NAVY NAV MIL-HDBK-1015 2-1989 CHEMICAL ENGINEERING《化学工程》.pdf

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1、3535789 0306289 255 MIL-HDBK-1015/2 31 MAY 1989 MILITARY HANDBOOK CHEMICAL ENGINEERING ELECTROPLATING TECHNICAL SYNOPSIS AMSC NIA DISTRIBUTION STATEMENT A. APPROVED FOR PUBLIC RELEASE: DISTRIBUTION IS UMLIMITED AREA FACR . 15.56 Provided by IHSNot for ResaleNo reproduction or networking permitted wi

2、thout license from IHS-,-,-THIS PAGE INTENTIONALLY LEFT BLANK W 3535787 0306290 T77 MIL-HDBK-1015/2 ii i557 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-3515789 0306293 903 MIL-HDBK-1015/2 ABSTMCT The purpose of this handbook is to assist managers

3、 responsible for Navy electroplating shop designs to select alternative process technologies. reviews several aspects of electroplating and assesses the application of certain technology alternatives to specific plating processes commonly used at Navy facilities, factors including: in-process contro

4、ls to minimize hazardous waste generation and water use, end-of-pipe treatment alternatives, space and logistic considerations (tank layouts, shop configurations), and selected process mechanisms (tank materials, bath purification, ventilation). It The primary emphasis of this handbook is environmen

5、tal iii Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-.= 3515789 0106292 84T = MIL-HDBK-1015/2 THIS PAGE INTENTIONALLY LEFT BLANK F 1559 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-Y W 3515789 0

6、106293 786 W MIL-HDBK-1015/2 FOREWORD This handbook has been developed from an evaluation of facilities in the shore establishment, from surveys of the availability of new materials and construction methods, and from selection of the best design practices of the Naval Facilities Engineering Command

7、(NAVFACENGCOM), other Government agencies, and the private sector. This handbook was prepared using, to the maximum extent feasible, national professional society, association, and institute standards. Deviations from these criteria in the planning, engineering, design, and construction of Naval sho

8、re facilities cannot be made without prior approval of NAVFACENGCOM HQ Code 04. Design cannot remain static any more than can the functions it serves or the technologies it uses. Accordingly, recommendations for improvement are encouraged and should be furnished to Commander, Naval Facilities Engine

9、ering Command (Code 04), 200 Stovall Street, Alexandria, VA 22332-2300; telephone (202) 325-0450. THIS HANDBOOK SHALL NOT BE USED AS A REFERENCE DOCUMENT FOR PROCUREMENT OF FACILITIES CONSTRUCTION. IT IS TO BE USED IN THE PURCHASE OF FACILITIES ENGINEERING STUDIES AND DESIGN (FINAL PLANS, SPECIFICAT

10、IONS, AND COST ESTIMATES). DO NOT REFERENCE IT IN MILITARY OR FEDERAL SPECIFICATIONS OR OTHER PROCUREMENT DOCUMENTS. V Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-W 3535789 0306294 bL2 MIL-HDBK-1015/2 CHEMICAL ENGINEERING CRITERIA MANUALS Criteri

11、a Manual Title MIL-HDBK-1015/1 Electroplating Facilities MIL-HDBK-1015/2 Chemical Engineering, Electroplating Technical Synopsis vi - PA HDQTRS HDQTRS a b a c Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-= 3535789 030b295 559 Section 1 1.1 MIL-HDB

12、K-1015/2 CHEMICAL ENGINEERING. ELECTROPLATING TECHNICAL SYNOPSIS TABLE OF CONTENTS .Pase Section 2 2.1 2.2 2.2.1 2.2.2 2.2.2.1 2.2.2.2 2.2.2.3 2.2.2.4 2.3 2.3.1 2.3.2 2.3.3 2.3.4 2.4 2.4.1 2.4.1.1 2.4.1.2 2.4.1.3 2.4.1.4 2.4.1.5 2.4.1.6 2.4.2 2.4.2.1 2.4.2.2 2.4.2.3 2.5 Section 3 3.1 3.2 3.2.1 3.2.2

13、 3.3 3.4 3.4.1 3.4.2 3.4.3 3.4.4 3.4.5 3.4.6 3.4.7 INTRODUCTION Scope . 1 TABULATION OF TECHNOLOGY ALTERNATIVES General . 5 5 5 5 6 6 7 7 Space and Logistics . Shop Configurations . Tank Layouts Common Well Configuration . Common Well Configuration Plus Transfer Straight Line Configuration Circle Co

14、nfiguration Selected Process Mechanics . 11 Tank Construction Materials 11 TankLinings 11 Bath Purification 11 Ventilation . 11 In-Process Waste Control 11 Water Reduction Methods . 12 Proper Rinse Tank Design and Operation . 12 Rinsing 26 Water Conservation Through Reactive Rinsing 27 Chemicals . 2

15、7 Rinsing 27 Cost of Reactive Rinsing Applications . 27 Waste Reduction Methods . 29 Single Drag-out Tanks 29 Multiple Drag-out Tanks . 34 High Technology Controls 35 End-of-Pipe Treatment . 37 Water Conservation Through .Countercurrent Using Reactive Rinsing To Save Water and Conserve Improving Rin

16、sing Efficiency Through Reactive PROCESS RECOMMENDATIONS General . Space and Logistics . Low Production Shops Moderate to High Production Shops Process Mechanics Pollution Control Alkaline Cleaning Acid Cleaning Black Oxide . Cadmium Plating Chromium Plating (Hard) . Copper Plating . Anodizing 41 41

17、 41 . 41 41 41 42 42 42 42 55 55 55 vi i i462 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-3.4.8 3.4.9 3.4.10 3.4.11 3.4.12 Appendix A B C Figure 1 2 3 4 5 6 Table 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 3535789 OLOb29b 495 MIL-HDBK-101

18、5/2 Nickel Plating . Phosphate Coating Silver Plating . Zincate . Zincplating APPENDICES Examples of Existing Navy Plating Shop Configurations Surface Preparation Procedures for Common Materials . Plating and Coating Procedures . FIGURES Common Well Tank Layout . Common Well Plus Transfer Tank Layou

19、t Big Circle Tank Layout . Proper Rinse Tank Design Intraprocess Reactive Rinsing Example of Interprocess Reactive Rinsing System . TABLES Plating Processes at Naval Facilities Plating Tank Construction Materials . Process Mechanics: Bath Purification Process Mechanics: Ventilation . General Waste R

20、eduction Technologies Water Reduction Methods . Waste Reduction Methods . End-of-Pipe Treatment Technologies . Common Navy Electroplating Process and Solution Characteristics Recommendations For Process Mechanisms . Pollution Control Recommendations: Anodizing (Chromium or Sulfuric) Pollution Contro

21、l Recommendations: Black Oxide . Pollution Control Recommendations: Cadmium Cyanide Pollution Control Recommendations: Chrome (Hard) Pollution Control Recommendations: Chromate . Pollution Control Recommendations: Nickel Pollution Control Recommendations: Phosphate . . Pollution Control Recommendati

22、ons: Silver Cyanide Pollution Control Recommendations: Zinc . Pollution Control Recommendations: Zincate . viii 1563 Pane 56 56 56 56 56 57 63 65 8 9 10 25 28 30 2 13 14 16 20 22 31 38 43 45 46 47 48 49 49 50 51 52 53 54 Provided by IHSNot for ResaleNo reproduction or networking permitted without li

23、cense from IHS-,-,-m 351,5749 OI,OW 321, m CHEMICAL ENGINEERING. ELECTROPLATING TECHNICAL SYNOPSIS TABLE OF CONTENTS Pape Section 1 INTRODUCTION 1.1 Scope . 1 Sect ion I* a 2 2.1 2.2 2.2.1 2.2.2 2.2.2.1 2.2.2.2 2.2.2.3 2.2.2.4 2.3 2.3.1 2.3.2 2.3.3 2.3.4 2.4 2.4.1 2.4.1.1 2.4.1.2 2.4.1.3 2.4.1.4 2.4

24、.1.5 2.4.1.6 2.4.2 2.4.2.1 2.4.2.2 2.4.2.3 2.5 Section 3 3.1 3.2 3.2.1 3.2.2 3.3 3.4 3.4.1 3.4.2 3.4.3 3.4.4 3.4.5 3.4.6 3.4.7 TABULATION OF TECHNOLOGY ALTERNATIVES General . Space and Logistics . Shop Configurations . Tank Layouts Common Well Configuration . Straight Line Configuration Circle Confi

25、guration Selected Process Mechanics . Tank Construction Materials TankLinings Bath Purification Ventilation . In-Process Waste Control Water Reduction Methods . Water Conservation Through Countercurrent Common Well Configuration Plus Transfer Proper Rinse Tank Design and Operation Water Conservation

26、 Through Reactive Rinsing . Rinsing Using Reactive Rinsing To Save Water and Conserve Chemicals . Improving Rinsing Efficiency Through Reactive Rinsing Cost of Reactive Rinsing Applications . Waste Reduction Methods . Single Drag-out Tanks Multiple Drag-out Tanks . High Technology Controls End-of-Pi

27、pe Treatment . 5 5 5 5 6 6 7 7 11 11 11 11 11 11 12 12 26 27 27 27 27 29 29 34 35 37 PROCESS RECOMMENDATIONS General . Space and Logistics . Low Production Shops Moderate to High Production Shops Process Mechanics Pollution Control Alkaline Cleaning Acid Cleaning Anodizing Black Oxide . Cadmium Plat

28、ing Chromium Plating (Hard) . Copper Plating . 41 41 41 . 41 41 41 42 42 42 42 55 55 55 vii Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-35157b OLOb2b 2bb = MIL-HDBK-1015/2 3.4.8 Nickel Plating . 56 3.4.9 Phosphate Coating 56 3.4.10 Silver Plating

29、 . 56 3.4.11 ZincPlating 56 3.4.12 Zincate . 56 APPENDICES Appendix A B ti Figure 1 2 3 4 5 6 Table 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 19 20 ia Examples of Existing Navy Plating Shop Configurations 57 Surface Preparation Procedures for Common Materials . 63 Plating and Coating Procedures . 65

30、 FIGURES Common Well Tank Layout . 8 Common Well Plus Transfer Tank Layout 9 Big Circle Tank Layout . 10 Proper Rinse Tank Design 25 Intraprocess Reactive Rinsing 28 Example of Interprocess Reactive Rinsing System . 30 TABLES Plating Processes at Naval Facilities 2 Plating Tank Construction Material

31、s . 13 Process Mechanics: Bath Purification 14 Process Mechanics: Ventilation . 16 General Waste Reduction Technologies 20 Water Reduction Methods . 22 Waste Reduction Methods . 31 End-of-Pipe Treatment Technologies . 38 Common Navy Electroplating Process and Solution Characteristics 43 Recommendati

32、ons For Process Mechanisms . 45 Pollution Control Recommendations: Anodizing (Chromium or Sulfuric) 46 Pollution Control Recommendations: Black Oxide . 47 Pollution Control Recommendations: Cadmium Cyanide . 48 Pollution Control Recommendations: Chrome (Hard) . . 49 Pollution Control Recommendations

33、: Chromate . 49 Pollution Control Recommendations: Nickel 50 Pollution Control Recommendations: Phosphate 51 Pollution Control Recommendations: Silver Cyanide . 52 Pollution Control Recommendations: Zinc . 53 Pollution Control Recommendations: Zincate . 54 viii 1565 . Provided by IHSNot for ResaleNo

34、 reproduction or networking permitted without license from IHS-,-,-m 3535789 0306299 3T4 m MIL-HDBK-1015/2 Section 1: INTRODUCTION 1.1 Scope. This handbook provides design criteria for preparing an inventory of plating processes used by the Navy (refer to Table 1); tabulating information on space an

35、d logistics, selecting process mechanics, in-process waste controls and waste treatment technology alternatives; and, preparing specific technology recommendations for most common processes used by the Navy. 1 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from

36、IHS-,-,-= 3515789 0106300 746 = MIL-HDBK-1015/2 Table 1 Piati-:., Processes at Javal Facili- .?s COMMON METAL PLATING Brass Cadmium ;*I* Chromium/Hard imim Copper, Non-distinguished I Copper, Acid - Copper, Kanide i I*!* Decorative Chromium I/ I ei I I Lead I i i I* I Nickel, Non-distinguished i i i

37、 I _( I l I Nickel, Chloride Nickel, Sulfamate i i* * Nickel, Watts 1 19 I Nickel, Woods I . I I -. . . . I I I Zinc, Acid I I I Zinc/ Cyanide ! I- PRECIOUS METALS PLATING Gold I! i Silver, Cyanide Pl* *! I _i Silver, Non-cyanide ! I l I I i 4NODIZING I I Alodine I I I Anodizing I; Anodizing, Chromi

38、c 11 Anodizing, Suifuric Il Hardcoat, low temp. I _ I- i Macinesium I .- I SONVERSTION AND POST lREATMENT - - - Chromating o* 2 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-3535789 030630L 682 MIL-HDBK-1015/2 Table 1 Plating Processes a Naval Faci

39、lities -ont) . i (I I I Copper I I- mosphating, Non-distinguished I I 1-1 I I Phosphating, Hard 1-1 I Phosphating, Manganese 1-1- Phosphating, Zinc Seal, Ni Acetate Seal, Sodium Dichromate Zincate I I- ELECTROLESS PLATING I Nickel SURFACE PREPARATION Cleaning I Vapor Degreasing I I- ! Activation I I

40、- De-Rusting 0 Bright Dip 0 Etching 0 Coloring + I- I Magnesium Anodize II -I- I Metal Strips ll I Auminide I I- I Anodize I I- Chrome Cadmium Nickel I- * Brazed 0 Non-Brazed 0 I Plasma Sprayed I I- Paint Strip PaccivateStainless Phosphate, Acid Pickle I 3 Provided by IHSNot for ResaleNo reproductio

41、n or networking permitted without license from IHS-,-,-m 3535789 O306302 519 MIL-HDBK-1015/2 Table 1 Plating Processes at Naval Facilities (cont) i I i OTHER I- Brush Platina Diffusion, Nickel/Cadmium Metallizing 1 Non-cyanide cadmium o o o o a z W a 4 Provided by IHSNot for ResaleNo reproduction or

42、 networking permitted without license from IHS-,-,-3535789 O306303 455 MIL-HDBK-1015/2 Section 2: TABULATION OF TECHNOLOGY ALTERNATIVES 2.1 General a) Space and logistics. b) Selected process mechanics. c) In-process waste control d) End-of-pipe treatment. 2.2 Space and LoEistics. The location of a

43、plating shop in a Navy facility and its layout depends upon available space, number and type of processes, size and volume of work, and relationship to other manufacturing operations in the facility. There are no standard shop designs that fit all situations because the requirements and functions of

44、 a plating shop are varied. In general, the plating shop should be located convenient to the manufacturing operations in which the parts to be plated are worked. If the location of the plating shop does not affect work flow, the shop should be located convenient to utilities, ventilation, sewer coll

45、ections, Industrial Wastewater Treatment Plant (IWTP), or other peripherals. 2.2.1 Shop Confimrations. The major design elements to be considered in configuring a shop are as follows: z a) Areas receiving material to be plated. b) Systems to transport materials to and within plating departments. c)

46、Plating shop layout including racking/unracking, plating and rectifier areas. d) Ancillary plating areas for filtration, stripping, solution maintenance, and rack, anode, and chemical storage. e) Support areas for laboratory, offices, inspection, lockers, lunchroom, and restrooms. f) Utilities inclu

47、ding power, water, and waste treatment. Small errors in the design and location of support and staging areas have subtle impacts on production efficiency, but they can be as dramatic as more obvious errors such as missizing equipment or misapplying a process. For example, moving materials is time co

48、nsuming, may require special handling equipment and, as a result, is costly. Therefore, plants should be configured so that all materials; process chemicals, racks, anodes, and parts to be plated can be handled as infrequently and as quickly as possible. 2.2.2 Tank Layouts. Military plating shops often differ from private industry shops in the greater variety of processes that they provide including many which are highly specialized and used infrequently. mostly manual operations with some use of motor driven trolley hoists and Military shops are 5 Provided by IHSNot for Resa