SAE USCAR 40-1-2015 Lead-Free Solder Validation Test Plan.pdf

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1、Lead-Free Solder Validation Test PlanSAE/USCAR40-1 April 2015ISBN: 978-0-7680-8219-7 SUMMARY OF CONTENTS 1. INTRODUCTION . 2 1.1 Scope 2 1.2 Purpose . 2 1.3 Functional Requirement of the Connection 2 1.4 Parameter and Tolerance Requirements 3 2. CONNECTION DESCRIPTION 3 2.1 Connection Family Descrip

2、tion . 3 3. PERFORMANCE VERIFICATION 4 3.1 DUT Specimens 4 3.2 Test Sequence 5 3.3 Test Matrix 5 3.4 Evaluation Criteria . 6 3.4.1 Failure Analysis . 6 3.5 Acceptance Criteria . 6 3.5.1 Visual Inspection . 6 3.5.2 Continuity Check . 6 4. VALIDATION . 7 4.1 Ambient Temperature Exposure . 7 4.2 High T

3、emperature Exposure . 7 4.3 Low Temperature Exposure 7 4.4 Humidity With Temperature 8 4.5 Temperature Cycle 8 4.6 Vibration Test 9 4.7 Power Cycle at Cold 9 4.8 Continuous Power On . 9 5. REVISION HISTORY 9 SAE/USCAR-40 REVISION 1 Issued 2011-04 Revised 2015-04 Lead-Free Solder Validation Test Plan

4、 _ The research data, analysis, conclusion, opinions and other contents of this document are solely the product of the authors. Neither the SAE International (SAE) nor the United States Council for Automotive Research (USCAR) certifies the compliance of any products with the requirements of nor make

5、s any representations as to the accuracy of the contents of this document nor to its applicability for purpose. It is the sole responsibility of the user of this document to determine whether or not it is applicable for their purposes. Copyright 2015 USCAR Printed in U.S.A. All rights reserved. QUES

6、TIONS REGARDING THIS DOCUMENT: (248) 273-2470 FAX (248) 273-2494 TO PLACE A DOCUMENT ORDER: (724) 776-4970 FAX (724) 776-0790 SAE/USCAR-40 Revision 1 Revised 2015-04 LEAD-FREE SOLDER VALIDATION TEST PLAN - 2 - 1. INTRODUCTION This Test Plan shall be completed by the supplier and submitted to the OEM

7、s 6 weeks prior to start of test for approval by the OEM representative. All sections shall be included as stated in the outline, only additions of new sections are allowed. If a section is not applicable, this shall be stated in this Test Plan along with supporting justification in the relevant sec

8、tion description. This document has been developed and agreed upon by a joint workgroup consisting of the following OEM representatives: Marty Hildreth - Chrysler LLC Daryl Trate - Chrysler LLC Tom Boettger Ford Motor Company Keith Hodgson Ford Motor Company Tom Hagen General Motors Corporation 1.1

9、Scope This guideline is applicable to existing lead solder production products that will change to lead-free solder processes to meet the ELV Directive 2000/53/EC Annex II, exemption 8B requirements. This guideline is applicable to similar products used by multiple OEMs that have the same manufactur

10、ing processes / equipment. The intent is to streamline the suppliers environmental testing via common qualification to reduce timing, quantities, and costs. 1.2 Purpose The purpose of this Test Plan documents the procedures for all tests according to this USCAR guideline. It describes all test set-u

11、ps and the procedures to verify the environmental robustness of a lead free connector on glass. 1.3 Functional Requirement of the Connection The functional requirement for the solder joint is to provide an electrical connection between wiring elements and a glazing component for the life of the vehi

12、cle. Life Requirements Target Life = 10 years, 150k Miles Electrical Load - Minimum/Maximum 11 15 operating voltage Operating Temperature Range Ambient temperature and at T0, also part temperature Tmin = -40 to Tmax_ 85, 95 105 or 115 C, per component/OEM specification SAE/USCAR-40 Revision 1 Revise

13、d 2015-04 LEAD-FREE SOLDER VALIDATION TEST PLAN - 3 - 1.4 Parameter and Tolerance Requirements Unless stated otherwise, the following shall define the test environment parameters and tolerances to be used for all validation testing: Parameter Tolerance Ambient Temperature Spec. 3 C Test Time Spec. -

14、0,+2 % Room Ambient Relative Humidity 30 - 70 % Chamber Humidity Spec. 5 % Voltage Spec. 0.3 V Current Spec. 1 % Random Acceleration (GRMS) Spec. 20 % (PSD deviations from applicable tables are not permitted) Acceleration (Mechanical Shock, G) Spec. 20 % Frequency Spec. 1 % Distance (Excluding Dimen

15、sional Check) Spec. 5 % 2. CONNECTION DESCRIPTION 2.1 Connection Family Description A family consists of a glazing material substrate (annealed, tempered or polymeric), a silver conductive paste, a solder alloy, and a connector geometry. No one member or multiple members of this family may be change

16、d without revalidating the entire family. SAE/USCAR-40 Revision 1 Revised 2015-04 LEAD-FREE SOLDER VALIDATION TEST PLAN - 4 - 3. PERFORMANCE VERIFICATION 3.1 DUT Specimens Provide a brief DUT product family description, including any similarities and differences of hardware implementation within the

17、 family. Please state the justification and rationale for choosing the specific DUT sample which represents the entire product family. DUT Name (no abbreviations): (TBD) Revision Date: (TBD) Revision Number: (TBD) DUT Part Number: (TBD) DUT Manufacturer: (TBD) DUT Project Information: (TBD: First ve

18、hicle application, including model year and program name) DUT Mounting Location in Vehicle: (TBD) Prepared by (Supplier): (TBD) Surrogate Applications: (TBD: Other DUTs, including model year and program name, validated by the test results) Approved by (Supplier): (TBD) Approved by OEM Responsible En

19、gineers: Chrysler (TBD) Ford (TBD) General Motors (TBD) SAE/USCAR-40 Revision 1 Revised 2015-04 LEAD-FREE SOLDER VALIDATION TEST PLAN - 5 - 3.2 Test Sequence 3.3 Test Matrix (see matrix below) SAE/USCAR-40 Revision 1 Revised 2015-04 LEAD-FREE SOLDER VALIDATION TEST PLAN - 6 - 3.4 Evaluation Criteria

20、 3.4.1 Failure Analysis All failures/non compliance parts shall be evaluated using the requesting OEM/suppliers in house Failure Analysis process. Sample forms and directions to be supplied along with the any additional Acceptance Criteria at the time of the test request. 3.5 Acceptance Criteria Def

21、ined by each OEM prior to start of test 3.5.1 Visual Inspection Procedure 1. All soldered joints are visually inspected to detect micro cracks with the method described below. 2. Initial micro crack inspection should be conducted at least 24 hours after soldering. 3. The inspection must be performed

22、 prior to all other tests. 4. The inspection must also be performed as the first inspection after completion of the other tests. 5. If a micro crack is detected, the inspection result is not passed. Inspection Method for micro cracks 1. The outside glass surface of the test part is cleaned with a gl

23、ass cleaner leaving no impurities. 2. Viewing through the outside glass surface (opposite the silver printed side), the interface area of the solder joint to the glass or frit is inspected for micro cracks. 3. A bright spot light (65W minimum) is used to illuminate the soldered area. 4. The light sh

24、ould be held at an angle of approximately 45 degrees and a distance of 6 - 12 inches (15 - 30 cm) from the glass surface. The light should be moved around the part to illuminate the soldered area from different directions to ensure detection of the micro crack. 5. A micro crack is visible due to its

25、 light scattering properties and will be detectable as a white/silver spot or reflection. 6. If a defect is observed a 10X magnifier should be used with spot light illumination to verify that the defect is in fact a micro crack (i.e. not a paint void or bubble, glass surface scratch, etc.). 3.5.2 Co

26、ntinuity Check Windows and electrical connectors tested Cycles are at 13.5 V or the design voltage whichever is greater, +/- 0.3 VDC Design Voltage is the normal engine on operating voltage expected at the terminals of the window based on voltage regulation, electrical distribution wiring resistance

27、, and window current draw. Functional test Soak to specific time and temp Measure current draw at operating voltage and record Environmental Cycles 25C for 30 minutes - measure current draw at operating voltage -30C for 30 minutes - measure current draw at operating voltage 50C for 30 minutes - meas

28、ure current draw at operating voltage SAE/USCAR-40 Revision 1 Revised 2015-04 LEAD-FREE SOLDER VALIDATION TEST PLAN - 7 - Failure Criteria Current draw change 7% from original Change in total power dissipation 15% 4. VALIDATION 4.1 Ambient Temperature Exposure Applicable standard: ISO 16750 a. Load

29、parts as defined above at room ambient. Record starting temperature. b. After 500 hours perform the required Functional and Visual evaluations as specified in section 3.5.1 and 3.5.2. 4.2 High Temperature Exposure Applicable standard: ISO 16750 a. Equipment and Facilities The chamber shall be capabl

30、e of maintaining the specified temperature in the working space within the tolerances as specified. Forced air circulation may be used to maintain homogeneous conditions. b. Test Setup and Preparation Mount the DUTs in the chamber, orientation should allow weights to hang freely. c. Operation 1. Pow

31、er up chamber and stabilize at Tmax and expose the DUTs for 500 hours. 2. When the test is complete return chamber to ambient conditions and perform the required Functional and Visual evaluations as specified in section 3.5.1 and 3.5.2. 4.3 Low Temperature Exposure Applicable standard: ISO 16750 a.

32、Equipment and Facilities The chamber shall be capable of maintaining the specified temperature in the working space within the tolerances as specified. Forced air circulation may be used to maintain homogeneous conditions. b. Test Setup and Preparation Mount the DUTs in the chamber, orientation shou

33、ld allow weights to hang freely. c. Operation 1. Power up chamber and stabilize at Tmin and expose the DUTs for 500 hours. 2. When the test is complete return chamber to ambient conditions and perform the required Functional and Visual evaluations as specified in section 3.5.1 and 3.5.2. SAE/USCAR-4

34、0 Revision 1 Revised 2015-04 LEAD-FREE SOLDER VALIDATION TEST PLAN - 8 - 4.4 Humidity With Temperature Applicable standard: ISO 16750 a. Equipment and Facilities. The chamber shall be capable of maintaining the specified temperature in the working space within the tolerances as specified. Forced air

35、 circulation may be used to maintain homogeneous conditions. b. Test Setup and Preparation. Mount the DUTs in the chamber. c. Operation. 1. Power up chamber and stabilize at 50 C and 90% humidity, expose the DUTs for 336 hours, non- condensing. 2. When the test is complete return chamber to ambient

36、conditions perform the required Functional and Visual evaluations as specified in section 3.5.1 and 3.5.2. 4.5 Temperature Cycle Applicable standard: ISO 16750 a. Equipment and Facilities. The chamber shall be capable of maintaining the specified temperature in the working space within the tolerance

37、s as specified. Forced air circulation may be used to maintain homogeneous conditions. b. Test setup and preparation. Mount the DUTs in the chamber. c. Operation. 1. Power up chamber and cycle between the temperatures -40C and +90C as indicated in the table below and expose the DUTs for thirty cycle

38、s. 2. When the test is complete return chamber to ambient conditions perform the required Functional and Visual evaluations as specified in section 3.5.1 and 3.5.2. 20480904109030020210-40150-4060200Temp., CTime, minSAE/USCAR-40 Revision 1 Revised 2015-04 LEAD-FREE SOLDER VALIDATION TEST PLAN - 9 -

39、4.6 Vibration Test Reference the OEMs specific vibration profile and procedures as detailed in the SOW. 4.7 Power Cycle at Cold Applicable standard: ISO 16750 a. Equipment and Facilities. The chamber shall be capable of maintaining the specified temperature in the working space within the tolerances

40、 as specified. Forced air circulation may be used to maintain homogeneous conditions. b. Test Setup and Preparation. Mount the DUTs in the chamber. c. Operation. 1. Power up chamber and stabilize at -40 C., 2. Power on at Vn for 10 minutes. 3. Power off and allow glass temp at terminals to reach -40

41、C. 4. Repeat for 1000 cycles. 5. When the test is complete return chamber to ambient conditions perform the required Functional and Visual evaluations as specified in section 3.5.1 and 3.5.2. 4.8 Continuous Power On a. Load parts as defined above at room ambient. Record starting temperature. Power o

42、n for 100 hours continuous. b. After 24 hours perform the required Functional and Visual evaluations as specified in section 3.5.1 and 3.5.2. 5. REVISION HISTORY Date Revision Number + Description (2/6/2015) Corrected section 4.7(TBD)and section 4.8 This Test Plan is approved with the following corrections and/or added conditions: