JEDEC JESD30H-2017 Descriptive Designation System for Electronic-device Packages.pdf

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1、JEDEC STANDARD Descriptive Designation System for Electronic-device Packages JESD30H (Proposed Revision of JESD30G, January 2016) AUGUST 2017 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and approved through the J

2、EDEC Board of Directors level and subsequently reviewed and approved by the JEDEC legal counsel. JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of p

3、roducts, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally. JEDEC standards and publications are adopted without regard to whether or not th

4、eir adoption may involve patents or articles, materials, or processes. By such action JEDEC does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the JEDEC standards or publications. The information included in JEDEC standards and publicati

5、ons represents a sound approach to product specification and application, principally from the solid state device manufacturer viewpoint. Within the JEDEC organization there are procedures whereby a JEDEC standard or publication may be further processed and ultimately become an ANSI standard. No cla

6、ims to be in conformance with this standard may be made unless all requirements stated in the standard are met. Inquiries, comments, and suggestions relative to the content of this JEDEC standard or publication should be addressed to JEDEC at the address below, or refer to www.jedec.org under Standa

7、rds and Documents for alternative contact information. Published by JEDEC Solid State Technology Association 2017 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 This document may be downloaded free of charge; however JEDEC retains the copyright on this material. By downloading this

8、file the individual agrees not to charge for or resell the resulting material. PRICE: Contact JEDEC Printed in the U.S.A. All rights reserved PLEASE! DONT VIOLATE THE LAW! This document is copyrighted by JEDEC and may not be reproduced without permission. For information, contact: JEDEC Solid State

9、Technology Association 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 or refer to www.jedec.org under Standards-Documents/Copyright Information. JEDEC Standard No. 30H -i- DESCRIPTIVE DESIGNATION SYSTEM FOR ELECTRONIC-DEVICE PACKAGES Contents Foreword ii 1 Scope. 1 2 Terms and defin

10、itions 1 3 Descriptive designation system for electronic-device packages . 2 3.1 General 2 3.2 Field descriptions . 4 3.2.1 Package-outline-style codes 4 3.2.2 Terminal-position prefix 7 3.2.2 Terminal-position prefix (contd) . 8 3.2 Field descriptions (contd) 9 3.2.3 Package-body material 9 3.2.4 T

11、erminal shape suffix . 10 3.2.5 Terminal-count suffixes 13 3.2.6 Package pitch . 13 3.2.7 Supplemental-information field 13 3.2.8 Terminal Span and Terminal Spacing 14 3.2.9 Terminal Thickness 15 4 Other part detail . 16 4.1 Part access direction 16 4.2 Mounting preparation . 17 4.3 Body Direction 1

12、8 4.4 Part Entry UOM 19 5 New descriptive codes 19 Annex A (normative) Additional information on package, terminal position and shapes 20 Annex B (informative) Package classification . 63 Annex C (informative) Differences between JESD30H and its predecessors 64 Figures Figure 1 Descriptive designati

13、on system for electronic-device packages 3 Figure 2 Package View Representative 16 Figure 3 Packages that are Straight Mounted as received from Supplier 17 Figure 4 Prepped Packages prior to Assembly 17 Figure 5 Horizontal Body Direction 18 Figure 6 Vertical Body Direction 18 Tables Table 1 Package

14、Outline Style Codes 4 Table 2 Prefixes for lead (terminal) position 8 Table 3 Prefixes for predominant package-body material 9 Table 4 Codes for package-specific features 9 Table 5 Suffixes for lead form (or terminal shape) 11 Table A.1 Illustrations of Package Outline Styles 20 Table A.1.1 Illustra

15、tions of Extended Package Outline Styles 20 Table A.2 Terminal position with added definition 25 Table A.3 Suffixes for terminal shape with additional definition 54 Table A.4 Illustrations of terminal shape 57 JEDEC Standard No. 30H -ii- Foreword This standard establishes requirements for the genera

16、tion of electronic-device package designators for the JEDEC Solid State Technology Association. The requirements herein are intended to ensure that such designators are presented in as uniform a manner as practicablenullnullnullnull Example of how this standard can be used, is in defining the part i

17、n sufficient detail to enable process efficiencies during the part and product life cycles, i.e., design, purchasing, manufacturing, quality control, test, etc This release includes additional definition and clarification of the device to provide this support to the industry. The standard is designe

18、d to be scalable insofar that it should cover as many components as possible that are available in the market. It should also be scalable to encompass the emergence of new packages in the future. It is not intended to provide standardization for a limited number of parts, or the perceived common par

19、ts in the market, since this is impracticable to measure. Although this standard is considered to have international standardization implications, a complete comparison between the JEDEC standard and the international documents has not been made. This revision of the standard incorporates many new t

20、able entries and text emendations compared to JESD30G. The material contained in this standard was formulated by the JEDEC JC-11 Committee on Mechanical (Package Outlines) Standardization and approved by the JEDEC Board of Directors. In the next release, this standard will incorporate a standard XML

21、 structure to support Component Manufacturers in providing part data to their customers, utilizing these definitions herein. This document will be made available under JEP95, as a Standard Process Procedure, SPP-XXX, to be developed. .JEDEC Standard No. 30H Page 1 DESCRIPTIVE DESIGNATION SYSTEM FOR

22、ELECTRONIC-DEVICE PACKAGES From JEDEC Board Ballots JCB-17-23 formulated under the cognizance of the JC-11 Committee on Mechanical (Package outline) Standardization.) 1 Scope This standard describes a systematic method for generating descriptive designators for electronic-device packages. The descri

23、ptive designator is intended to provide a useful communication tool, but has no implied control for assuring package interchangeability. 2 Terms and definitions For the purpose of this standard, the following definitions shall apply: body direction: this attribute defines whether the part body is ei

24、ther vertical or horizontal, by comparing the cross-sectional area of the part in both the horizontal direction and the vertical direction. If the horizontal cross sectional area is greater than the vertical cross sectional area, then the body direction is horizontal. die-size package: See chip scal

25、e package footprint (of a package): The pattern of package terminals that is used to define the land patterns on a mating printed circuit board. NOTE The footprint may include features necessary for mechanical mounting of the package. package: The encapsulation of an electronic component. See Table

26、1 for a list of package outline styles. package terminal shape: Package terminal shape is a one character code that indicates the terminal shapes of all the terminals on the package (see 3.2.4 for how this is calculated) package terminal position: Package terminal position is a one character code th

27、at indicates the position of all the terminals on the package (see 3.2.2 for how this is calculated) part access direction: Various parts require additional clearance around the part, typically in one direction post assembly on the PCB. This may be a once off access to the part as the PCB is mounted

28、 into its enclosure, or it may require continuous access over the life of the product. Part access can come in any of the following directions Topside, Underside, Front, Back, Right side, Left side terminal: An externally available point of electrical connection. (Ref. JESD99.) The solid or stranded

29、 wire or formed conductor that extends from a package body to serve as a mechanical or electrical connector, or both. The terminal can also be a metallic post or stud mount package body that is used for making electrical connections. JEDEC Standard No. 30H Page 2 2 Terms and definitions (contd) term

30、inal group: A part can have multiple terminals of different shapes, position, and size. The term group is used to define a grouping of terminals that have a uniform layout and which have a common set of terminal types and terminal dimensions. As an example a layout of multiple terminals would be a s

31、et of 16 terminals organized into 2 columns of 8 where the spacing in the vertical direction is the same for all terminals and the spacing in the horizontal direction is the same for all terminals. terminal group terminal shape: A single-letter suffix that identifies the standard form or shape of th

32、e terminal belonging to a specific group of terminals on a package. When there is a single terminal group on a package, then the package terminal shape is the same as the terminal group terminal shape. terminal group terminal position: A single-letter prefix that identifies the physical terminal pos

33、itions specific to a group of terminals on a package. When there is a single terminal group on a package, then the package terminal position is the same as the terminal group terminal position. terminal mount: The method or technology employed in mounting the terminal to the printed board land patte

34、rn. There are 5 types available SMT, Through-hole, Non-board, Hole, or Press-fit 3 Descriptive designation system for electronic-device packages 3.1 General The standard descriptive designation system is a method for identifying the physical features of an electronic-device package. The most scalabl

35、e method to achieve this is to split the definition of the package into three basic elements, namely package outline, terminal position, and terminal shape description. To conform as close as possible to previous JEDEC Standards, the terminal position precedes the package outline, while the terminal

36、 shape follows the package outline. This designator is extended through the use of additional fields to provide additional package information such as package-body material, terminal count, and package body dimensions. This mandatory package designator may be extended, through the use of user-select

37、ed fields, to provide additional package information such as specific package features, package differentiators, and supplemental information. NOTE JEITA ED7303 (“Name and code for integrated circuit package”) and IEC 60191-4 (“Coding system and classification into forms of package outlines for elec

38、tronic device packages”) are standards similar to JESD30. JEDEC Standard No. 30H Page 3 Figure 1 Descriptive designation system for electronic-device packages- - _ - - -HP a c k a g e - s p e c if ic f e a tu r e s( 3 . 2 . 3 . 1 , T a b le 3 - 4 , o p ti o n a l)HP a c k a g e - b o d y M a te r ia

39、 l( 3 . 2 . 3 , T a b le 3 - 3 . m a n d a to r y )D# S O # G# 4 4 5 0 I# X # Y # Z # N# C# T# H PM o u n ti n g B o d y D ir e c ti o n( 4 . 3 o p ti o n a l)( 3 . 2 . 8 , m a n d a to r y f o r c e r ta in T e r m in a ls )( 4 . 2 m a n d a to r y if T e r m in a l S p a c in gP a c k a g e D im e

40、 n s io n s( 3 . 2 . 7 , m a n d a to r y )T e r m in a l S p a n( 3 . 2 . 8 , m a n d a to r y f o r c e r ta in T e r m in a ls )( M a n d a to r y if P a r t is p o la r iz e d . I f n o t- p o la r iz e d , th e n P - is o m itte d . )T e r m in a l T h ic k n e s s / H e ig h t( 3 . 2 . 9 , m a

41、 n d a to r y f o r c e r ta in T e r m in a ls )B a s ic P a c k a g e O u tl in e S ty le Co d e s( 3 . 2 . 1 , T a b le 3 - 1 , m a n d a to r y . W h e n th is is in s u f f ic ie n t, th e e x te n d e d c o d e c a n b e a d d e d h e r e to e x p la in th e e x te n d e d P a c k a g e O u tl

42、 in e ) T e r m in a l S h a p eT e r m in a l Co u n t( 3 . 2 . 5 , m a n d a to r y )( 3 . 2 . 4 , T a b le 3 - 5 , m a n d a to r y . W h e n th is is in s u f f ic ie n t, th e e x te n d e d c o d e c a n b e a d d e d h e r e to e x p la in th e e x te n d e d T e r m in a l s h a p e )P a c k

43、 a g e T e r m in a l P o s iti o n( 3 . 2 . 2 , T a b le 3 . 2 , m a n d a to r y . W h e n th is is in s u f f ic ie n t, th e e x te n d e d c o d e c a n b e a d d e d h e r e to e x p la in th e e x te n d e d T e r m in a l p o s iti o n )PP o la r ity Co n s c io u sP itc h Co d e( 3 . 2 . 6

44、, T a b le 3 - 6 , m a n d a to r y )JEDEC Standard No. 30H Page 4 3.2 Field descriptions 3.2.1 Package-outline-style codes The basic package designator is a two-character package outline style code. It is preceded with a terminal-position code and a succeeding terminal shape code (see 3.2.2 and 3.2

45、.4). Table 1 shows the two-character package outline style codes. Table 1 Package Outline Style Codes Package style code Package type Description AT Array Type A rectangular or square shaped body with or without chamfered corners with perpendicular sides. The sides do not taper outwards or inwards a

46、s in a Small Outline or a Flatpack Package Outline. CP Clamped Package (Press-Pack) A package for high-current devices, in the form of a cylinder with a flat, circular high-current terminal on each end that is intended to be clamped between two bus bars acting as heat sinks. CS Chip Scale Package A

47、Package that is no more than 1.2X the area of the internal die size. CY Cylinder or Can A cylindrical (tubular) package whose terminals exit from one end parallel to the axis of the package. DB Disk Button A package shaped like a disk or button whose terminals exit radially from the periphery of the

48、 package (like the spokes of a wheel) or axially from the center of the disk. FM2 Flange Mount A package having a flange mounted heat sink that is an integral part of the package and that extends beyond the package body to provide mechanical mounting to a packaging interconnect structure or cold pla

49、te. NOTE The terminals may exit from, or be attached to, any surface of the package. FP Flatpack A surface-mount package whose terminals project parallel to, and are designed primarily to be attached parallel to, the seating plane. The terminals exist on three or four sides of the package, and can contain a surface terminal on the underside of the package. The terminals can also be metal pad surfaces or be terminals that emerge from the side of the package. GA Grid-Array A package that has terminals arranged in a matrix on the bottom of th