FORD WSS-M11A46-A1-2012 SOLDER PASTE (63 TIN 37 LEAD RMA FLUX NO-CLEAN STENCIL PRINTABLE) TO BE USED WITH FORD WSS-M99P1111-A .pdf
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1、 ENGINEERING MATERIAL SPECIFICATION Date Action Revisions 2012 07 25 N-Status No replacement A. Wedepohl, NA 2005 02 10 Revised Inserted 3.0; Deleted 3.1, 3.2, 3.7, 3.8, 4 1996 09 11 Activated L. Merala Controlled document at www.MATS Copyright 2012, Ford Global Technologies, LLC Page 1 of 4 SOLDER
2、PASTE (63 TIN/37 LEAD, RMA FLUX, NOT FOR NEW DESIGN WSS-M11A46-A1 NO-CLEAN, STENCIL PRINTABLE) 1. SCOPE The material defined by this specification is a RMA 63 Sn/37 Pb solder paste. This solder paste is a homogeneous suspension of a prealloyed solder powder in a specially formulated screening and fl
3、uxing vehicle system. 2. APPLICATION This specification was released as a conductive material used as a printable solder for surface mount connections and other applications. This solder paste was designed to be stencil printed onto printed circuit substrates and reflowed using either convection or
4、infrared soldering. 3. REQUIREMENTS This solder paste is a homogeneous suspension of a prealloyed solder powder in a specially formulated fluxing vehicle. All qualification testing shall be done at 25 +/- 2 C and 50 +/- 3% relative humidity, unless otherwise specified. 3.0 STANDARD REQUIREMENTS FOR
5、PRODUCTION MATERIALS Material suppliers and part producers must conform to the Companys Standard Requirements For Production Materials (WSS-M99P1111-A). 3.3 COMPOSITION (IPC-SP-819, para 4.4, 50 gram sample required) Solder Metal, weight, % 89.5 - 90.5 Vehicle Balance 3.3.1 Solder Metal Composition,
6、 percent (ASTM B32/QQ-S-571F, class 1 impurity levels) Tin 62.5 - 63.5 Silver 0.003 max Zinc 0.003 max Antimony 0.50 max Bismuth 0.10 max Copper 0.08 max Iron 0.02 max Aluminum 0.005 max Cadmium 0.005 max Other Elements 0.08 max Lead Remainder ENGINEERING MATERIAL SPECIFICATION WSS-M11A46-A1 Copyrig
7、ht 2012, Ford Global Technologies, LLC Page 2 of 4 3.3.2 Vehicle Composition, weight percent (IPC-SF-818, para 4.4.2.2, IPC-TM-650, para 2.3.34) Flux, % 59.0 min Solvent Balance 3.4 INDIVIDUAL COMPONENT PROPERTIES 3.4.1 Solder Powder (Powder sample prior to mixing) 3.4.1.1 Particle Size Type 3 (IPC-
8、SP-819, para 3.2.2) % of Sample by Weight - Nominal Sizes Less than 1% larger than 45 microns 80% minimum between 45 - 20 microns 10% maximum less than 20 microns 3.4.1.2 Particle Shape Spherical; (IPC-SP-819, para 3.2.3) Ratio = 1 - 1.5 3.4.2 Flux Vehicle (Flux sample prior to mixing) 3.4.2.1 Coppe
9、r Mirror No complete (IPC-TM-650, para 2.3.32) copper removal 3.4.2.2 Halide Content, max 500 ppm of (IPC-TM-650, para 2.3.35) vehicle comp. 3.5 VISCOSITY, mPa.s (IPC-TM-650, para 2.4.34.3, spiral pump viscometer, 25 +/- 0.25 C) 5 RPM (6 minutes) 2650 - 3800 10 RPM (1 minute) 1650 - 2450 15 RPM (1 m
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