SAE AIR 5271-2002 A Guideline for Application of High-Density Fiber Optic Interconnects to Aerospace Platforms《纤维光导互连器在航空平台上的应用指南》.pdf
《SAE AIR 5271-2002 A Guideline for Application of High-Density Fiber Optic Interconnects to Aerospace Platforms《纤维光导互连器在航空平台上的应用指南》.pdf》由会员分享,可在线阅读,更多相关《SAE AIR 5271-2002 A Guideline for Application of High-Density Fiber Optic Interconnects to Aerospace Platforms《纤维光导互连器在航空平台上的应用指南》.pdf(116页珍藏版)》请在麦多课文档分享上搜索。
1、AIR5271Issued 2002-06A Guideline for Application of High-Density Fiber Optic Interconnects to Aerospace PlatformsFOREWORDThis document details various aspects of a Generation II high-density fiber optic interconnect system and related interface and installation hardware concepts for aircraft applica
2、tions. The currently utilized Generation I fiber optic interconnect hardware, represents an extension or duplication of existing aircraft electrical cabling and connector technology to fiber optic media. It is therefore desirable to consider at the outset guidelines for an advanced high density inte
3、rconnect system based on emerging technology concepts so that avionics interconnect systems can accommodate growth as the technology matures. This high-density interconnect will represent a revolutionary advance in interconnect systems based on optical fibers unique performance characteristics. The
4、concept should be compatible with all advanced aerospace system concepts including “fly-by-light”, broadband multimedia networks such as passenger entertainment systems, advanced avionics computer interconnects (e.g. optical backplanes) and “smart structures”. The vision is to attain a “mobile vehic
5、le information distribution system” analogous to the “premises distribution systems” provided for buildings where all elements of a fiber optic interconnect are designed for compatibility and interchangeability.This guideline addresses industry and government concerns with the affordability of first
6、 generation of interconnect hardware in order to provide solutions for improved second-generation hardware. This second-generation hardware should take into account advanced commercial network and “fly-by-light” systems implementation as well as recent technology advances by the commercial photonics
7、 industry. It is proposed that existing and planned industry wide consortia and working groups be used to provide input for this interconnect system for future military and aerospace applications since expertise from many disciplines and diverse organizations is required to arrive at workable soluti
8、ons. It is also proposed that the automotive community participate in this effort to gain the economy-of-scale which can be achieved by possible dual-use aerospace/automotive application. Contributions and suggestions have been supplied by attendees of the AS-3C meetings held from October 1992 throu
9、gh April 1999.AEROSPACE INFORMATION REPORT Reaffirmed 2009-03SAE Technical Standards Board Rules provide that: “This report is published by SAE to advance the state of technical and engineering sciences. The use of this report is entirely voluntary, and its applicability and suitability for any part
10、icular use, including any patent infringement arising therefrom, is the sole responsibility of the user.” SAE reviews each technical report at least every five years at which time it may be reaffirmed, revised, or cancelled. SAE invites your written comments and suggestions. Copyright 2009 SAE Inter
11、national All rights reserved. No part of this publication may be reproduced, stored in a retrieval system or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of SAE. TO PLACE A DOCUMENT ORDER: Tel: 877-606-7
12、323 (inside USA and Canada) Tel: 724-776-4970 (outside USA) Fax: 724-776-0790 Email: CustomerServicesae.org SAE WEB ADDRESS: http:/www.sae.org SAE values your input. To provide feedbackon this Technical Report, please visit http:/www.sae.org/technical/standards/AIR5271SAE AIR5271- 2 -TABLE OF CONTEN
13、TS1. SCOPE 62. AVAILABLE REFERENCE DOCUMENTS .62.1 Sources For Reference Documents 72.2 Definitions .82.3 First Generation Fiber Optic Interconnect Constraints 92.4 System Requirements .102.5 Fiber Optic High-Density Cable Plant Benefits .113. ADVANCED INTERCONNECT/HARNESS REQUIREMENTS .114. EMERGIN
14、G TECHNOLOGY TRENDS 124.1 Optical Fibers For High-Density Cables 134.1.1 Glass Fibers 144.1.2 Plastic Optical Fibers (POF) 154.1.3 Hard Clad Silica Fibers .184.1.4 Radiation Hardness 184.2 Optical Fiber Physical Properties 204.3 Optical Properties of Fibers .204.4 Fiber Optic Ribbon Cable Constructi
15、on .214.4.1 Encapsulated Fiber Optic Ribbon Cables .214.4.2 Non-encapsulated Fiber Optic Ribbon Cables 224.4.3 Fiber Optic Ribbon Cable Physical Properties 224.4.4 Stacked Fiber Optic Ribbon Cables 244.4.5 Suggested Cable Test Procedures 264.5 High Density Fiber Optic Termination Concepts .264.5.1 F
16、iber Optic Termini Properties .304.5.2 High Density Fiber Optic Cable Connectors .374.5.3 High-density Connector Backshell Properties 374.6 Silicon Compatible Integrated Optic Devices 384.6.1 Pyrolytically Deposited Silica Waveguide Couplers 394.6.2 Microchip Couplers Fabricated By The Sol-Gel Metho
17、d .40SAE AIR5271- 3 -TABLE OF CONTENTS (Continued)4.6.3 Properties of Planar Waveguide Couplers 424.6.4 Active Silicon Optical Circuits 424.7 Optical Backplane Interconnect 444.7.1 Optical Backplane Construction 454.7.2 Optical Backplane Parameters 574.8 Opto-Electronic Source/Detector Devices and P
18、ackaging 584.8.1 Edge Emitting Hetero-junction Lasers .594.8.2 Vertical Cavity Surface Emitting Lasers (VCSELS) .604.8.3 Micro-chip Lasers 674.8.4 External Modulators 684.8.5 Modal Noise 73 4.9 Switching Mechanisms .744.9.1 Smart Pixels 744.9.2 Electro-Mechanical Switching .754.9.3 All Optical Switc
19、hing 755. OPTICAL AMPLIFIERS .765.1 Erbium Doped Fiber Amplifiers (EDFA) .765.2 Semiconductor Optical Amplifiers (SOA) .785.3 Comparison of SOA And EDFA Performance .786. AIRCRAFT INSTALLATION 796.1 Conduit Enclosed Cables 796.2 Stand Alone Cable 806.3 Air Blown Fiber (ABF) .816.4 Splicing .826.5 Br
20、anching And Break-Out Techniques 886.6 Fasteners Or Tie-Down Techniques 886.7 Installation and Repair Tools .887. TIME DIVISION MULTIPLEXED NETWORK TOPOLOGIES 897.1 Linear Network Topology .897.2 Star Network Topology 917.3 Ring Network Topology .917.4 Mesh Network Topology 927.5 Switched Network To
21、pologies .927.6 Shunted Ring “Skip-A-Node” Topology .93SAE AIR5271- 4 -TABLE OF CONTENTS (Continued)8. BROADBAND NETWORKS 938.1 Sub-Carrier Modulation .948.2 Wavelength Division Multiplexing (WDM) .958.3 Broadband Network Topologies 978.3.1 Broadband Ring Topology .988.3.2 Broadband Star Topology 99
22、9. BUILT-IN-TEST CONCEPTS .1029.1 Diagnostic Requirements 1049.1.1 Fault Detection 1049.1.2 Fault Containment .1059.1.3 Fault Isolation 1059.1.4 Fault Prediction .1059.1.5 Fault Isolation Methods .1069.2 Functional Element Module .1069.2.1 Interconnect Fabric Module .1069.2.2 Optical Backplane .1069
23、.2.3 Intra-Rack Harness And Inter-Rack Harness 1079.3 Transmitter/Monitor And Receiver/Stimulator .10710. TEST EQUIPMENT AND MAINTENANCE 10911. ADVANCED INTERCONNECT CONCLUSIONS AND RECOMMENDATIONS .109APPENDIX A REFERENCE SOURCES 110APPENDIX B LIST OF FIGURES .114SAE AIR5271- 5 -ACKNOWLEDGEMENTSCON
24、TRIBUTING COMMITTEE MEMBERSThe following individuals submitted data inputs, graphics and hardware pictorials and gave committee presentations which directly contributed to AIR5271:The following individuals participated in the preparation and editing of AIR5271:Drew GlistaChairman, AS3-CRick Allison
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