ISA SENS SELEC GUD-2006 Sensor Selection Guide Optimizing Manufacturing and Processes (Second Edition).pdf
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1、Sensor Selection Guide:Optimizing Manufacturingand Processes2nd EditionChapman2006.book Page i Tuesday, June 13, 2006 10:29 AMChapman2006.book Page ii Tuesday, June 13, 2006 10:29 AMSensor Selection Guide:Optimizing Manufacturingand Processes2nd EditionBy Paul W. ChapmanChapman2006.book Page iii Tue
2、sday, June 13, 2006 10:29 AMNoticeThe information presented in this publication is for the general education of the reader. Because neither the author nor the publisher have any control over the use of the information by the reader, both the author and the publisher disclaim any and all liability of
3、 any kind arising out of such use. The reader is expected to exercise sound professional judgment in using any of the information pre-sented in a particular application.Additionally, neither the author nor the publisher have investigated or considered the affect of any patents on the ability of the
4、reader to use any of the information in a particular application. The reader is responsible for reviewing any possible patents that may affect any particular use of the information presented.Any references to commercial products in the work are cited as examples only. Neither the author nor the publ
5、isher endorse any referenced commercial product. Any trademarks or trade-names referenced belong to the respective owner of the mark or name. Neither the author nor the publisher make any representation regarding the availability of any referenced commercial product at any time. The manufacturers in
6、structions on use of any commercial product must be followed at all times, even if in conflict with the information in this publication.Copyright 2006 by ISAThe Instrumentation, Systems, and Automation Society67 Alexander DriveP.O. Box 12277Research Triangle Park, NC 27709All rights reserved.Printed
7、 in the United States of America.10 9 8 7 6 5 4 3 2 ISBN-13: 978-1-55617-987-7ISBN-10: 1-55617-987-1No part of this work may be reproduced, stored in a retrieval system, or transmitted in any form or by any means, electronic, mechanical, photocopying, recording or otherwise, without the prior writ-t
8、en permission of the publisher.Library of Congress Cataloging-in-Publication Data Chapman, Paul W.Sensor selection guide : optimizing manufacturing and processes / byPaul W. Chapman. - 2nd ed.p. cm.Rev. ed. of: Smart sensors. 1996.Includes bibliographical references and index.ISBN 1-55617-987-1 (pbk
9、.)1. Engineering instruments-Programmed instruction. 2.Detectors-Programmed instruction. 3. Smart materials-Programmedinstruction. I. Chapman, Paul W. Smart sensors. II. Title. TA165.C43 2006670.42-dc222006017133Chapman2006.book Page iv Tuesday, June 13, 2006 10:29 AMvTable of ContentsPreface . . .
10、. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . viiUnit 1: Introduction and Overview1-1. Course Coverage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31-2. Purpose . . . . . . . . . . . .
11、 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41-3. Audience and Prerequisites . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41-4. Study Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41-5. Org
12、anization and Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51-6. Course Objectives . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51-7. Course Length . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13、 . . . . 5Unit 2: Sensors and Sensing: History and Definitions2-1. What Is a Sensor? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92-2. Early Sensor Development . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122-3. Overview of Smart Sensing a
14、nd Control Systems . . . . . . . . . . . . . . 152-4. Sensor Types and Their Typical Use . . . . . . . . . . . . . . . . . . . . . . . . . 16Unit 3: Sensor Technologies3-1. Todays Sensor Technologies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233-2. Digital and Analog Sensors: App
15、lication Examples . . . . . . . . . . . . 42Unit 4: Sensor Manufacturing4-1. Silicon-based Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 494-2. Silicon-based Sensor Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . 51Unit 5: Smart Sensing: “Adding
16、Value” to the Sensing Circuit5-1. Smart Sensors? Smart Sensing? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 615-2. Do Requirements for Sensor “Smartness” Exist Only at the Higher Levels of Sophistication? . . . . . . . . . . . . . . . . . . . . . . . 645-3. Environmental Compensation
17、 in Silicon Integrated-CircuitTechnology as Applied to Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . 665-4. Advances in Communication Abilities: Making theSensor Smarter by Improving Its Ability to Communicate with the System . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
18、. 735-5. Self-Diagnostics: Enhancing Sensor Functionality by Making It Able to Anticipate Function Problems . . . . . . . . . . . . . . 74Unit 6: Control Partitioning: Should the “Smarts” Be in the Sensor or the System?6-1. Why Is Control Partitioning Important to the Sensor User? . . . . . 816-2. D
19、eciding Which Capabilities Should Reside in the Sensor and Which in the System . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826-3. Requirements for Smart Sensing in Broad Markets . . . . . . . . . . . . . 86Unit 7: Sensors + Artificial Intelligence: The “High End” of Sensor Partitioning7-
20、1. Artificial Intelligence: What Is It? . . . . . . . . . . . . . . . . . . . . . . . . . . . . 937-2. Monitoring Intangible Parameters Using an Artificial Intelligence Sensing Network . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 957-3. How to Create an AI Sensing Network . . . . .
21、. . . . . . . . . . . . . . . . . . 977-4. Advantages of Using AI Combined with Sensing . . . . . . . . . . . . . 100Chapman2006.book Page v Tuesday, June 13, 2006 10:29 AMvi Table of Contents7-5. Challenges to Widespread Development and Use of AI Sensing Networks . . . . . . . . . . . . . . . . . .
22、 . . . . . . . . . . . . . . . . . . . 100Unit 8: Sensor Packaging: Pulling It All Together8-1. What Is Sensor Packaging? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1058-2. What Should an Effective Sensor Package Do? . . . . . . . . . . . . . . . 1078-3. Sensor Packaging at Two
23、Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1078-4. Sensor Packaging in Various Markets . . . . . . . . . . . . . . . . . . . . . . . 1148-5. Sensor Packaging Attributes Important to All Markets . . . . . . . . 1178-6. Trends in Packaging Standards . . . . . . . . . . . . . . . .
24、. . . . . . . . . . . . 117Unit 9: Bus-based Sensing Systems: Combining Controls, Communication, and Diagnostic Capabilities9-1. What Is a Bus-based Sensing System? . . . . . . . . . . . . . . . . . . . . . . . 1239-2. Distributed Machine Control . . . . . . . . . . . . . . . . . . . . . . . . . . .
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