FORD ESB-M11P32-A-2013 ADHESION REQUIREMENT ADHESIVE FOR BONDING MOLDED WEATHERSTRIP TO ALUMINUM IN MODULE WINDOW ASSEMBLY TO BE USED WITH FORD WSS-M99P1111-A .pdf
《FORD ESB-M11P32-A-2013 ADHESION REQUIREMENT ADHESIVE FOR BONDING MOLDED WEATHERSTRIP TO ALUMINUM IN MODULE WINDOW ASSEMBLY TO BE USED WITH FORD WSS-M99P1111-A .pdf》由会员分享,可在线阅读,更多相关《FORD ESB-M11P32-A-2013 ADHESION REQUIREMENT ADHESIVE FOR BONDING MOLDED WEATHERSTRIP TO ALUMINUM IN MODULE WINDOW ASSEMBLY TO BE USED WITH FORD WSS-M99P1111-A .pdf(3页珍藏版)》请在麦多课文档分享上搜索。
1、 ENGINEERING MATERIAL SPECIFICATION Date Action Revisions 2013 12 12 N Status No replacement named. L. Sinclair, NA 2007 07 31 Revised Inserted 3.0; Deleted 3.5 & 4 1985 03 22 Released C9P1-DR531035 Controlled document at www.MATS Copyright 2013, Ford Global Technologies, LLC Page 1 of 3 ADHESION RE
2、QUIREMENT, ADHESIVE FOR BONDING ESB-M11P32-A MOLDED WEATHERSTRIP TO ALUMINUM IN MODULE WINDOW ASSEMBLY NOT TO BE USED FOR NEW DESIGN 1. SCOPE This specification defines the adhesion requirements for an adhesive or an adhesive system suitable for bonding molded weatherstrip to the aluminum frame in m
3、odule window assemblies. 2. APPLICATION This specification was released originally for adhesives used to bond ESB-M2D348 RIM urethane and ESB-M4D284 polyvinyl chloride weatherstrip to SAE AA6063T5 aluminum. Compliance with this performance specification does not guarantee the adhesive will function
4、for all potential applications on a vehicle. The specific assembly should be evaluated to Design Engineering performance requirements. Materials meeting this performance specification are specified on the Corporate Approved Source List. 3. REQUIREMENTS 3.0 STANDARD REQUIREMENTS FOR PRODUCTION MATERI
5、ALS Material suppliers and part producers must conform to the Companys Standard Requirements For Production Materials (WSS-M99P1111-A). 3.1 CONDITIONING All test values indicated herein are based on materials conditioned in a controlled atmosphere of 23 +/- 2 C and 50 +/- 5% relative humidity for 24
6、 h prior to testing and tested under the same conditions unless otherwise stated herein. 3.2 PEEL ADHESION Average load specified or substrate breakage Subject bonded test assemblies to the following exposures: Normal, min (Condition for 30 min at specified temperature prior to test) 3.2.1 Test at 2
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