SAE AMS 2425F-2012 Plating Gold for Thermal Control《电镀、热控制用黄金》.pdf
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1、_ SAE Technical Standards Board Rules provide that: “This report is published by SAE to advance the state of technical and engineering sciences. The use of this report is entirely voluntary, and its applicability and suitability for any particular use, including any patent infringement arising there
2、from, is the sole responsibility of the user.” SAE reviews each technical report at least every five years at which time it may be reaffirmed, revised, or cancelled. SAE invites your written comments and suggestions. Copyright 2012 SAE International All rights reserved. No part of this publication m
3、ay be reproduced, stored in a retrieval system or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of SAE. TO PLACE A DOCUMENT ORDER: Tel: 877-606-7323 (inside USA and Canada) Tel: +1 724-776-4970 (outside U
4、SA) Fax: 724-776-0790 Email: CustomerServicesae.org SAE WEB ADDRESS: http:/www.sae.org SAE values your input. To provide feedback on this Technical Report, please visit http:/www.sae.org/technical/standards/AMS2425F AEROSPACE MATERIAL SPECIFICATION AMS2425 REV. F Issued 1966-03 Reaffirmed 2006-09 Re
5、vised 2012-12 Superseding AMS2425E Plating, Gold for Thermal Control RATIONALE AMS2425F results from a Five Year Review and update of this specification and adds ordering information consistent with other AMS plating specifications. NOTICE ORDERING INFORMATION: The following information shall be pro
6、vided to the plating processor by the purchaser. Purchase order shall specify not less than the following: AMS2425F. Plating thickness desired (3.4.2) and minimum thickness on internal surfaces, if required (3.4.2.4) Basis metal to be plated Tensile strength or hardness of the basis metal Pre-plate
7、stress relief to be performed by plating processor (time and temperature) if different from 3.1.1 Special features, geometry or processing present on parts that requires special attention by the plating processor Hydrogen embrittlement relief to be performed by plating processor (parameters or refer
8、ence document) if different from 3.3 Periodic testing frequency and sample quantity, if different from 4.2.2 and 4.3.3. Quantity of pieces to be plated Parts manufacturing operations such as heat treating, forming, joining and media finishing can affect the condition of the substrate for plating, or
9、 if performed after plating, could adversely affect the plated part. The sequencing of these types of operations should be specified by the cognizant engineering organization or purchaser and is not controlled by this specification. SAE AMS2425F Page 2 of 8 1. SCOPE 1.1 Purpose This specification co
10、vers the requirements for gold deposited on metal surfaces and the properties of the deposit. 1.2 Application This process has been used typically for passive thermal control applications where high reflectance and low absorptance of solar radiation are required, but usage is not limited to such app
11、lications. 2. APPLICABLE DOCUMENTS The issue of the following documents in effect on the date of the purchase order forms a part of this specification to the extent specified herein. The supplier may work to a subsequent revision of a document unless a specific document issue is specified. When the
12、referenced document has been cancelled and no superseding document has been specified, the last published issue of that document shall apply. 2.1 ASTM Publications Available from ASTM International, 100 Barr Harbor Drive, P.O. Box C700, West Conshohocken, PA 19428-2959, Tel: 610-832-9585, www.astm.o
13、rg. ASTM B 117 Operating Salt Spray (Fog) Testing Apparatus ASTM B 253 Preparation of Aluminum Alloys for Electrodeposition ASTM B 487 Measurement of Metal and Oxide Coating Thicknesses by Microscopical Examination of a Cross Section ASTM B 499 Measurement of Coating Thicknesses by the Magnetic Meth
14、od: Nonmagnetic Coatings on Magnetic Basis Metals ASTM B 504 Measurement of Thickness of Metallic Coatings by the Coulometric Method ASTM B 567 Measurement of Coating Thickness by the Beta Backscatter Method ASTM B 583 Porosity in Gold Coatings on Metal Substrates 2.2 ANSI Publications Available fro
15、m American National Standards Institute, 25 West 43rd Street, New York, NY 10036-8002, Tel: 212-642-4900, www.ansi.org. ANSI B46.1 Surface Texture 3. TECHNICAL REQUIREMENTS 3.1 Preparation 3.1.1 Ferrous parts having a hardness higher than 40 HRC and which have been ground after heat treatment shall
16、be cleaned to remove surface contamination and suitably stress relieved before preparation for plating. Temperatures to which parts are heated shall be such that maximum stress relief is obtained without reducing hardness of parts below drawing limits, but unless otherwise specified not less than 27
17、5 F (135 C) for not less than 5 hours for parts having hardness of 55 HRC or higher or not less than 375 F (191 C) for not less than 4 hours for other parts. SAE AMS2425F Page 3 of 8 3.1.2 Texture of surfaces to be plated, prior to cleaning, shall be not rougher than 32 microinches (0.8 m), determin
18、ed in accordance with ANSI B46.1. Light abrasive blasting and polishing are permitted to improve surface finish to produce a high luster. 3.1.3 Parts shall have clean surfaces free of waterbreak prior to immersion in the plating solution. 3.1.4 Except for barrel plating electrical contact points sha
19、ll be as follows: For parts which are to be plated all over, locations shall be acceptable to purchaser; for parts which are not to be plated all over, locations shall be in areas on which plating is not required or is optional. 3.2 Procedure Parts shall be plated in the following sequence using sui
20、table plating solutions. A zincate immersion coating treatment in accordance with ASTM B 253 shall be applied to aluminum or aluminum alloys prior to plating. Copper Flash or Strike Nickel Plate Gold Plate 3.2.1 Copper Flash or Copper Strike A copper flash or copper strike shall be electrodeposited
21、from a suitable copper plating bath except as exempted in 3.2.1.1, 3.2.1.2, and 3.2.1.3. 3.2.1.1 A nickel flash or nickel strike shall replace the copper strike when the basis metal is corrosion- resistant steel. The nickel flash or nickel strike shall be electrodeposited from a suitable nickel plat
22、ing solution. 3.2.1.2 The copper strike may be omitted when the substrate is copper or a copper alloy containing less than 15% zinc. 3.2.1.3 Parts that have been zincated do not require a copper flash or strike. 3.2.2 Nickel Plate The nickel plate shall be deposited directly onto the copper strike o
23、r flash or, when specified as in 3.2.1.1, onto the nickel strike or flash. Either electroplating or electroless nickel processing is permitted. 3.2.3 Gold Plate Shall be electrodeposited from a suitable gold plating solution directly onto the nickel surface. 3.2.4 Rinsing The plated part shall be re
24、moved from the plating solution and shall be thoroughly rinsed by immersion for not less than 15 minutes in water at not lower than 180 F (82 C) and dried. 3.2.4.1 Plated springs may be removed from the plating racks after rinsing provided they are not flexed prior to embrittlement relief. 3.3 Hydro
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