EN ISO 9455-10-2012 en Soft soldering fluxes - Test methods - Part 10 Flux efficacy test solder spread method《软钎焊钎焊剂 测试方法 第10部分 通量功效测试 焊接传播方法》.pdf

《EN ISO 9455-10-2012 en Soft soldering fluxes - Test methods - Part 10 Flux efficacy test solder spread method《软钎焊钎焊剂 测试方法 第10部分 通量功效测试 焊接传播方法》.pdf》由会员分享，可在线阅读，更多相关《EN ISO 9455-10-2012 en Soft soldering fluxes - Test methods - Part 10 Flux efficacy test solder spread method《软钎焊钎焊剂 测试方法 第10部分 通量功效测试 焊接传播方法》.pdf（18页珍藏版）》请在麦多课文档分享上搜索。

1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI Standards PublicationSoft soldering fluxes Test methodsPart 10: Flux efficacy test, solder spread methodBS EN ISO 9455-10:2012National forewordThis British Standard is the UK implementation of EN ISO

2、 9455-10:2012. It supersedes BS EN ISO 9455-10:2001 which is withdrawn.The UK participation in its preparation was entrusted by Technical Committee NFE/27, Tin and tin alloys, to Subcommittee NFE/27/4, Solders and soldering fluxes.BSI, as a member of CEN, is obliged to publish EN ISO 9455-10 as a Br

3、itish Standard. However, attention is drawn to the fact that during the development of this European Standard, the UK voted against its approval as a European Standard.The UK Technical subcommittee NFE/27/4, Solders and soldering fluxes, submitted a negative vote due to the following: The test metho

4、d uses brass test plates, on which the solder spread is measured. However, note 2 to paragraph 7.1 states that “an alternative is 10 oxidized copper test plates, each of dimensions 40 mm 40 mm, cut from phosphorus deoxidized sheet, 0,5 mm thick, complying with ISO 197-1,1 for each flux being tested.

5、” It is thus envisaged that the solder spread can be measured on oxidised copper instead of brass. Paragraph 8.1 describes the preparation of the test plates prior to testing the extent of solder spread. This involves, inter alia, dipping the plates into a strong solution comprising sulphuric and ni

6、tric acids. As copper oxide reacts with both sulphuric and nitric acids, the effect of this would be to remove any oxidation from the surface, therefore, it would no longer be an oxidised copper plate. The note to paragraph 8.1 states This preparation method is applicable to both brass and copper te

7、st plates.There is a lack of clarity as whether testing is permitted to both brass and oxi-dised test plates, as per clause 8.1, or whether it is confined to brass test plates, as per clause 7.1.A list of organizations represented on this committee can be obtained on request to its secretary.This pu

8、blication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. The British Standards Institution 2012Published by BSI Standards Limited 2012ISBN 978 0 580 72886 0ICS 25.160.50Compliance with a British Standard cannot confer immuni

9、ty from legal obligations.This British Standard was published under the authority of the Standards Policy and Strategy Committee on 30 November 2012.Amendments issued since publicationDate Text affectedBRITISH STANDARDBS EN ISO 9455-10:2012EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN ISO 945

10、5-10 September 2012 ICS 25.160.50 Supersedes EN ISO 9455-10:2000English Version Soft soldering fluxes - Test methods - Part 10: Flux efficacy test, solder spread method (ISO 9455-10:2012) Flux de brasage tendre - Mthodes dessai - Partie 10: Essai defficacit du flux, mthode dtalement (ISO 9455-10:201

11、2) Flussmittel zum Weichlten - Prfverfahren - Teil 10: Bestimmung der Wirksamkeit des Flussmittels, Ausbreitungsprfung (ISO 9455-10:2012) This European Standard was approved by CEN on 14 September 2012. CEN members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the con

12、ditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CEN member. This European Standard exis

13、ts in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CEN member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CEN members are the national sta

14、ndards bodies of Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia, S

15、lovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom. EUROPEAN COMMITTEE FOR STANDARDIZATION COMIT EUROPEN DE NORMALISATION EUROPISCHES KOMITEE FR NORMUNG Management Centre: Avenue Marnix 17, B-1000 Brussels 2012 CEN All rights of exploitation in any form and by any means reserved worldwid

16、e for CEN national Members. Ref. No. EN ISO 9455-10:2012: EBS EN ISO 9455-10:2012EN ISO 9455-10:2012 (E) 2 Contents Page Foreword 3BS EN ISO 9455-10:2012EN ISO 9455-10:2012 (E) 3 Foreword This document (EN ISO 9455-10:2012) has been prepared by Technical Committee ISO/TC 44 “Welding and allied proce

17、sses“ in collaboration with Technical Committee CEN/TC 121 “Welding” the secretariat of which is held by DIN. This European Standard shall be given the status of a national standard, either by publication of an identical text or by endorsement, at the latest by March 2013, and conflicting national s

18、tandards shall be withdrawn at the latest by March 2013. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CEN and/or CENELEC shall not be held responsible for identifying any or all such patent rights. This document supersedes EN I

19、SO 9455-10:2000. According to the CEN/CENELEC Internal Regulations, the national standards organisations of the following countries are bound to implement this European Standard: Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Maced

20、onia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. Endorsement notice The text of ISO 9455-10:2012 has been approved by C

21、EN as a EN ISO 9455-10:2012 without any modification. BS EN ISO 9455-10:2012ISO 9455-10:2012(E) ISO 2012 All rights reserved iiiContents Page1 Scope 12 Normative references . 13 Symbols . 14 Principle . 15 Reagents 26 Apparatus and materials . 27 Test specimens 37.1 Brass test plates 37.2 Solder sam

22、ple . 38 Procedure 38.1 Preparation of test plates 38.2 Test method 38.3 Replicate tests 49 Expression of results . 410 Precision 411 Test report . 5Annex A (informative) Method for the preparation of standard reference rosin (colophony) based liquid fluxes, having 25 % by mass non-volatile content

23、. 6Annex B (informative) Chemical composition of brass test plates . 8Bibliography . 9BS EN ISO 9455-10:2012INTERNATIONAL STANDARD ISO 9455-10:2012(E)Soft soldering fluxes Test methods Part 10: Flux efficacy test, solder spread method1 ScopeThis part of ISO 9455 specifies a method for the determinat

24、ion of the efficacy of a soft soldering flux. The method is known as the solder spread method of filler metal and is applicable to all flux classes defined in ISO 9454-1.NOTE An alternative method for the determination of the flux efficacy, applicable to liquid fluxes only, known as the wetting bala

25、nce method, is specified in ISO 9455-16.32 Normative referencesThe following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendme

26、nts) applies.ISO 9453, Soft solder alloys Chemical compositions and formsISO 9454-1:1990, Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging3 SymbolsAarithmetic mean spread area, in square millimetresH height of spread solder, in millimetresD diamet

27、er, in millimetres, when the solder used is considered as a sphere, D = 1,24 V1/3R reproducibilityr repeatabilityswstandard deviation within laboratorysbstandard deviation between laboratories density, in grams per millilitre, of solder under test at the test temperatureV volume, in millilitres, of

28、the solder used4 PrincipleA specially prepared brass test sheet is treated with a known quantity of the flux under test and a standard quantity of specified solder alloy. Upon heating, the solder alloy melts and spreads across the surface of the brass test sheet, the extent of spread being a measure

29、 of the flux efficacy. The area covered by the solder is determined by means of a planimeter or other suitable technique. ISO 2012 All rights reserved 1BS EN ISO 9455-10:2012ISO 9455-10:2012(E)This test method is applicable to all fluxes. If required, the efficacy of the flux sample under test can b

30、e compared with that of a standard flux (see Annex A).NOTE It is possible to use copper as the test surface. However, it is preferable to use brass as the test surface in order to distinguish between various fluxes because it provides a better surface for differentiation than copper does.5 ReagentsU

31、se only reagents of recognized analytical grade and distilled or demineralized water or water of equivalent purity.5.1 Acid preparation solution, prepared in a fume cupboard by cautiously mixing the following ingredients in the order given, cooling as necessary. 140 ml water; 225 ml nitric acid ( =

32、1,42 g/ml); 600 ml sulfuric acid ( = 1,84 g/ml); 5 g sodium chloride; 18 ml copper solution (5.2).Thoroughly mix the solution.This preparation solution shall be freshly prepared every day.WARNING The mixture is extremely corrosive and produces hazardous fumes.5.2 Copper solution, prepared by dissolv

33、ing 10 g pure copper turnings in 100 ml of 50 % by volume nitric acid solution ( = 1,42 g/ml).5.3 Industrial methylated spirits.5.4 Acetone.6 Apparatus and materials6.1 Solder bath, containing not less than 4 kg of molten solder. The liquid solder in the bath shall be at least 25 mm in depth, with a

34、 surface area easily capable of accommodating the test specimen. As a minimum, the bath temperature shall be capable of being maintained at a set temperature of the liquidus temperature of the alloy in the test plus 35 C. The test temperature shall be documented.6.2 Tongs, or other suitable mechanic

35、al device, for lowering the brass test plate (7.1), in a horizontal plane, onto the surface of the liquid solder in the bath (6.1) and raising it again, also in a horizontal plane.6.3 Planimeter, suitable for measuring surface areas of the order of 100 mm2.6.4 Microsyringe, or micropipette, capable

36、of delivering 25 l (i.e. 0,025 ml).6.5 Plastic tweezers or tongs, for use in the cleaning procedure for test plates.6.6 Micrometer, as specified in ISO 3611.26.7 Filter paper, for use in cleaning procedure for test plates.2 ISO 2012 All rights reservedBS EN ISO 9455-10:2012ISO 9455-10:2012(E)7 Test

37、specimens7.1 Brass test platesEach plate shall be of dimensions 40 mm 40 mm. Prepare 10 plates, of alloy CuZn37 or CuZn40, cut from brass sheet 0,5 mm thick, for each flux being tested.NOTE 1 Annex B gives the chemical composition of these two brasses.NOTE 2 An alternative is 10 oxidized copper test

38、 plates, each of dimensions 40 mm 40 mm, cut from phosphorus deoxidized sheet, 0,5 mm thick, complying with ISO 197-1,1for each flux being tested.NOTE 3 One corner of the test plate can be bent, to facilitate handling with the tongs (6.2).7.2 Solder sampleClean a length of solid solder wire as agree

39、d between the contracting parties, with a diameter of 1 mm 0,05 mm, weighing between 0,49 g and 0,50 g with a filter paper soaked in industrial methylated spirits (5.3) or acetone (5.4). Wind the length of wire into a tight, flat spiral for use in the test. After cleaning, handle the solder wire onl

40、y with clean cotton gloves.The solder used for the test and the test temperature shall be selected from one of the following: S-Sn60Pb40 (in accordance with ISO 9453) at 235 C 3 C; S-Sn96Ag3Cu1 (in accordance with ISO 9453) at 255 C 3 C; any other solder or temperature combinations as agreed between

41、 the customer and the flux supplier for test temperatures, see 6.1.8 Procedure8.1 Preparation of test platesImmediately before use, pretreat the 10 test pieces in the following manner; handle with clean tongs or with a suitable mechanical device (6.2).Degrease the test plates (7.1) thoroughly in ace

42、tone (5.4) and allow to dry in clean air.Immerse each test plate separately for approximately 15 s in the acid preparation solution (5.1) using the plastic tweezers or tongs (6.5). Hold the solution at a temperature between 15 C and 25 C.Wash the test plates in water for a maximum of 5 s.Repeat the

43、acid preparation operation not more than three times, until a uniform matt lustre on the surface of the test plates has been attained.After the final rinsing in water, rinse the test plates in methylated spirits (5.3) and dry them with filter paper (6.7).NOTE This preparation method is applicable to

44、 both brass and copper test plates.8.2 Test methodImmediately after the cleaning operation specified in 8.1, take one of the test plates and apply the flux sample under test to the central region of the plate, in accordance with a) or b):a) for liquid flux samples: measure 0,025 ml 0,001 25 ml of th

45、e flux sample by means of the microsyringe or micropipette (6.4);b) for paste and solid flux samples: weigh 0,025 g 0,001 25 g of the flux sample. ISO 2012 All rights reserved 3BS EN ISO 9455-10:2012ISO 9455-10:2012(E)Place a solder sample (7.2) in the middle of the test plate. Lower the test plate,

46、 with its plane horizontal, on to the surface of the solder in the solder bath of filler metal (6.1).After 5 s of the start of spreading, remove the test plate from the solder bath, keeping it in a horizontal plane until it has cooled to room temperature.Remove the flux residue with a suitable solve

47、nt.Determine the area, in square millimretres, covered by the melted solder alloy by use of the planimeter (6.3), or measure the height of the solder by use of a micrometer (6.6) and calculate the ratio of spread, expressed as a percentage, by the formula:DHD100whereH is the height of spread solder,

48、 in millimetres;D is the diameter, in millimetres, when the solder used is considered as a sphere, D = 1,24 V1/3 ;V is the volume, in millilitres, of the solder used.8.3 Replicate testsUsing the remaining nine test plates, re-prepare as specified in 8.1, repeat the test method specified in 8.2, calc

49、ulating either the area or the ratio of spread as in the original sample.9 Expression of resultsThe efficacy of the flux sample under test is expressed as the arithmetic mean and the standard deviation of the 10 areas of spread, in square millimetres or ratios of spread, expressed as a percentage, measured in the tests carried out as described in Clause 8.The efficacy of the flux sample under test may also be expressed in comparison with results obtained by using the test descr