessusdonnetouteinformationsurlevoteayant abou

30、tilapprobationdecettenorme. LesannexesA,BetCsontdonnesuniquementtitredinformation.611632IEC:1998 5 INTERNATIONALELECTROTECHNICALCOMMISSION _ RELIABILITYSTRESSSCREENING Part2:Electroniccomponents FOREWORD 1) TheIEC(InternationalElectrotechnicalCommission)isaworldwideorganizationforstandardizationcomp

31、rising allnationalelectrotechnicalcommittees(IECNationalCommittees).TheobjectoftheIECistopromote internationalcooperationonallquestionsconcerningstandardizationintheelectricalandelectronicfields.To thisendandinadditiontootheractivities,theIECpublishesInternationalStandards.Theirpreparationis entrust

32、edtotechnicalcommittees;anyIECNationalCommitteeinterestedinthesubjectdealtwithmay participateinthispreparatorywork.International,governmentalandnongovernmentalorganizationsliaising withtheIECalsoparticipateinthispreparation.TheIECcollaboratescloselywiththeInternationalOrganization forStandardization

33、(ISO)inaccordancewithconditionsdeterminedbyagreementbetweenthetwo organizations. 2) TheformaldecisionsoragreementsoftheIEContechnicalmattersexpress,asnearlyaspossible,an internationalconsensusofopinionontherelevantsubjectssinceeachtechnicalcommitteehasrepresentation fromallinterestedNationalCommitte

34、es. 3) Thedocumentsproducedhavetheformofrecommendationsforinternationaluseandarepublishedintheform ofstandards,technicalreportsorguidesandtheyareacceptedbytheNationalCommitteesinthatsense. 4) Inordertopromoteinternationalunification,IECNationalCommitteesundertaketoapplyIECInternational Standardstran

35、sparentlytothemaximumextentpossibleintheirnationalandregionalstandards.Any divergencebetweentheIECStandardandthecorrespondingnationalorregionalstandardshallbeclearly indicatedinthelatter. 5) TheIECprovidesnomarkingproceduretoindicateitsapprovalandcannotberenderedresponsibleforany equipmentdeclaredto

36、beinconformitywithoneofitsstandards. 6) AttentionisdrawntothepossibilitythatsomeoftheelementsofthisInternationalStandardmaybethesubject ofpatentrights.TheIECshallnotbeheldresponsibleforidentifyinganyorallsuchpatentrights. InternationalStandardIEC611632hasbeenpreparedbyIECtechnicalcommittee56: Depend

37、ability. Thetextofthisstandardisbasedonthefollowingdocuments: FDIS Reportonvoting 56/636/FDIS 56/642/RVD Fullinformationonthevotingfortheapprovalofthisstandardcanbefoundinthereporton votingindicatedintheabovetable. AnnexesA,BandCareforinformationonly.6 611632CEI:1998 INTRODUCTON Bienquedveloppinitia

38、lementcommeoutildobtentiondelafiabilitpourdessystmes fonctionnantdansdesconditionsdenvironnementsvres,ledverminagesouscontraintesa merg,danslaprofessiondesfabricantsdematriellectronique,commetantune techniquepermettantdatteindreleniveaudezrodfautpourlesnouveauxproduits. Ledverminagesouscontraintesap

39、rouvquiltaitunoutilefficacepour a) identifieretliminerlesdfectuositsduesunemauvaiseconceptiondescomposantset desproblmesdefabrication, b) trierlescomposantspourlesamenerunniveaudefiabilitpluslevquelesvaleurs publies, c) fournirdesinformationspermettantladaptationdesprocessusdansdeslimitestrs serresp

40、ourminimiserlavariabilitdesparamtres. Ilconvientdenepasconsidrerledverminagesouscontraintescommeunmoyennormal pourobtenirlafiabilitdescomposantslectroniques,parcequilnepeutpasamliorerla fiabilitindividuelledechaquecomposant.Parcontre,ilpeutamliorerlafiabilitdun systme.Lecotetlesrisques,associsaufait

41、quelescontraintesappliquespeuvent dgraderladuredeviedescomposants,dpassentengnrallesbnficespotentiels.Ilest plusavantageuxderenforcerlecontrledesprocdsdefabrication.Cependant,cette mthodepeutnepastrepratique,parexemplelorsquilexistedescomposantsdontla fiabilitestplusfaiblequelafiabilitacceptable.Uti

42、liserledverminagesouscontraintespour amliorerlescaractristiquesdecomposantspeutgalementposerunproblmedelogistique, lorsquedescomposantssimilairesceuxdverminsnesontpasdisponiblesunedate ultrieure. Lorsquedescomposantsonttdverminssouscontraintespourtreutilissdansun systmeparticulier,soitlaquantitdecomposantsncessairelarparation,pourtoutela duredeviedusystme,estdverminedsledbutduprogramme,soitlutilisateursassure queladocumentationdusystmeestsuffisantepour