IEC 60748-21-1-1997 Semiconductor devices - Integrated circuits - Part 21-1 Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis.pdf

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1、NORME INTERNATIONALE CEI IEC INTERNATIONAL STANDARD 60748211 QC760101 Deuximedition Secondedition 199704 Numroderfrence Referencenumber CEI/IEC60748211:1997 Dispositifssemiconducteurs Circuitsintgrs Partie211: Spcificationparticulirecadre pourlescircuitsintgrscouchesetlescircuits intgrshybridescouch

2、essurlabasedes procduresdhomologation Semiconductordevices Integratedcircuits Part211: Blankdetailspecificationforfilmintegratedcircuits andhybridfilmintegratedcircuitsonthebasisof qualificationapprovalproceduresValiditdelaprsentepublication LecontenutechniquedespublicationsdelaCEIestcons tammentrev

3、uparlaCEIafinquilreflteltatactuelde latechnique. Desrenseignementsrelatifsladatedereconfirmationde lapublicationsontdisponiblesauprsduBureauCentralde laCEI. Lesrenseignementsrelatifscesrvisions,ltablis sementdesditionsrvisesetauxamendementspeuvent treobtenusauprsdesComitsnationauxdelaCEIet danslesdo

4、cumentscidessous: BulletindelaCEI AnnuairedelaCEI Publiannuellement CataloguedespublicationsdelaCEI Publiannuellementetmisjourrgulirement Terminologie Encequiconcernelaterminologiegnrale,lelecteurse reporteralaCEI50:VocabulaireElectrotechniqueInter national(VEI),quiseprsentesousformedechapitres spar

5、straitantchacundunsujetdfini.Desdtails completssurleVEIpeuventtreobtenussurdemande. VoirgalementledictionnairemultilinguedelaCEI. Lestermesetdfinitionsfigurantdanslaprsentepubli cationonttsoittirsduVEI,soitspcifiquement approuvsauxfinsdecettepublication. Symbolesgraphiquesetlittraux Pourlessymbolesg

6、raphiques,lessymboleslittrauxetles signesdusagegnralapprouvsparlaCEI,lelecteur consultera: laCEI27: Symboleslittrauxutiliseren lectrotechnique; laCEI417: Symbolesgraphiquesutilisables surlematriel.Index,relevetcompilationdes feuillesindividuelles; laCEI617: Symbolesgraphiquespourschmas; etpourlesapp

7、areilslectromdicaux, laCEI878: Symbolesgraphiquespour quipementslectriquesenpratiquemdicale. Lessymbolesetsignescontenusdanslaprsentepubli cationonttsoittirsdelaCEI27,delaCEI417,dela CEI617et/oudelaCEI878,soitspcifiquementapprouvs auxfinsdecettepublication. PublicationsdelaCEItabliesparle mmecomitdt

8、udes Lattentiondulecteurestattiresurleslistesfigurantlafin decettepublication,quinumrentlespublicationsdela CEIprparesparlecomitdtudesquiatablila prsentepublication. Validityofthispublication ThetechnicalcontentofIECpublicationsiskeptunder constantreviewbytheIEC,thusensuringthatthecontent reflectscu

9、rrenttechnology. Informationrelatingtothedateofthereconfirmationofthe publicationisavailablefromtheIECCentralOffice. Informationontherevisionwork,theissueofrevised editionsandamendmentsmaybeobtainedfromIEC NationalCommitteesandfromthefollowingIEC sources: IECBulletin IECYearbook Publishedyearly Cata

10、logueofIECpublications Publishedyearlywithregularupdates Terminology Forgeneralterminology,readersarereferredtoIEC50: InternationalElectrotechnicalVocabulary (IEV),whichis issuedintheformofseparatechapterseachdealing withaspecificfield.FulldetailsoftheIEVwillbe suppliedonrequest.SeealsotheIECMultili

11、ngual Dictionary. Thetermsanddefinitionscontainedinthepresentpubli cationhaveeitherbeentakenfromtheIEVorhavebeen specificallyapprovedforthepurposeofthispublication. Graphicalandlettersymbols Forgraphicalsymbols,andlettersymbolsandsigns approvedbytheIECforgeneraluse,readersarereferredto publications:

12、 IEC27: Lettersymbolstobeusedinelectrical technology; IEC417: Graphicalsymbolsforuseon equipment.Index,surveyandcompilationofthe singlesheets; IEC617: Graphicalsymbolsfordiagrams; andformedicalelectricalequipment, IEC878:Graphicalsymbolsforelectromedical equipmentinmedicalpractice. Thesymbolsandsign

13、scontainedinthepresentpublication haveeitherbeentakenfromIEC27,IEC417,IEC617 and/orIEC878,orhavebeenspecificallyapprovedforthe purposeofthispublication. IECpublicationspreparedbythesame technicalcommittee Theattentionofreadersisdrawntotheendpagesofthis publicationwhichlisttheIECpublicationsissuedbyt

14、he technicalcommitteewhichhaspreparedthepresent publication.NORME INTERNATIONALE CEI IEC INTERNATIONAL STANDARD 60748211 QC760101 Deuximedition Secondedition 199704 Dispositifssemiconducteurs Circuitsintgrs Partie211: Spcificationparticulirecadre pourlescircuitsintgrscouchesetlescircuits intgrshybri

15、descouchessurlabasedes procduresdhomologation Semiconductordevices Integratedcircuits Part211: Blankdetailspecificationforfilmintegratedcircuits andhybridfilmintegratedcircuitsonthebasisof qualificationapprovalprocedures N Pourprix,voircatalogueenvigueur Forprice,seecurrentcatalogue CODEPRIX PRICECO

16、DE IEC1997Droitsdereproductionrservs Copyrightallrightsreserved Aucunepartiedecettepublicationnepeuttrereproduiteniut ilise sousquelqueformequecesoitetparaucunprocd,lectronique oumcanique,ycomprislaphotocopieetlesmicrofilms,sans laccordcritdelditeur. Nopartofthispublicationmaybereproducedorut ilized

17、in anyformorbyanymeans,electronicormechanical,including photocopyingandmicrofilm,withoutpermissioninwritingfrom thepublisher. InternationalElectrotechnicalCommission 3,ruedeVarembGeneva,Switzerland Telefax:+41229190300 email:inmailiec.ch IECwebsitehttp:/www.iec.ch CommissionElectrotechniqueInternati

18、onale InternationalElectrotechnicalCommission2 60748211CEI:1997 SOMMAIRE Pages AVANTPROPOS 4 INTRODUCTION . 6 Articles 1 Caractristiquesetconditionsdutilisation. 12 2 Mthodesdemontagerecommandes 12 3Marquage. 12 4 Renseignementsdonnerdanslescommandes . 12 5 Rapportscertifisdeslotsaccepts 14 6Renseig

19、nements supplmentaires. 14 7 Exigencescomplmentairesouplussvresquecellesspcifiesdanslaspcification gnriqueet/ouintermdiaire 14 8 Exigencesdecontrle(voirtableaux2et3ou4et5) . 14 9 ComplmentTableauxdelamthodeB . 22 Tableaux 1 Siunegammedecircuits. 10 2 MthodeAGroupesAetBLotparlot . 16 3 MthodeAGroupeC

20、Essaispriodiques. 18 3b MthodeAGroupeDEssaispriodiques. 20 4a MthodeBGroupeALotparlot 22 4b MthodeBGroupeBLotparlot 24 5a MthodeBGroupeCEssaispriodiques. 26 5b MthodeBGroupeDEssaispriodiques. 2860748211IEC:1997 3 CONTENTS Page FOREWORD . 5 INTRODUCTION . 7 Clause 1 Characteristicsandconditionsofuse

21、13 2 Recommendedmethodsofmounting 13 3Marking 13 4Ordering information. 13 5 Certifiedrecordsofreleasedlots 15 6Additional information. 15 7 Additionalorincreasedseveritiesorrequirementstothosespecifiedinthegeneric and/orsectionalspecification 15 8 Inspectionrequirements(seetables2and3or4and5) 15 9

22、SupplementTablesofmethodB. 23 Tables 1 Wherearangeofcircuits. 11 2 MethodAGroupsAandBLotbylot . 17 3a MethodAGroupCPeriodictests. 19 3b MethodAGroupDPeriodictests. 21 4a MethodBGroupALotbylot . 23 4b MethodBGroupBLotbylot . 25 5a MethodBGroupCPeriodictests. 27 5b MethodBGroupDPeriodictests. 294 6074

23、8211CEI:1997 COMMISSIONLECTROTECHNIQUEINTERNATIONALE _ DISPOSITIFSSEMICONDUCTEURS CIRCUITSINTGRS Partie211:Spcificationparticulirecadrepourlescircuits intgrscouchesetlescircuitsintgrshybridescouches surlabasedesprocduresdhomologation AVANTPROPOS 1) LaCEI(CommissionElectrotechniqueInternationale)estu

24、neorganisationmondialedenormalisation composedelensembledescomitslectrotechniquesnationaux(ComitsnationauxdelaCEI).LaCEIa pourobjetdefavoriserlacooprationinternationalepourtouteslesquestionsdenormalisationdansles domainesdellectricitetdellectronique.Aceteffet,laCEI,entreautresactivits,publiedesNorme

25、s Internationales.Leurlaborationestconfiedescomitsdtudes,auxtravauxdesquelstoutComit nationalintressparlesujettraitpeutparticiper.Lesorganisationsinternationales,gouvernementaleset nongouvernementales,enliaisonaveclaCEI,participentgalementauxtravaux.LaCEIcollabore troitementaveclOrganisationInternat

26、ionaledeNormalisation(ISO),selondesconditionsfixesparaccord entrelesdeuxorganisations. 2) LesdcisionsouaccordsofficielsdelaCEIconcernantlesquestionstechniques,reprsentent,dansla mesuredupossibleunaccordinternationalsurlessujetstudis,tantdonnquelesComitsnationaux intressssontreprsentsdanschaquecomitd

27、tudes. 3) Lesdocumentsproduitsseprsententsouslaformederecommandationsinternationales.Ilssontpublis commenormes,rapportstechniquesouguidesetagrscommetelsparlesComitsnationaux. 4) Danslebutdencouragerlunificationinternationale,lesComitsnationauxdelaCEIsengagentappliquer defaontransparente,danstoutelam

28、esurepossible,lesNormesinternationalesdelaCEIdansleursnormes nationalesetrgionales.ToutedivergenceentrelanormedelaCEIetlanormenationaleourgionale correspondantedoittreindiqueentermesclairsdanscettedernire. 5) LaCEInafixaucuneprocdureconcernantlemarquagecommeindicationdapprobationetsa responsabilitne

29、stpasengagequandunmatrielestdclarconformelunedesesnormes. 6) LattentionestattiresurlefaitquecertainsdeslmentsdelaprsenteNormeinternationalepeuventfaire lobjetdedroitsdepropritintellectuelleoudedroitsanalogues.LaCEInesauraittretenuepour responsabledenepasavoiridentifidetelsdroitsdepropritetdenepasavo

30、irsignalleurexistence. LaNormeinternationaleCEI60748211attablieparlesouscomit47A:Circuits intgrs,ducomitdtudes47delaCEI:Dispositifssemiconducteurs. Cettedeuximeditionannuleetremplacelapremireditionparueen1991etconstitueune rvisiontechnique. Cettenormeestunespcificationparticulirecadrepourlescircuits

31、intgrscouchesetles circuitsintgrshybridescouches. Letextedecettenormeestissudesdocumentssuivants: FDIS Rapportdevote 47A/445/FDIS 47A/477/RVD Lerapportdevoteindiqudansletableaucidessusdonnetouteinformationsurlevoteayant aboutilapprobationdecettenorme. LenumroQCquifiguresurlapagedecouverturedelaprsen

32、tepublicationestlenumrode laspcificationdanslesystmeCEIdassurancedelaqualitdescomposantslectroniques (IECQ).60748211IEC:1997 5 INTERNATIONALELECTROTECHNICALCOMMISSION - SEMICONDUCTORDEVICES INTEGRATEDCIRCUITS Part211:Blankdetailspecificationfor filmintegratedcircuitsandhybridfilmintegratedcircuits o

33、nthebasisofqualificationapprovalprocedures FOREWORD 1) TheIEC(InternationalElectrotechnicalCommission)isaworldwideorganizationforstandardization comprisingallnationalelectrotechnicalcommittees(IECNationalCommittees).TheobjectoftheIECisto promoteinternationalcooperationonallquestionsconcerningstandar

34、dizationintheelectricalandelectronic fields.Tothisendandinadditiontootheractivities,theIECpublishesInternationalStandards.Their preparationisentrustedtotechnicalcommittees;anyIECNationalCommitteeinterestedinthesubjectdealt withmayparticipateinthispreparatorywork.International,governmentalandnongover

35、nmentalorganizations liaisingwiththeIECalsoparticipateinthispreparation.TheIECcollaboratescloselywiththeInternational OrganizationforStandardization(ISO)inaccordancewithconditionsdeterminedbyagreementbetweenthe twoorganizations. 2) TheformaldecisionsoragreementsoftheIEContechnicalmattersexpress,asne

36、arlyaspossible,an internationalconsensusofopinionontherelevantsubjectssinceeachtechnicalcommitteehasrepresentation fromallinterestedNationalCommittees. 3) Thedocumentsproducedhavetheformofrecommendationsforinternationaluseandarepublishedinthe formofstandards,technicalreportsorguidesandtheyareaccepte

37、dbytheNationalCommitteesinthat sense. 4) Inordertopromoteinternationalunification,IECNationalCommitteesundertaketoapplyIECInternational Standardstransparentlytothemaximumextentpossibleintheirnationalandregionalstandards.Any divergencebetweentheIECStandardandthecorrespondingnationalorregionalstandard

38、shallbeclearly indicatedinthelatter. 5) TheIECprovidesnomarkingproceduretoindicateitsapprovalandcannotberenderedresponsibleforany equipmentdeclaredtobeinconformitywithoneofitsstandards. 6) AttentionisdrawntothepossibilitythatsomeoftheelementsofthisInternationalStandardmaybethe subjectofpatentrights.

39、TheIECshallnotbeheldresponsibleforidentifyinganyorallsuchpatentrights. InternationalStandardIEC60748211hasbeenpreparedbysubcommittee47A:Integrated circuits,ofIECtechnicalcommittee47:Semiconductordevices. Thissecondeditioncancelsandreplacesthefirsteditionpublishedin1991andconstitutesa technicalrevisi

40、on. Thisstandardisablankdetailspecificationforfilmintegratedcircuitsandhybridfilm integratedcircuits. Thetextofthisstandardisbasedonthefollowingdocuments: FDIS Reportonvoting 47A/445/FDIS 47A/477/RVD Fullinformationonthevotingfortheapprovalofthisstandardcanbefoundinthereporton votingindicatedintheab

41、ovetable. TheQCnumberthatappearsonthefrontcoverofthispublicationisthespecificationnumber intheIECQualityAssessmentSystemforElectronicComponents(IECQ).6 60748211CEI:1997 DISPOSITIFSSEMICONDUCTEURS CIRCUITSINTGRS Partie211:Spcificationparticulirecadrepourlescircuits intgrscouchesetlescircuitsintgrshyb

42、ridescouches surlabasedesprocduresdhomologation INTRODUCTION LeSystmeCEIdAssurancedelaQualitdesComposantsElectroniquesfonctionne conformmentauxstatutsdelaCEIetsoussonautorit.Lebutdecesystmeestdedfinir lesprocduresdassurancedelaqualitdetellefaonquelescomposantslectroniqueslivrs parunpaysparticipantcommetantconformesaux