REG GSFC-EEE-INST-002 REV A-2003 Instructions for EEE Parts Selection Screening Qualification and Derating Incorporated Addendum 1 April 2008 [ GSFC GSFC-EEE-INST-002 REV A GSFC GSRE.pdf
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1、NASA/TP2003212242EEE-INST-002: Instructions for EEE Parts Selection, Screening, Qualification, and Derating Prepared by: Dr. Kusum Sahu Reviewed by: Dr. Henning Leidecker Approved by: Darryl LakinsApril 2008, Incorporated Addendum 1National Aeronautics and Space Administration Goddard Space Flight C
2、enter Greenbelt, Maryland 20771 May 2003 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-ENCLOSURE 1: Addendum 1 for GSFC EEE-INST-002 Connector Section C2, General Section, added new paragraphs 5), 6), and 7) on Page 2. 5) Prohibited connectors. The
3、 following connectors are prohibited for Level 1 and Level 2 applications. The following connectors are not recommended for Level 3 applications. The screening and qualification tables that follow do not apply to connectors listed as prohibited. a. CompactPCI connectors and 2.0mm Hard Metric connect
4、ors, as well as other connector designs (e.g. Eurocard, VME) with flat bifurcated “tuning fork” type female contacts. b. Other connector contact systems having two (2) points of contact engagement, or less, that do not utilize a military style hood “clamping” mechanism to support female contact enga
5、gement tines. c. Connectors with compliant pin “press fit” terminations to flight boards. d. MIL-DTL-55302/ 131 through 134 Eurocard type PWB connectors e. MIL-DTL-55302/ 157 i.e., a grade 1 part is consistent with reliability level 1. Levels of part reliability confidence decrease by reliability le
6、vel, with level 1 being the highest reliability and level 3 the lowest. A reliability level 1 part has the highest level of manufacturing control and testing per military or DSCC specifications. Level 2 parts have reduced manufacturing control and testing. Level 3 Parts have no guaranteed reliabilit
7、y controls in the manufacturing process and no standardized testing requirements. The reliability of level 3 parts can vary significantly with each manufacturer, part type and LDC due to unreported and frequent changes in design, construction and materials. GSFC projects and contractors shall incorp
8、orate this guideline into their Project EEE Parts Program. 3.0 DEFINITIONS Screening. Screening tests are intended to remove nonconforming parts (parts with random defects that are likely to result in early failures, known as infant mortality) from an otherwise acceptable lot and thus increase confi
9、dence in the reliability of the parts selected for use. Qualification. Qualification testing consists of mechanical, electrical, and environmental inspections, and is intended to verify that materials, design, performance, and long-term reliability of the part are consistent with the specification a
10、nd intended application, and to assure that manufacturer processes are consistent from lot to lot. Derating. Derating is the reduction of electrical and thermal stresses applied to a part during normal operation in order to decrease the degradation rate and prolong its expected life. Provided by IHS
11、Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-Source Control Drawing (SCD) - Provides an engineering description (including configuration, part number, marking, reliability, environmental, functional / performance characteristics), qualification requirements and
12、acceptance criteria for commercial items or vendor developed items procurable from a specialized segment of industry that provides for application critical or unique characteristics. Vendor Item Control Drawing (Formerly known as Specification Control Drawing) - Provides an engineering description (
13、including configuration, performance, reliability, environmental, functional characteristics) and acceptance criteria for commercial or vendor developed items that are procurable from a specialized segment of industry. The drawing is used to provide an administrative control number, but the item is
14、marked with the vendors part number. NOTE: For the purposes of this EEE Part Instruction document, in the Screening and Qualification tables, the term SCD is used to convey any user developed EEE part procurement control document whether Source Control Drawing or Vendor Item Control Drawing, regardl
15、ess of qualification requirement. 4.0 REFERENCES The following documents, of the issue in effect when this document is used, form a part of this document to the extent specified herein. GSFC Documents GPG 1310.1 Customer Agreements GPG 1440.1 Control of Quality Records GPG 7120.2 Project Management
16、S-311-M-70 Specifications for Destructive Physical Analysis (DPA) NASA Documents NPD 8730.2 NASA Parts Policy Military Standards MIL- STD-883 Test Method Standard, Microcircuits MIL- STD-750 Test Methods for Semiconductor Devices MIL-STD-202 Test Method Standard, Electronic and Electrical Component
17、Parts MIL-STD-1580 Test Method Standard, Destructive Physical Analysis for EEE Parts Industry Standards ASTM E595 Standard Test Methods for Total Mass Loss and Collected Volatile Condensable Materials From Outgassing in a Vacuum Environment 5.0 IMPLEMENTATION The instructions in this document shall
18、be implemented when specified in GSFC space projects Statements of Work (SOWs), Mission Assurance Requirements (MARs), or their equivalents. Hereafter, any use of the word “requirement” assumes compliance to this document is mandatory. Section 1 EEE-INST-002 Instructions for All Part Categories Page
19、 2 of 12 5/03 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-5.1 Part Type Categories The instructions for each part type category have been developed by the parts specialists with experience in working on a large number of GSFC projects. These inst
20、ructions and the Federal Source Code (FSC) are specified in the following sections of this document: Part Type Document Section Parts Specialists FSC General Instructions for All Part Categories 1 Dr. Kusum Sahu kusum.k.sahunasa.gov N/A Capacitors C1 Tom Duffytduffypop300.gsfc.nasa.gov 5910 Connecto
21、rs and Contacts C2 Terry King tkingpop300.gsfc.nasa.gov 5935 Crystals C3 Gerard F. Kiernan 5955 Crystal Oscillators C4 Gerard F. Kiernan 5955 Fiber Optics, Passive Dr. Tracee Jamison tracee.l.jamisonnasa.govMarcellus Proctor marcellus.a.proctornasa.gov 60GP Filters F2 Tom Duffytduffypop300.gsfc.na
22、sa.gov 5915 Fuses F3 Thom Perrytperrypop300.gsfc.nasa.gov 5920 Heaters H1 Tom Duffytduffypop300.gsfc.nasa.gov 4520 Magnetics M1 Gerard F. Kiernan 5950 Microcircuits, Hybrid M2 Ashok Sharma ashok.k.sharmanasa.gov 5962 Microcircuits, Monolithic M3 Susan Ritter ritterspop500.gsfc.nasa.gov 5962 Microci
23、rcuits, Plastic Encapsulated (PEMs) M4ateverovpop300.gsfc.nasa.gov 5962 Relays, Electromagnetic R1 Thom Perry tperrypop300.gsfc.nasa.gov 5945 Resistors R2 Thom Perrytperrypop300.gsfc.nasa.gov 5905 Semiconductor Devices, Discrete S1 Dennis Krus dkruspop300.gsfc.nasa.gov 5961 Switches S2 Terry Kingtki
24、ngpop300.gsfc.nasa.gov 5930 Thermistors T1 Thom Perrytperrypop300.gsfc.nasa.gov 5905 Wire and Cable W1 Terry King tkingpop300.gsfc.nasa.gov 6145 Section 1 EEE-INST-002 Instructions for All Part Categories Page 3 of 12 5/03 Dr. Alexander TeverovskyProvided by IHSNot for ResaleNo reproduction or netwo
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