NAVY MIL-HDBK-2164 A-1996 ENVIRONMENTAL STRESS SCREENING PROCESS FOR ELECTRONIC EQUIPMENT《电子设备环境压力屏蔽过程》.pdf
《NAVY MIL-HDBK-2164 A-1996 ENVIRONMENTAL STRESS SCREENING PROCESS FOR ELECTRONIC EQUIPMENT《电子设备环境压力屏蔽过程》.pdf》由会员分享,可在线阅读,更多相关《NAVY MIL-HDBK-2164 A-1996 ENVIRONMENTAL STRESS SCREENING PROCESS FOR ELECTRONIC EQUIPMENT《电子设备环境压力屏蔽过程》.pdf(45页珍藏版)》请在麦多课文档分享上搜索。
1、II1II1MIL-HDBK-2164A19 June 1996SUPERSEDINGMIL-HDBK-2164(SH)16 January 1996DEPARTMENT OF DEFENSEHANDBOOKENVIRONMENTM-J STRESS SCREENINGPROCESSFORELECTRONIC EQUIPMENTTHIS HANDBOOK IS FOR GUIDANCE ONLY. DO NOT CITE THIS DOCUMENTAS A REQUIREMENT.AMSC NIA AREA RELIProvided by IHSNot for ResaleNo reprodu
2、ction or networking permitted without license from IHS-,-,-,., _. - MIL-HDBK-2164AFOREWORD1. This handbook is approved for use by all Departments and Agenciesof the Department of Defense (DoD)2. This handbook is for guidance only. This handbook cannot becited as a requirement. If it is, the contract
3、or does not have to comply.3. The current emphasis on quality, reliability and hardware designintegrity has resulted in efforts to provide a sound and inherentlyreliable design. The increased complexity and density of packaging ofcontemporary electronic equipment amplifies the ever present problems
4、ofdetecting and correcting latent manufacturing defects. The occurrence of amalfunction incurs extremely high maintenance costs after the equipment hasbeen deployed. It is also important that laboratory testing be extensiveenough to prevent failure that would result in loss of life or mission.4. Thi
5、s handbook provides guidelines that will help in theEnvironmental Strese Screening (ESS) of electronic equipment so that latentdefects may be located and eliminated before the equipment is accepted. Ithas been written in compliance with the DoD Acquisition Reform Initiatives(ARI), Single PrOCeSe Ini
6、tiative (sPI), and the latest series of DoDacquisition directives.5. Beneficial connnents (recommendations, additions, deletionfi) andany pertinent data which may be of use in improving thie document should beaddressed to: Commander, Naval Sea Systems Conmnand, SEA 03R42, 2531Jefferson Davis Highway
7、, l+rlington, VA 22242-5160, by using the self-addressed Standardization Document Improvement Proposal (DD Fonn 1426)appearing at the end of this document or by letter. .iiProvided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-. .MIL-HDBK-2164AcONTENTS . .
8、. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.1.1 Purpose 1.2 Application to products 1.2.1 Large, heavy items .1.2.2 Contractual responsibility considerations. .2.2.1 General 2.2 Government documents .2.2.1 Specif icat ions, standarda, and handbooks 2.2.
9、2 Other Government documents, drawings, andpublications .2.3 Non-Governm6nt publications 2.4 Order of precedence 3.3.1 Definitions 3.2 Acronyms used in this handbook. 4.4.14.24.2.14.2.1.14.2. 1.24.2.1.34.2 .1.44.2.1.54.2.24.34.3.14.3.24.3.34.44.54.5.14.5.1.14.5.2General Screening conditions .General
10、 environmental guidelines. Standard ambient .Controlled ambient .Thermal screening tolerances .Vibration screening tolerances. Time .Accuracy of screening instrumentation calibration. .Screening facilities .Screening chamber Vibration apparatus Quality of air for supplementary cooled equipment. .Gen
11、eral instrumentation guidelines. Vibration screening guidelines. Screening fixture .Fixture checkout .Control excitation ”.iiiEAGEii111223333444446-777999910 1010101011111112121313Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-_. _,MIL-HDBK-2164ACON
12、TENTS4.64.74.7.14.7.24.7.34.8Performance monitoring guidelines. Failure reporting, analysis, and correction actionsystem (FRACAS )Failure during pre defect-free screening. .Failures during defect-free screening. Rescreening .Sampling 5.5.15.1.15.1.1.15.1.25.1.2.15.1.2.1.15.1.2.1.25.1.2.25.1.2.2.15.1
13、.2 .2.25.25.2.15.2.25.2 .2.15.2 .2.25.2.35.2.3.15.2 .3.1.15.2 .3.1.25.2 .3.25.3Environmental stresses. .Random vibration spectrum. Applied axis detemination. .Temperature cycling .Thermal survey Procedure for ambient-cooled equipment. .Procedure for supplementally cooled equipment. .Thermal screenin
14、g .Ambient cooled equipment Supplementally cooled equipment. Total ESS program .Documentation . Individual tests Examination of product. Initial operational test Environmental Screening. Fixed duration pre defect-free (PDF)screening. .Vibration .Thermal cycling .Defect-free (DF) screening Final func
15、tional operational tefit.6. 6.1 Intended use 6.2 Subject term (keyword) listing .1. Screen Development Process. .2. Environmental Stress Screening Constituents. 3. Random Vibration Spectrum. PAGE131313131414141414141517171819191920202020212121212122222222222815ivProvided by IHSNot for ResaleNo repro
16、duction or networking permitted without license from IHS-,-,-4A-1A-I.A-II.c-I.ABcMIL-HDBK-2164A .CONTESTemperature Cycling Profile for Ambient Cooled andSupplementary Cooled Equipment. .ESS Characteristics Curve .Values of PA for Various a and TPDF = TDFProbability of Rejections Due to Random Failur
17、efOr VariOus Values Of ElESSBenefits to Management ESS screening duration, reduced screening andsampling ESS troubleshooting plan. .Navy program management guidance. : PAGE1625282835233032vProvided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-. _MIL-HDBK-2
18、164A1. SCOPE1.1 OlzQcEe. This handbook provides guidelines for EnvironmentalStress Screening (ESS) of electronic equipment, including environmentalscreening conditions, durations of exposure, procedures, equipmentoperation, actions taken upon detection of defects, and screeningdocumentation. These g
19、uidelines provide for a uniform ESS process that maybe utilized for effectively disclosing manufacturing defects in electronicequipment caused by poor workmanship and faulty or marginal parts. It willalso identify design problems if the design is inherently fragile or ifqualification and reliability
20、 growth tests were too benign or notaccomplished. The most common stimuli used in ESS are temperature cyclingand random vibration. A viable ESS prcgram” must be dynamic; the screeningprogram must be actively managed, and tailored to the particularcharacteristics of the equipment being screened. It s
21、hould be noted thatthere are no universal screens applicable to all equipment.ESS is part of a viable engineering development, manufacturing correctiveaction and overhaul process rather than a test in the normal accept/reject8ense. Guidance in developing a screen can be found in figure 1. Thoseparti
22、cipating in the effort, including the contractor should never be ledto believe that a “failure” is bad andwould be held against them. ESS isintended to stimulate defects, not to simulate the operating environment,and therefore, factory failures are encouraged. The root causea of ESSfailures need to
23、be found and corrected before there is a complete process.This handbook cannot be cited as a requirement. If it ia, the contractordoes not have to comply.1.2 The process described herein msy beaPPlied to electronic assemblies, eqUiPment and systems, in six broadcategories as distinguished according
24、to their field service application:1233A3B456Fixed ground equipmentMobile ground vehicle equipmentShipboard equipmenta71 Sheltereda71 ExposedJet aircraft equipmentTurbo-propeller and rotary-wing aircraftEquipmentAir launched weapons and assembledexternal stores1Provided by IHSNot for ResaleNo reprod
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