FORD WSS-M2G373-A2-2008 ADHESIVE HEM FLANGE ALUMINUM BONDING TWO COMPONENT 50 - 70 C GEL POINT TO BE USED WITH FORD WSS-M99P1111-A (Shown on FORD WSB-M2G373-A)《凝胶点为50-70℃的两组分铝粘合用.pdf

《FORD WSS-M2G373-A2-2008 ADHESIVE HEM FLANGE ALUMINUM BONDING TWO COMPONENT 50 - 70 C GEL POINT TO BE USED WITH FORD WSS-M99P1111-A (Shown on FORD WSB-M2G373-A)《凝胶点为50-70℃的两组分铝粘合用.pdf》由会员分享，可在线阅读，更多相关《FORD WSS-M2G373-A2-2008 ADHESIVE HEM FLANGE ALUMINUM BONDING TWO COMPONENT 50 - 70 C GEL POINT TO BE USED WITH FORD WSS-M99P1111-A (Shown on FORD WSB-M2G373-A)《凝胶点为50-70℃的两组分铝粘合用.pdf（12页珍藏版）》请在麦多课文档分享上搜索。

1、 ENGINEERING MATERIAL SPECIFICATIONDate Action Revisions Ver 4 2008 04 25 Revised WSS-M2G373-A2 made N-Status, replaced by WSS-M2G373-C Fixed numbering in 3.6 B. Witkowski, FNA 2003 01 08 Revised Para 3.0 inserted ; Para 3.1, 3.2, 3.3, 3.10, 3.11, 4 deleted 1995 07 13 Activated N.E. Lindsay, G. A. M

2、olnar Printed copies are uncontrolled Copyright 2008, Ford Global Technologies, LLC Page 1 of 12 ADHESIVE, HEM FLANGE, ALUMINUM BONDING, TWO WSB-M2G373-A COMPONENT 150 - 180 MINUTE GEL POINT, 70 - 90 C GEL POINT ADHESIVE, HEM FLANGE, ALUMINUM BONDING, NOT TO BE USED FOR NEW DESIGN WSS-M2G373-A2 TWO

3、COMPONENT 50 - 70 C GEL POINT ADHESIVE, HEM FLANGE, STEEL BONDING, TWO WSS-M2G373-B COMPONENT 90 - 120 MINUTE GEL POINT, 100 - 120 C GEL POINT 1. SCOPE The materials defined by these specifications are pumpable two-component, induction heat responsive structural adhesives with bondline spacers for b

4、onding metal. Full adhesive strengths are attained after an oven cure. The mixed adhesive performance for bonding aluminum and steel is defined as follows: A-series: Defines the mixed adhesive performance requirements for aluminum bonding: WSB-M2G373-A: The mixed adhesive is room temperature curing

5、or induction responsive. At 23 C the material will gel after 150 - 180 minutes. The ramped heat gel point is 70 - 90 C as defined by para 3.5.2. WSS-M2G373-A2: The mixed adhesive is room temperature curing or induction responsive. The ramped heat gel point is 50 - 70 C as defined by para 3.5.2. A he

6、at induction process with induction coils covering a minimum of 85% of the adhesive bonding area is required to achieve acceptable adhesive bond durability. B-series: Defines the mixed adhesive performance requirements for steel bonding. WSS-M2G373-B: The mixed adhesive is room temperature curing or

7、 induction responsive. At 23 C the material will gel after 90 - 120 minutes. The ramped heat gel point is 100 - 120 C as defined by para 3.5.2. 2. APPLICATION These specifications were released originally for materials to structurally bond metal-to-metal body components such as the inner and outer p

8、anels (hem flange) of deck lids, doors, and hoods, etc. This adhesive can be used to bond oily, unclean metal substrates. Bondline spacers are added to one of the components to maintain a 0.25 mm bondline thickness during the hemming process. ENGINEERING MATERIAL SPECIFICATIONWSB-M2G373-A WSS-M2G373

9、-A2/B Printed copies are uncontrolled Copyright 2008, Ford Global Technologies, LLC Page 2 of 12 The Manufacturing Properties and Engineering Performance requirements defined in these specifications are based upon laboratory coupon testing and define the minimum acceptance criteria for adhesive perf

10、ormance. The assembly process and design for the component will determine the specific adhesive processing parameters for each assembly line. The component engineering performance requirements are defined by the component SDS (Sub-system Design Specification). The materials are two component inducti

11、on heat or room temperature cure responsive structural adhesives. Reactivity build rate of the adhesive to generate required component handling strengths for manufacturing is a function of the assembly line processing conditions. Full adhesive strengths are attained after an oven cure. Recommended m

12、aterial oven cure schedules are minimum 171 C metal temperature for 10 minutes and maximum 205 C metal temperature for 30 minutes. Prior to use, the adhesive must be evaluated under the component production parameters. The choice of substrates, stamping lubricants, stamping plant processing conditio

13、ns, assembly plant processing conditions and specific design application may affect adhesive performance. Compliance with this specification does not guarantee the adhesive will function for all potential applications on a vehicle. 3. REQUIREMENTS 3.0 STANDARD REQUIREMENTS FOR PRODUCTION MATERIALS M

14、aterial suppliers and part producers must conform to the Companys Standard Requirements For Production Materials (WSS-M99P1111-A). 3.4 SYSTEM COMPATIBILITY Initial adhesive approval was based on a specific material system which included the substrate, stamping lubricants and adhesive. The originally

15、 approved material system was induction heated or room temperature cured followed by an oven cured using specific production process parameters. Substrate choice, stamping lubricants, stamping plant processing conditions and assembly plant processing conditions may affect adhesive performance. If an

16、y of these parameters are changed, the adhesive performance must be validated using the new parameters. 3.5 MATERIAL PROPERTIES 3.5.1 Weight Per Volume +/- 0.06 kg/L (ASTM D 816) The weight tolerance for any one supplier shall be +/- 0.06 kg/L, based on the recorded weight of their original approved

17、 production sample. Reference para 5.1. ENGINEERING MATERIAL SPECIFICATIONWSB-M2G373-A WSS-M2G373-A2/B Printed copies are uncontrolled Copyright 2008, Ford Global Technologies, LLC Page 3 of 12 3.5.2 Cure Behavior (ASTM D 4473, 25 mm or 40 mm parallel plate with a 1.0 mm gap, Induction responsive ma

18、terials - ramped heating at a 35 - 40 C/minute ramp rate over the temperature range 23 C to 205 C, room temperature curing materials record at 23 +/- 2 C, Report gel point - inter-section of elastic (G) and viscous (G“) moduli) Room Temperature Induction Curing Responsive (Ramped Heat) WSB-M2G373-A

19、150 - 180 minutes 70 - 90 C WSS-M2G373-A2 Not Feasible 50 - 70 C WSS-M2G373-B 90 - 120 minutes 100 - 120 C The gel point tolerance for any one supplier shall be +/- 5 minutes for room temperature curing at 23 C and +/- 5 C for ramped heating, based on the recorded gel point of their original approve

20、d production sample. 3.5.3 Expansion No porosity or (Substrates per para 5.5, induction expansion heat per para 5.6.1 or room temperature cure per para 5.6.2, one panel each substrate and cure) Extrude a 13 x 200 mm adhesive bead onto a 100 x 300 mm panel. Induction heat or room temperature cure. Pl

21、ace the test panel in an air circulating oven and bake at 205 +/- 2 C for 40 minutes oven time. After bake, condition test panel at 23 +/- 2 C for 1 h min. Cut the panel lengthwise through the center of the adhesive. Examine the adhesive for any voids, porosity or expansion caused by entrapped air o

22、r internal gassing. ENGINEERING MATERIAL SPECIFICATIONWSB-M2G373-A WSS-M2G373-A2/B Printed copies are uncontrolled Copyright 2008, Ford Global Technologies, LLC Page 4 of 12 3.6 MANUFACTURING PROPERTIES 3.6.1 Rheology (SAE J1524, rotational rheometer with 40 mm diameter parallel plates, 500 micron g

23、ap, 50 Pa/sec ramp, stress controlled rheometers use stress range 0 - 3500 Pa, strain controlled rheometers use strain range 0 - 100 s-1, evaluate material to highest stress or strain as the formulation will allow, report material batch/lot number, identify rheometer make and model, for each test co

24、ndition report yield stress and submit plots for shear stress vs. shear rate, submit plot for viscosity vs. temperature at mid-range shear rate, each component and mixed). Initial (as received) . Test at 23 +/- 2 C . Test at application temperature +/- 2 C . Test over range 10 to 50 C at increments

25、of 10 C Aged (age then test at 23 C and application temperature) . 7 d at 40 +/- 2 C . 90 d at 32 +/- 2 C The flow curves established for initial approval shall constitute the reference standard and shall be kept on file at the designated material laboratory. All samples shall produce flow curves th

26、at correspond to the reference standard when tested under the same conditions. Final approval of material rheology for production shipments shall be made by the affected manufacturing activity. In all cases, the rheology shall be within the limits as identified on the material control plan. 3.6.2 Sa

27、g Resistance/Flow Rate No measurable movement or flow, no loss of material 3.6.2.1 North American Production (FLTM BV 118-01, 6 mm diameter bead, substrates per para 5.5, room temperature cure per para 5.6.2, oven cure per para 5.6.3, one panel each bake) . Horizontal . Vertical . Inverted 3.6.2.2 E

28、uropean Production (FLTM BV 153-01, Method A, 8 mm diameter bead, substrates per para 5.5, room temperature cure per para 5.6.2, bake 30 minutes at 110 +/- 2 C) ENGINEERING MATERIAL SPECIFICATIONWSB-M2G373-A WSS-M2G373-A2/B Printed copies are uncontrolled Copyright 2008, Ford Global Technologies, LL

29、C Page 5 of 12 3.6.3 Phosphate Wash Resistance No measurable movement, displacement or wash off. No dissolution of material or lifting from panel. 3.6.3.1 North American Production (FLTM BV 116-01, Method B, 1.5 mm material thickness, room temperature cure per para. 5.6.2 prior to test) 3.6.3.2 Euro

30、pean Production Test Method: . Prepare a test panel (300 X 100 X 0.8 - 0.9 mm) according to FLTM BZ 150-11 oiling grade Normal. . Apply a ribbon of test material (250 x 30 x 5 mm) to the panel. . Condition for 2 h at 23 +/- 2 C. . Wash, phosphate and electrocoat the test panel under current process

31、conditions. 3.6.4 Electrocoat Compatibility (FLTM BV 119-01, use current production paints as identified by Materials Engineering, room temperature cure per para 5.6.2 prior to test) Shall not contaminate electrocoat primer bath or cause electrocoat film irregularities. 3.6.5 Color Each component is

32、 distinctly different in color. The mixed adhesive is dark in color and shall meet manufacturing process control requirements. Final approval of material color for production shipments shall be made by the affected manufacturing activity. The material color for any one supplier shall not visually de

33、viate from the originally approved production sample. Reference para 5.3. 3.6.6 Odor Shall be free from objectionable odors as determined by the manufacturing facility, both as received, after storage, and mixed. 3.6.7 Material Consistency Shall be a smooth homogenous mixture, free from entrapped ai

34、r, foreign materials and properties detrimental to normal production operation. ENGINEERING MATERIAL SPECIFICATIONWSB-M2G373-A WSS-M2G373-A2/B Printed copies are uncontrolled Copyright 2008, Ford Global Technologies, LLC Page 6 of 12 3.6.8 Volume Off-Ratio Mix Ratio Tolerance +/- 10% (SAE J 1523, Su

35、bstrates per para 5.5, 0.25 mm adhesive bondline thickness, 13 mm length overlap, 13 mm/minute pull rate, induction heat per para 5.6.1 or room temperature cure per para 5.6.2, oven cure per para 5.6.3, test at 23 +/- C) Test Method: . Prepare coupons using adhesive at nominal mix ratio, at +10% off

36、-ratio and at -10% off-ratio. . Mix ratio by volume is determined by the following formulas: Volume A * 1.1 = RATIO at + 10% Volume A * 1.0 = RATIO at nominal, control Volume A * 0.9 = RATIO at - 10% . Induction heat or room temperature cure. . Proceed with oven curing and testing. Overlap shear adh

37、esive strengths for mix ratios conditions at +/- 10% shall meet the min requirement for 3.7.1.1 tested at 23 C and shall be no more that 10% lower than the strengths for the nominal mix ratio. 3.6.9 Adhesive Open Time, min 60 minutes (SAE J 1523, substrates per para 5.5, 0.25 mm adhesive bondline th

38、ickness, 13 mm length overlap, 13 mm/minute pull rate, induction heat per para 5.6.1 or room temperature cure per para 5.6.2, oven cure per para 5.6.3, test at 23 +/- C) “Adhesive Open Time“ for the assembly process is defined as the time interval between dispensing and hemming. Test Method: . Prepa

39、re coupons as described with the following exception: . Apply adhesive to coupons, let unmated coupons lay flat for 0, 15, 30, 45, 60, 75, and 90 minutes prior to mating with second coupon. . Induction heat or room temperature cure. . Proceed with oven curing and testing. Overlap shear adhesive stre

40、ngths for open times up to 60 minutes shall meet the min requirement for para 3.7.1.1 tested at 23 C and shall be no more than 10% lower the strengths at 0 minutes open time. ENGINEERING MATERIAL SPECIFICATIONWSB-M2G373-A WSS-M2G373-A2/B Printed copies are uncontrolled Copyright 2008, Ford Global Te

41、chnologies, LLC Page 7 of 12 3.6.10 Exposed Adhesion Strength, min (SAE J1523, substrates per para 5.5, 0.25 mm adhesive bondline thickness, 13 mm length overlap, induction heat per para 5.6.1 or room temperature cure per para 5.6.2, 13 mm/minute pull rate) 3.6.10.1 Exposure after 1 h, min 8.0 MPa (

42、Induction heat or room temperature cure, condition at 23 +/- 2 C for 1 h, subject to environmental cycle and test at 23 C) 3.6.10.2 Exposure after 24 h, min 8.0 MPa (Induction heat or room temperature cure, condition at 23 +/- 2 C for 24 h, subject to environmental cycle and test at 23 C) Environmen

43、tal cycle: -40 +/- 1 C for 7 d PLUS 40 +/- 1 C for 98 +/- 2% RH for 7 d PLUS 40 +/- 1 C for 7 d PLUS 23 +/- 2 C for 1 d 3.6.11 Creep Resistance, min (ASTM D 1780, substrates per para 5.5 0.25 mm adhesive bondline thickness, 13 mm bond overlap, induction heat per para 5.6.1 or room temperature cure p

44、er para 5.6.2, condition at 23 +/- 2 C for 72 h, test 205 C for 40 minutes oven time) Induction Heat No creep with dead load weight of 10 kg Room Temperature No creep with dead load weight of 5 kg 3.6.12 Storage Stability Heat greatly accelerates aging. The material shall be stored in closed contain

45、ers away from all sources of heat. The shelf life of the material shall be 6 months when stored below 27 C. When these materials are stored at temperatures below 23 C, they shall be conditioned at room temperature 24 h prior to application. Adequate conditioning permits the material to retain its op

46、timum application properties. 3.7 ENGINEERING REQUIREMENTS 3.7.1 Oven Cured Adhesion Strength, min (SAE J1523, Substrates per para 5.5, 0.25 mm adhesive bondline thickness, 13 mm length overlap, 13 mm/minute pull rate, induction heat per para 5.6.1 or room temperature cure per para 5.6.2, oven cure

47、per para 5.6.3) ENGINEERING MATERIAL SPECIFICATIONWSB-M2G373-A WSS-M2G373-A2/B Printed copies are uncontrolled Copyright 2008, Ford Global Technologies, LLC Page 8 of 12 3.7.1.1 Normal, min (Condition for 30 minutes at specified temperature prior to test) . Test at 23 +/- 2 C 10.0 MPa . Test at 82 +

48、/- 2 C Aluminum 2.0 MPa Steel 5.0 MPa . Test at - 40 +/- 2 C 7.0 MPa 3.7.1.2 Exposed, min . Exposure after 1 h 10.0 MPa (Induction heat or room temperature cure, condition at 23 +/- 2 C for 1 h, subject to environmental cycle, oven cure, test at 23 C) . Exposure after 24 h 10.0 MPa (Induction heat o

49、r room temperature cure, condition at 23 +/- 2 C for 24 h, subject to environmental cycle, oven cure, test at 23 C) Environmental cycle: -40 +/- 1 C for 7 d PLUS 40 +/- 1 C for 98 +/- 2% RH for 7 d PLUS 40 +/- 1 C for 7 d PLUS 23 +/- 2 C for 1 d 3.7.1.3 Aged, min (Condition at 23 +/- 2 C for 24 h after exposure, test at 23 +/- 2) . 10 Thermal Cycles 10.0 Mpa One Cycle: 90 +/- 1 C for 4 h PLUS 40 +/- 1 C and 98 +/- 2% RH for 4 h PLUS -40 +/- 1 C for 16 h . 30 APGE Corrosion Cycles 10.0 Mpa (FLTM BI 123