GMW GMW16016-2013 Mirror Button Hardware Bonded to Glass Performance Issue 4 English.pdf
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1、 WORLDWIDE ENGINEERING STANDARDS Material Specification GMW16016 Mirror Button/Hardware Bonded to Glass Performance Copyright 2013 General Motors Company All Rights Reserved March 2013 Page 1 of 8 1 Scope 1.1 Material Description. This specification covers the durability and adhesion performance of
2、inside rearview mirror support studs, sensor farm brackets, and other hardware bonded to automotive glass. 1.2 Symbols. Not applicable. 1.3 Typical Applications. Typical applications include but are not restricted to bonded mirror buttons, Remote Function Antenna brackets, antenna studs/brackets, La
3、ne Departure Warning and Sensor Farm Pins. 1.4 Remarks. Materials used for and subject to this performance requirement are adhesive bonding systems with glass hardware, metal, or plastic. 2 References Note: Only the latest approved standards are applicable unless otherwise specified. 2.1 External St
4、andards/Specifications. ASTM D412 ISO 180 SAE J2412 2.2 GM Standards/Specifications. GMW3041 GMW3371 GMW14729 GMW15851 GMW3059 GMW3417 GMW15201 GMW3221 GMW14124 GMW15329 GMW3368 GMW14162 GMW15671 2.3 Additional References. TMC003 Material Safety Data Sheet guidance documents (available at ). 3 Requi
5、rements 3.1 Requirements on Test Specimens. Reference GMW3221. 3.1.1 Sample Conditioning. All samples are to be conditioned prior to each requirement test to GMW3221, Code A. 3.1.2 As-Received. As received refers to the production parts/test samples in the As-Received state at the intended GM vehicl
6、e assemble center. This includes full cure conditions of the adhesive systems based upon the manufacture recommended requirements. 3.1.3 Bonded Hardware. Mirror buttons, brackets, bracket attachment pins, locator pins and other hardware that are adhesively attached to automotive glass must meet the
7、following bonding performance. 3.1.4 Test Samples. Production intent hardware, adhesive, glass, and processes shall be used when creating samples for this test. Hardware with adhesive shall be mounted on production glazing or laminated glass samples measuring 70 mm 150 mm minimum. Three (3) test sam
8、ples are to be used for each test environment per each test condition. 3.1.5 Adhesive Wet-Out. The adhesive wet-out defines the amount of adhesive area covering the total area of the bonded surface or substrate. The bonded surface refers to both surfaces attached by the adhesive system. The adhesive
9、 system can be pressure sensitive adhesive tape (PSAT) or Non-PSAT such as Polyurethane glass adhesive. Bonded assemblies must demonstrate a minimum 85% wet-out of the adhesive on each bonded substrate. Copyright General Motors Company Provided by IHS under license with General Motors CompanyNot for
10、 ResaleNo reproduction or networking permitted without license from IHS-,-,-GM WORLDWIDE ENGINEERING STANDARDS GMW16016 Copyright 2013 General Motors Company All Rights Reserved March 2013 Page 2 of 8 3.1.5.1 Wet-out of any surface may be confirmed by applying a non-bondable material like Teflon tap
11、e, lubricant, or water Art Paint, to the intended substrate. If cure or dry time is required, perform per manufactures recommendations. Apply adhesive and allow to cure/set-up via production intent processes. After cure/set-up, separate adhesive from the substrate(s). Observe the adhesive and substr
12、ate the adhesive was removed from. Measure and calculate the total adhesive coverage verses the total intended surface to be bonded. Report in percentage of adhesive wet-out. 3.2 Adhesive Type. 3.2.1 Autoclave Adhesives. Autoclave adhesives are types that require a bake condition performed generally
13、 during the autoclave process, e.g., Polyvinyl Butyral (PVB), Structural Bonding Tape (SBT). The bake is not restricted to Autoclave, so may also be performed post Autoclave. 3.2.2 Post Autoclave, Low Modulus, High Elongation Adhesives. Post Autoclave adhesives shall have a Modulus 200% when tested
14、per GMW15329 and ASTM D412, Method A, Die C respectively. These are typically glass bonding, moisture cure polyurethane adhesives. Deviations to this type adhesive must specifically be requested to the regionally responsible GM Materials Engineering Group prior to any production intent validation. 3
15、.2.3 Pressure Sensitive Adhesive Tape (PSAT). Section 3.3 defines the bonding performance for post autoclave, pressure sensitive adhesive tape attached hardware. This attachment method is intended for light, assembly aid trim, e.g., locator pins. It is not intended for hardware that retains function
16、ally attached components, e.g., mirror bracket, glass hinges, or sensor farm pins. 3.3 Test Requirements. 3.3.1 Mirror Button/Bracket Creep Resistance. In addition to the described test sample preparation, mount a 64 mm (from glass) rigid extension arm to the required mirror button/bracket with a 10
17、00 g weight attached no more than 6 mm inward from the end of the extension. With the glass in vehicle position, mount the extension arm to the button/bracket on the glass parallel to horizontal. The bonded assembly must withstand the environmental exposures per 3.3.1.1 and 3.3.1.2 without delaminat
18、ion. 3.3.1.1 One Thousand Hours (1000 h) Humidity. Expose to one (1) thousand (1000 h) humidity per GMW14729 Option A at 65 C, 80% 5% relative humidity (RH). 3.3.1.2 Natural Weathering. Expose test samples to 150 000 temperature normalized radiation (TNR) Langleys natural weathering exposure per GMW
19、3417; L2-F1-G2-T5. Test samples are required to have the 1000 g weight attached as described in 3.3.2.1 during exposure. Glass construction and test location may vary by agreement of the GM regionally responsible engineer. Note: Surrogate data may be used, if the production intent adhesive system ha
20、s existing data showing capability after natural weathering exposure. 3.3.1.3 Creep Resistance for Hardware Other Than Mirror Buttons/Bracket, e.g., Farm Sensor Pins. In addition to the described test sample preparation, mount a 150% mass of the intended production assembly to the attached hardware.
21、 If multiple attachment points are to be used such as a multiple sensor farm pin system, single pin test samples may be employed with an equal amount of distributed mass applied. For example: 4 Pin System, total mass 150%/4 = equally distributed mass. The test sample/assembly must be tested in vehic
22、le position. Locator Pins are excluded here, but covered in 3.4. 3.3.1.4 Requirement. The bonded assembly must withstand the environmental exposures without delamination. Cohesive separation of the adhesive and/or substrate break/tear required. 3.3.2 Side Impact Adhesion. All attached hardware must
23、meet Impact Adhesion. See Figure 1 and Figure 1A for test setup. Locator Pins are excluded. Copyright General Motors Company Provided by IHS under license with General Motors CompanyNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-GM WORLDWIDE ENGINEERING STANDARDS
24、GMW16016 Copyright 2013 General Motors Company All Rights Reserved March 2013 Page 3 of 8 Figure 1: Impact Tester Figure 1A: Impact Test Setup Copyright General Motors Company Provided by IHS under license with General Motors CompanyNot for ResaleNo reproduction or networking permitted without licen
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