ETSI TS 105 174-2-2-2009 Access Terminals Transmission and Multiplexing (ATTM) Broadband Deployment - Energy Efficiency and Key Performance Indicators Part 2 Network sites Sub-part_1.pdf
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1、 ETSI TS 105 174-2-2 V1.1.1 (2009-10)Technical Specification Access, Terminals, Transmission and Multiplexing (ATTM); Broadband Deployment - Energy Efficiency and Key Performance Indicators; Part 2: Network sites; Sub-part 2: Data centres ETSI ETSI TS 105 174-2-2 V1.1.1 (2009-10) 2Reference DTS/ATTM
2、-02005-1-3 Keywords access, cable, optical, site engineering ETSI 650 Route des Lucioles F-06921 Sophia Antipolis Cedex - FRANCE Tel.: +33 4 92 94 42 00 Fax: +33 4 93 65 47 16 Siret N 348 623 562 00017 - NAF 742 C Association but non lucratif enregistre la Sous-Prfecture de Grasse (06) N 7803/88 Imp
3、ortant notice Individual copies of the present document can be downloaded from: http:/www.etsi.org The present document may be made available in more than one electronic version or in print. In any case of existing or perceived difference in contents between such versions, the reference version is t
4、he Portable Document Format (PDF). In case of dispute, the reference shall be the printing on ETSI printers of the PDF version kept on a specific network drive within ETSI Secretariat. Users of the present document should be aware that the document may be subject to revision or change of status. Inf
5、ormation on the current status of this and other ETSI documents is available at http:/portal.etsi.org/tb/status/status.asp If you find errors in the present document, please send your comment to one of the following services: http:/portal.etsi.org/chaircor/ETSI_support.asp Copyright Notification No
6、part may be reproduced except as authorized by written permission. The copyright and the foregoing restriction extend to reproduction in all media. European Telecommunications Standards Institute 2009. All rights reserved. DECTTM, PLUGTESTSTM, UMTSTM, TIPHONTM, the TIPHON logo and the ETSI logo are
7、Trade Marks of ETSI registered for the benefit of its Members. 3GPPTM is a Trade Mark of ETSI registered for the benefit of its Members and of the 3GPP Organizational Partners. LTE is a Trade Mark of ETSI currently being registered for the benefit of its Members and of the 3GPP Organizational Partne
8、rs. GSM and the GSM logo are Trade Marks registered and owned by the GSM Association. ETSI ETSI TS 105 174-2-2 V1.1.1 (2009-10) 3Contents Intellectual Property Rights 6g3Foreword . 6g3Introduction 6g31 Scope 7g32 References 8g32.1 Normative references . 8g32.2 Informative references 9g33 Definitions
9、 and abbreviations . 9g33.1 Definitions 9g33.2 Abbreviations . 11g34 Overview of data centres 12g34.1 Types of data centres 12g34.2 Tiering of data centres 13g34.2.1 Tiers and criticality . 13g34.2.2 ANSI/TIA-942 13g34.2.3 Uptime Institute 13g34.2.4 Criticality levels 14g34.2.5 Tiers and costs 14g34
10、.3 Issues faced by data centres 15g34.3.1 General 15g34.3.2 Current issues 16g34.3.2.1 Overview . 16g34.3.2.2 Principle issues 16g34.3.2.3 Operator data centres. 17g34.3.3 Evolution and future trends . 17g34.3.3.1 Power and cooling demands of IT equipment . 17g34.3.3.2 New projects . 17g34.3.3.3 Dat
11、a centre consolidation programmes . 18g34.3.3.4 Environmental impacts 18g34.4 The new context . 18g34.4.1 Energy consumption and energy efficiency 18g34.4.2 Factors impacting energy efficiency . 19g34.4.3 On-going initiatives 19g35 Energy efficiency standards and metrics 20g35.1 Review of activities
12、 outside ETSI 20g35.1.1 EU Code of Conduct on Data Centres Energy Efficiency 20g35.2 Energy consumption in data centres . 20g35.3 Energy Efficiency Key Performance Indicators (KPIs) . 21g35.3.1 Power Usage Effectiveness (PUE) or Data Centre Infrastructure Efficiency (DCIE) 21g35.3.1.1 General 21g35.
13、3.1.2 PUE for new data centres 22g35.3.1.3 PUE in existing data centres 23g35.3.2 Other KPIs 24g35.3.2.1 Energy efficiency KPI . 24g35.3.2.2 Consolidation KPI . 24g35.3.2.3 Data collection 25g36 Increasing the energy efficiency of IT infrastructures 25g36.1 General . 25g36.2 3 Tier Software Architec
14、ture Model . 25g36.3 Energy efficiency solutions 26g36.3.1 Obsolete equipment 26g36.3.2 Replacement equipment 26g3ETSI ETSI TS 105 174-2-2 V1.1.1 (2009-10) 46.3.3 Power and capacity management 26g36.3.3.1 General 26g36.3.3.2 Power management . 26g36.3.3.2.1 Activation of basic power management featu
15、res . 26g36.3.3.2.2 Activation of “sleep“ mode 27g36.3.3.2.3 Reduction of energy consumption of environmental control equipment . 28g36.3.3.3 Capacity management . 28g36.3.3.3.1 General 28g36.3.3.3.2 Environmental capacity management 29g36.3.3.3.3 Storage . 29g36.3.3.3.4 Servers. 29g36.3.3.3.5 On-de
16、mand scalability for on-line business. 29g36.3.4 Consolidation initiatives . 29g36.3.4.1 Consolidation of servers 29g36.3.4.2 Physical consolidation . 30g36.3.4.2.1 The process 30g36.3.4.2.2 The effects . 30g36.3.4.3 Virtualization 30g36.3.4.3.1 The process 30g36.3.4.3.2 The effects . 30g36.3.4.3.3
17、Reduction of energy consumption of IT infrastructure 30g36.3.4.3.4 Reduction of energy consumption of environmental control equipment . 31g36.3.4.4 Logical consolidation 31g36.3.4.4.1 The process 31g36.3.4.4.2 The effects . 32g36.3.4.5 Application consolidation . 32g36.3.4.5.1 General 32g36.3.4.5.2
18、The process 32g36.3.4.5.3 The effects . 33g37 Reducing the energy demand of environmental control systems . 33g37.1 General . 33g37.2 Energy reduction solutions . 34g37.2.1 Measurement of thermal behaviour 34g37.2.2 Improvement of cooling efficiency . 34g37.2.2.1 Zonal approaches to thermal isolatio
19、n. 34g37.2.2.1.1 General 34g37.2.2.1.2 Hot aisle and cold aisle segregation. 34g37.2.2.1.3 Cold aisle covers 34g37.2.2.1.4 Segregation using curtains . 35g37.2.2.1.5 High density areas . 35g37.2.2.2 Reduction of thermal waste in cabinets/racks . 36g37.2.3 Modification of temperature and humidity . 3
20、7g37.2.3.1 General 37g37.2.3.2 Results of experimentation 37g37.2.3.3 Time before “system-shutdown“ . 38g37.2.3.4 Restrictions on implementation . 39g37.2.4 Alternative cooling mechanisms . 39g37.2.4.1 Free cooling. 39g37.2.4.2 Direct liquid cooling . 41g37.2.4.3 Emerging technology (auto cooled cha
21、ssis or chip-level cooling) 41g37.2.4.3.1 Cooling-on-the-chip 41g37.2.4.3.2 Auto-cooled chassis . 41g37.2.5 Enhancements of cooling systems 41g38 Infrastructure requirements to optimize energy efficiency. 42g39 Improvement of energy efficiency of power distribution systems . 42g39.1 General . 42g39.
22、2 Uninterruptible Power Supplies (UPS). 43g39.2.1 Efficiency 43g39.2.2 Modular UPS 44g39.3 Energy efficiency improvement solutions 45g3ETSI ETSI TS 105 174-2-2 V1.1.1 (2009-10) 59.3.1 Measurement of energy efficiency of existing equipment 45g39.3.2 Energy capacity management . 45g39.3.3 Review of po
23、licy . 45g39.3.3.1 General 45g39.3.3.2 HVDC versus AC 45g39.3.4 High efficiency distribution equipment 45g39.3.5 Backup power . 46g310 Energy efficiency within existing data centres . 46g311 Energy efficiency within new data centres . 46g311.1 General . 46g311.2 Multi-disciplinary approach . 47g311.
24、2.1 Location 47g311.2.2 Energy sources 47g311.2.2.1 Main energy 47g311.2.2.2 Backup energy . 48g311.2.3 Building conception 48g311.2.4 Internal design 48g311.2.5 Energy and cooling . 49g311.2.6 IT infrastructure 49g311.2.7 Software 49g311.2.8 Processes . 50g312 Conformance 50g312.1 Existing data cen
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