IEC 60691-2015 Thermal-links - Requirements and application guide《热熔断体.要求和应用导则》.pdf

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1、 IEC 60691 Edition 4.0 2015-10 INTERNATIONAL STANDARD NORME INTERNATIONALE Thermal-links Requirements and application guide Protecteurs thermiques Exigences et guide dapplication IEC 60691:2015-10(en-fr) THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2015 IEC, Geneva, Switzerland All rights reser

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19、ontactez-nous: csciec.ch. IEC 60691 Edition 4.0 2015-10 INTERNATIONAL STANDARD NORME INTERNATIONALE Thermal-links Requirements and application guide Protecteurs thermiques Exigences et guide dapplication INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE ICS 29.120.

20、50 ISBN 978-2-8322-2921-7 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu ce

21、tte publication via un distributeur agr. 2 IEC 60691:2015 IEC 2015 CONTENTS FOREWORD . 4 INTRODUCTION . 6 1 Scope 7 2 Normative references 7 3 Terms and definitions 8 4 General requirements 10 5 General notes on tests 11 6 Classification . 13 6.1 Electrical conditions 13 6.2 Thermal conditions 14 6.

22、3 Resistance to tracking . 14 7 Marking . 14 8 Documentation 15 9 Constructional requirements 15 9.1 General . 15 9.2 Lead secureness tests 16 9.2.1 General . 16 9.2.2 Tensile test 16 9.2.3 Thrust test . 17 9.2.4 Bending/twist test 17 9.3 Contacts used for the current path 18 9.4 Accessible mounting

23、 brackets or metal parts 18 9.5 Insulating materials . 18 9.6 Resistance to tracking . 18 9.7 Creepage distances and clearances 18 9.8 Temperature and humidity cycle conditioning 19 9.9 Terminals and terminations . 19 10 Electrical requirements 19 10.1 Dielectric strength . 19 10.2 Insulation resist

24、ance . 20 10.3 Interrupting current . 21 10.3.1 General . 21 10.3.2 Specific conditions . 21 10.4 Transient overload current 22 10.5 Limited short-circuit test 23 10.5.1 General . 23 10.5.2 Test method 23 10.5.3 Fuse size (rating) . 23 10.5.4 Compliance . 24 11 Temperature tests . 24 11.1 General .

25、24 11.2 Holding temperature, T h24 11.3 Rated functioning temperature, T f. 25 11.4 Maximum temperature limit, T m25 IEC 60691:2015 IEC 2015 3 11.5 Ageing 25 12 Resistance to rusting . 26 13 Manufacturers validation programme 26 Annex A (normative) Application guide. 28 Annex B (normative) Alternati

26、ve ageing test for thermal-links with T hgreater than 250 C for use in electric irons 29 Annex C (normative) Conductive heat ageing test 30 C.1 Conductive heat ageing test 30 C.2 Method . 30 C.3 Ageing 31 C.4 Results . 32 C.5 Dielectric strength test 32 C.6 Test oven 32 Annex D (informative) Extende

27、d holding temperature evaluation 34 D.1 Extended holding temperature conditioning test 34 D.2 Load current interrupt test . 34 Annex E (normative) Seal ageing test 36 Annex F (normative) Identification requirements 38 Annex G (normative) Indelibility of markings 39 Annex H (normative) Requirements f

28、or thermal-link packaged assemblies . 40 Bibliography 43 Figure 1 Bending/twist test . 17 Figure C.1 Typical test fixture assembly . 32 Figure C.2 Typical thermal-link test oven . 33 Figure D.1 Typical terminal block support test fixture . 35 Figure E.1 Conditioning time versus oven temperature for

29、proposed temperature index. 37 Figure G.1 Apparatus for testing durability of markings 39 Table 1 Test schedule 13 Table 2 Strength of leads and terminal parts Minimum required tensile and thrust test forces . 17 Table 3 Creepage distances and clearances (absolute minimum values) . 19 Table 4 Test v

30、oltages for dielectric strength . 20 Table 5 Test current for interrupting test 21 Table 6 Limited short-circuit test capacity 23 Table H.1 Push and pull force 41 Table H.2 Minimum nominal cross-sectional area of conductor 42 4 IEC 60691:2015 IEC 2015 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ THER

31、MAL-LINKS REQUIREMENTS AND APPLICATION GUIDE FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on al

32、l questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publi

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38、ication bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shal

39、l attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including lega

40、l fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publ

41、ication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60691 has been prepared by subcommittee 32C: Miniature

42、fuses, of IEC technical committee 32: Fuses. This fourth edition cancels and replaces the third edition published in 2002, Amendment 1: 2006 and Amendment 2: 2010. This fourth edition constitutes a technical revision. This fourth edition includes the following significant technical changes with resp

43、ect to the previous edition: a) requirements for thermal-link packaged assemblies; b) renew the requirements and definitions for T h -test; c) change starting temperature for interrupt current test; d) clarify requirements for marking (packing label); e) minimum Proof Tracking Index 175 instead 120.

44、 IEC 60691:2015 IEC 2015 5 The text of this standard is based on the following documents: FDIS Report on voting 32C/512/FDIS 32C/515/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been draft

45、ed in accordance with the ISO/IEC Directives, Part 2. The basis for this standard is the harmonization of the USA national standard, UL 1020, fifth edition (withdrawn 2003), and IEC 60691:1993, together with its Amendment 1:1995 and Amendment 2:2000. The following differing practices of a less perma

46、nent nature exist in the country indicated below: Annex C is required to be declared in the USA; Annex E is required in the USA, if applicable; Annex F is required to be declared in the USA. In this standard, the following type is used: compliance statements: in italic type. The committee has decide

47、d that the contents of this publication will remain unchanged until the stability date indicated on the IEC website under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended.

48、6 IEC 60691:2015 IEC 2015 INTRODUCTION Thermal-links, defined as non-resettable devices functioning once only without refunctioning, are widely applied for the thermal protection of equipment in which, under fault (abnormal) conditions, one or more parts may reach hazardous temperatures. As these de

49、vices have several aspects in common with miniature fuse-links and are used for obtaining a comparable degree of protection, this standard has endeavoured to lay down a number of basic requirements for such devices. IEC 60691:2015 IEC 2015 7 THERMAL-LINKS REQUIREMENTS AND APPLICATION GUIDE 1 Scope This International Standard is applicable to thermal-links intended for incorporation in electrical a