EN ISO 9455-17-2006 en Soft soldering fluxes - Test methods - Part 17 Surface insulation resistance comb test and electrochemical migration test of flux residues《软钎焊剂的试验方法 第17部分 钎焊.pdf

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1、BRITISH STANDARDBS EN ISO 9455-17:2006Incorporating Amendment No. 1 (renumbers BS ISO 9455-17:2002 as BS EN ISO 9455-17:2006)Soft soldering fluxes Test methods Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residuesThe European Standard EN ISO 9455-17:200

2、6 has the status of a British StandardICS 25.160.50g49g50g3g38g50g51g60g44g49g42g3g58g44g55g43g50g56g55g3g37g54g44g3g51g40g53g48g44g54g54g44g50g49g3g40g59g38g40g51g55g3g36g54g3g51g40g53g48g44g55g55g40g39g3g37g60g3g38g50g51g60g53g44g42g43g55g3g47g36g58BS EN ISO 9455-17:2006This British Standard was p

3、ublished under the authority of the Standards Policy and Strategy Committee on 21 March 2003 BSI 2006ISBN 0 580 41451 5National forewordThis British Standard is the official English language version of EN ISO 9455-17:2006.The UK participation in its preparation was entrusted to Technical Committee N

4、FE/27/4, Solders and soldering fluxes, which has the responsibility to: A list of organizations represented on this committee can be obtained on request to its secretary.Cross-referencesThe British Standards which implement international or European publications referred to in this document may be f

5、ound in the BSI Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Search” facility of the BSI Electronic Catalogue or of British Standards Online.This publication does not purport to include all the necessary provisions of a contract. Users are res

6、ponsible for its correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep

7、 UK interests informed; monitor related international and European developments and promulgate them in the UK.Summary of pagesThis document comprises a front cover, an inside front cover, the EN ISO title page, the EN ISO foreword page, the ISO title page, pages ii to iv, pages 1 to 21 and a back co

8、ver.The BSI copyright date displayed in this document indicates when the document was last issued.Amendments issued since publicationAmd. No. Date Comments16425 29 September 2006 Renumbers BS ISO 9455-17:2002 as BS EN ISO 9455-17:2006EUROPEAN STANDARDNORME EUROPENNEEUROPISCHE NORMEN ISO 9455-17June

9、2006ICS 25.160.50English VersionSoft soldering fluxes - Test methods - Part 17: Surface insulationresistance comb test and electrochemical migration test of fluxresidues (ISO 9455-17:2002)Flux de brasage tendre - Mthodes dessai - Partie 17:Essai au peigne et essai de migration lectrochimique dersist

10、ance disolement de surface des rsidus de flux (ISO9455-17:2002)Flussmittel zum Weichlten - Prfverfahren - Teil 17:Bestimmung des Widerstandes der Oberflchenisolierung,Kammprfung und elektrochemische Migrationsprfungvon Flussmittelrckstnden (ISO 9455-17:2002)This European Standard was approved by CEN

11、 on 2 June 2006.CEN members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this EuropeanStandard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such nationalstandards may be

12、 obtained on application to the Central Secretariat or to any CEN member.This European Standard exists in three official versions (English, French, German). A version in any other language made by translationunder the responsibility of a CEN member into its own language and notified to the Central S

13、ecretariat has the same status as the officialversions.CEN members are the national standards bodies of Austria, Belgium, Cyprus, Czech Republic, Denmark, Estonia, Finland, France,Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Po

14、rtugal, Romania,Slovakia, Slovenia, Spain, Sweden, Switzerland and United Kingdom.EUROPEAN COMMITTEE FOR STANDARDIZATIONCOMIT EUROPEN DE NORMALISATIONEUROPISCHES KOMITEE FR NORMUNGManagement Centre: rue de Stassart, 36 B-1050 Brussels 2006 CEN All rights of exploitation in any form and by any means

15、reservedworldwide for CEN national Members.Ref. No. EN ISO 9455-17:2006: EForeword The text of ISO 9455-17:2002 has been prepared by Technical Committee ISO/TC 44 “Welding and allied processes” of the International Organization for Standardization (ISO) and has been taken over as EN ISO 9455-17:2006

16、 by Technical Committee CEN/TC 121 “Welding“, the secretariat of which is held by DIN. This European Standard shall be given the status of a national standard, either by publication of an identical text or by endorsement, at the latest by December 2006, and conflicting national standards shall be wi

17、thdrawn at the latest by December 2006. According to the CEN/CENELEC Internal Regulations, the national standards organizations of the following countries are bound to implement this European Standard: Austria, Belgium, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hung

18、ary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and United Kingdom. Endorsement notice The text of ISO 9455-17:2002 has been approved by CEN as EN ISO 9455-17:2006 without any modificat

19、ions. EN ISO 9455-17:2006Reference numberISO 9455-17:2002(E)INTERNATIONAL STANDARD ISO9455-17First edition2002-12-15Soft soldering fluxes Test methods Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues Flux de brasage tendre Mthodes dessai Partie 17:

20、 Essai au peigne et essai de migration lectrochimique de rsistance disolement de surface des rsidus de flux EN ISO 9455-17:2006iiIS-5549 O71:(2002E) I SO 2002 All irhgts seredevr iiiContents Page Foreword iv 1 Scope 1 2 Normative references . 1 3 Principle . 1 4 Reagents 2 5 Apparatus. 2 6 Inspectio

21、n of test coupons 6 7 Sample preparation. 7 8 Procedure. 9 9 Assessment . 13 10 Precision 14 11 Test report 14 Annex A (informative) SIR testing guidance 16 Annex B (informative) Surface insulation resistance comb test and electrochemical migration test of flux residues Qualification test report . 1

22、8 Bibliography . 21 iiiEN ISO 9455-17:2006vi I SO 2002 All irhgts seredevrForeword ISO (the International Organization for Standardization) is a worldwide federation of national standards bodies (ISO member bodies). The work of preparing International Standards is normally carried out through ISO te

23、chnical committees. Each member body interested in a subject for which a technical committee has been established has the right to be represented on that committee. International organizations, governmental and non-governmental, in liaison with ISO, also take part in the work. ISO collaborates close

24、ly with the International Electrotechnical Commission (IEC) on all matters of electrotechnical standardization. International Standards are drafted in accordance with the rules given in the ISO/IEC Directives, Part 2. The main task of technical committees is to prepare International Standards. Draft

25、 International Standards adopted by the technical committees are circulated to the member bodies for voting. Publication as an International Standard requires approval by at least 75 % of the member bodies casting a vote. Attention is drawn to the possibility that some of the elements of this docume

26、nt may be the subject of patent rights. ISO shall not be held responsible for identifying any or all such patent rights. ISO 9455-17 was prepared by Technical Committee ISO/TC 44, Welding and allied processes, Subcommittee SC 12, Soldering and brazing materials. ISO 9455 consists of the following pa

27、rts, under the general title Soft soldering fluxes Test methods: Part 1: Determination of non-volatile matter, gravimetric method Part 2: Determination of non-volatile matter, ebulliometric method Part 3: Determination of acid value, potentiometric and visual titration methods Part 5: Copper mirror

28、test Part 6: Determination and detection of halide (excluding fluoride) content Part 8: Determination of zinc content Part 9: Determination of ammonia content Part 10: Flux efficacy tests, solder spread method Part 11: Solubility of flux residues Part 12: Steel tube corrosion test Part 13: Determina

29、tion of flux spattering Part 14: Assessment of tackiness of flux residues Part 15: Copper corrosion test Part 16: Flux efficacy tests, wetting balance method Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues ivEN ISO 9455-17:2006IS-5549 O71:(2002E)I

30、 SO 2002 All irhgts seredevr 1Soft soldering fluxes Test methods Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues 1 Scope This part of ISO 9455 specifies a method of testing for deleterious effects that may arise from flux residues after soldering

31、or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified in ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) solders (ISO 9453:1990, Class E). NO

32、TE This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated

33、 references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. ISO 5725-2, Accuracy (trueness and precision) of measurement methods and results Part 2: Basic method for the determination of repeatability and repr

34、oducibility of a standard measurement method ISO 9453:1990, Soft solder alloys Chemical compositions and forms ISO 12224-1:1997, Solder wire, solid and flux cored Specification and test methods Part 1: Classification and performance requirements IEC 61249-2-7:2002, Materials for printed boards and o

35、ther interconnecting structures Part 2-7: Reinforced base materials clad and unclad Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad IEC 60068-2-20, Environmental testing Part 2: Tests Test T: Soldering IPC-TM-6501), Test Methods Manual (TM 2.6.3.3 S

36、urface Insulation Resistance, Fluxes) (Test pattern IPC-B-24) 3 Principle The objective of this test method is to characterize fluxes by determining the degradation of electrical resistance and the electrochemical migration of rigid printed wiring coupon specimens after exposure to the specified flu

37、x. This test is carried out at high humidity and heat conditions under bias voltage. For fluxes which may leave undesirable residues and hence require cleaning, the results obtained from the test will depend on the characteristics of the flux residue, substrate, metallization, and also on the effect

38、iveness of the cleaning operation. 1) Obtainable from: IPC, 2215 Sanders Road, Northbrook, IL, 60062-6135. 1EN ISO 9455-17:20062 I SO 2002 All irhgts seredevrThe measurement of surface insulation resistance (SIR) makes use of a printed wiring coupon substrate having one or more conductive interleave

39、d test patterns. Prior to being subjected to conditioning, the interleaved test patterns are fluxed, soldered or tinned, and cleaned (when required). The patterns are then exposed to a controlled environment for a specified time, with an applied voltage. The surface insulation resistance is measured

40、 using insulation test apparatus, at a suitable test voltage while the test coupons are in the controlled environment. 4 Reagents In the test use only reagents of recognized analytical grade or higher and only distilled, or deionized water, with a conductivity of less than 0,5 S/cm (resistivity W 2

41、MA.cm). 4.1 Propan-2-ol, (CH3)2CHOH or other suitable solvent. 4.2 Cleaning solvent (where required), recommended by the flux manufacturer as suitable for the removal of post soldering flux residues, or propan-2-ol. 5 Apparatus Equipment shall be capable of demonstrating repeatability in accordance

42、with the gauge r and R methodology specified in ISO 5725-2. 5.1 Low profile container, e.g. a Petri dish or a watch glass. 5.2 Drying oven, suitable for use at up to 120 C 3 C. 5.3 Insulated wire or cable, tin coated single copper conductor, 1 000 V general purpose wire, temperature rated to 150 C;

43、primary insulation of radiation-crosslinked, extruded polyalkene; primary jacket of radiation-crosslinked, extruded polyvinylidene fluoride; configuration suitable for equipment in use. 5.4 Connector, 64-position, glass filled polyester body with the following properties: 1,27 mm 10,67 mm (0,05 in 0

44、,42 in) on 2,54 mm (0,10 in) centres; 32 tabs, gold plated over nickel plate over copper; 0,762 m (0,000 03 in) gold plated post/pin mating end; bifurcated beam contacts; for coupon thickness of 1,40 mm to 1,78 mm (0,055 in to 0,070 in); capable of withstanding temperatures up to 105 C. 5.5 Test cou

45、pon, conforming to IPC B-24, specified in IPC-TM-650 (see Figure 1). It shall be single sided copper clad epoxide woven glass fabric laminate conforming to IEC 61249-2-7 with nominal thickness of 1,5 mm, clad copper foil with a nominal thickness of 18 m. The final finish of the circuit conductors sh

46、all be bare copper (without preservative). This test substrate is referred to as the “test coupon” comprising four (4) “test patterns”. The dimensions of the test coupon shall be 101,6 mm 114,4 mm (4,0 in 4,5 in). The connections of the test coupon (connectors with gold-to-gold mechanical contacts)

47、shall be: 32 tabs, gold plated over nickel plate over copper; 1,27 mm 10,67 mm (0,05 in 0,42 in) on 2,54 mm (0,10 in) centres 2EN ISO 9455-17:2006IS-5549 O71:(2002E) I SO 2002 All irhgts seredevr 3The test pattern shall be: 0,4 mm (0,016 in) width 0,5 mm (0,020 in) spacing 15,25 mm (0,6 in) overlap

48、34 overlapping spaces 1 040 squares (nominal) NOTE Spaces are determined by counting the number of overlapping areas per pattern. Squares are determined by the following formula: length of overlap number of spaces1040 squaresspacing width Figure 1 Resistor verification coupon (Reproduced with permis

49、sion) 5.6 Soldering equipment. 5.6.1 Flux-cored solder wire, conforming to S-Sn60Pb40E/1.1.1 or S-Sn63Pb37E/1.1.1 of ISO 12224-1:1997. NOTE This wire consists of 60/40 or 63/37 tin/lead solder wire with a core of non-activated rosin (colophony) flux (classification 1.1.1, non-activated of ISO 9454-1:1990). 3EN ISO 9455-17:20064 I SO 2002 All irhgts seredevr5.6.2 Wave solder system, comprising a wave soldering machine where the sol