FORD WSB-M11P38-C-1991 PERFORMANCE REQUIREMENTS ADHESIVE FOR BONDING PLASTIC BUMPERS《用于粘合塑料保险杠的胶粘剂的性能要求[替代 FORD ESB-M11P38-B FORD ESB-M11P38-B FORD ESB-M11P38-B FORD ESB-M11P38-B]》.pdf
《FORD WSB-M11P38-C-1991 PERFORMANCE REQUIREMENTS ADHESIVE FOR BONDING PLASTIC BUMPERS《用于粘合塑料保险杠的胶粘剂的性能要求[替代 FORD ESB-M11P38-B FORD ESB-M11P38-B FORD ESB-M11P38-B FORD ESB-M11P38-B]》.pdf》由会员分享,可在线阅读,更多相关《FORD WSB-M11P38-C-1991 PERFORMANCE REQUIREMENTS ADHESIVE FOR BONDING PLASTIC BUMPERS《用于粘合塑料保险杠的胶粘剂的性能要求[替代 FORD ESB-M11P38-B FORD ESB-M11P38-B FORD ESB-M11P38-B FORD ESB-M11P38-B]》.pdf(6页珍藏版)》请在麦多课文档分享上搜索。
1、 ENGINEERING MATERIAL SPECIFICATIONMaterial Name Specification NumberDate Release No. Release/Revision1991 09 02 EP00E01089488000 Released W.Scholz;J.Schult;W.Curtiss;E.RezendesWP 3948-a Page 1 of 6 PERFORMANCE REQUIREMENTS, ADHESIVE FOR BONDING WSB-M11P38-CPLASTIC BUMPERS1. SCOPEThis s pecification
2、 defines the performance requirements of an adhesive oradhesive system for bonding plastic bumpers.2. APPLICATIONTh is specification was released originally for adhesives used tostructurally bond plastic bumper assemblies.This specification does not describe initial adhesive cu re conditions. Thepro
3、cedures for assembly bonding shall be prescribed in accordance toadhesive manufacturer and part supplier recommendations.Mate rials meeting this performance specification are identified on theCorporate Approved Source List.Compl iance with this performance specification does not guarantee thestr uct
4、ural adhesive will function for all potential applications on ave hicle. The specific design condition should be evaluated by a planttrial or laboratory simulation prior to release of the material.3. REQUIREMENTS3.1 STATISTICAL PROCESSSupplie rs must conform to the requirements of Ford Quality Syste
5、mStand ard Q-101. A mutually acceptable Control Plan as describedtherein is required for material/source approval. Appropriatestatist ical tools must be used to analyze process/product data sothat variation in the final product is continuously reduced.3.2 CONDITIONING AND TEST CONDITIONSAll test val
6、ues indicated herein are based on ma terial conditioned ina control led atmosphere of 23 +/- 2 C and 50 +/- 5 % relativehumidity for not less than 24 h prior to testing and tested under thesame conditions unless otherwise specified.ENGINEERING MATERIAL SPECIFICATIONWSB-M11P38-CWP 3948-b Page 2 of 6
7、3.3 SHEAR ADHESION Minimum load specified orsubstrate breakageSubject bonded test assemblies to the following exposures:. Normal, min(Condition for 30 minutes at specifiedtemperature prior to test)3.3.1 Test at 23 +/- 2 C 2.4 MPa3.3.2 Test at 88 +/- 2 C 1.0 MPa3.3.3 Test at - 29 +/- 2 C 4.2 MPa. Env
8、ironmental Aged, min3.3.4 1000 h Heat Age at 88 +/- 2 C 2.8 MPa3.3.5 1000 h Humidity at 38 +/- 2 C and 2.3 MPa95 - 100 % R.H.3.3.6 1000 h Water Immersion described 1.3 MPaper FLTM BI 104-013.3.7 240 h Salt Spray 1.7 MPa(ASTM B 117)3.3.8 10 Thermal Cycles: 2.9 MPa4 h at 8 8 +/- 2 C, 4 h humidity (38
9、+/- 2 C and 95 - 100 %R.H.), 16 h at - 29 +/- 2 C.Test Method:. Prepar e a minimum of 3 test assemblies per test condition asillustrated in Figure 1. Te st substrates shall consist of 100 x 25.4 x 3 mm couponsidentified in para 5. Bond test coupons and condition at 23 +/- 2 C until full adhesivecure
10、. Subject test assemblies to the environments listed above. Allow test assemblies to condition 24 h minimum after environmentalexposure before pull test. Conduct shear pull test on a tensile tester at a rate of 13 mm perminute. Report peak load at failure and indicate type of failure mode.ENGINEERIN
11、G MATERIAL SPECIFICATIONWSB-M11P38-CWP 3948-b Page 3 of 6 3.4 CREEP RESISTANCE No Slippage(ASTM D 1780, prepare three test samples perpara 3.3, apply a 4.5 kg dead weight load totest samples and expose to 88 +/- 2 C for 24 h)3.5 MANDREL BEND FLEXIBILITY No cracking oradhesion loss tosubstrateTest Me
12、thod:. Apply a 13 mm wide x 3 mm thickness ribbon of adhesive centeredlengthwise on two 250 x 50 x 3 mm panels identified in para 5. Condition test panels after bonding at 23 +/- 2 C until adhesivefull cure. Conduct 60 mandrel bend test at 23 +/- 2 C and - 29 +/- 2 C overa 50 mm d iameter mandrel. S
13、ubstrate is in contact with mandrelduring test. Repeat above proce dure on test assemblies heat aged at 70 +/- 2 Cfor 2 weeks.3.6 COLD SLAM RESISTANCE No cracking,(FLTM BV 101-02, 10 cycles of 6 slams per adhesion orcycle at - 29 +/- 2 C, 3 samples minimum) cohesion failure. Prepare test assemblies
14、as illustrated in Figure 2. Test substratesshall consist of 100 x 250 x 3 mm panels identified in para 5. Condition test assemblies after bonding at 23 +/- 2 C untiladhesive full cure. Mechanically attac h bonded test assembly to a 300 x 300 x 0.76 mmCRS base panel. Centrally locate test assembly on
15、 base panel. Conduct test as outlined per FLTM BV 101-02 following steps 9, 10,and 11. Position panel in slam fixture with test assembly facinginward. Subject each test assembly to 10 cycles of 6 slams percycle at - 29 +/- 2 C.3.7 REVERSE IMPACT PLAQUE TEST Test plaques shall exhi bit no less(FLTM B
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- FORDWSBM11P38C1991PERFORMANCEREQUIREMENTSADHESIVEFORBONDINGPLASTICBUMPERS 用于 粘合 塑料 保险杠 胶粘剂 性能 要求 替代 FORDESBM11P38BFORDESBM11P38BFORDESBM11P38BFORDESBM11P38B

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