EN 62047-21-2014 en Semiconductor devices - Micro-electromechanical devices - Part 21 Test method for Poisson-s ratio of thin film MEMS materials.pdf
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1、BSI Standards PublicationSemiconductor devices Micro-electromechanical devicesPart 21: Test method for Poissons ratio of thin film MEMS materialsBS EN 62047-21:2014National forewordThis British Standard is the UK implementation of EN 62047-21:2014. It isidentical to IEC 62047-21:2014.The UK particip
2、ation in its preparation was entrusted to TechnicalCommittee EPL/47, Semiconductors.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions ofa contract. Users are responsible for its c
3、orrect application. The British Standards Institution 2014.Published by BSI Standards Limited 2014ISBN 978 0 580 77554 3ICS 31.080.99Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of theStandards Policy and Stra
4、tegy Committee on 31 October 2014.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS EN 62047-21:2014EUROPEAN STANDARDNORME EUROPENNEEUROPISCHE NORMEN 62047-21 September 2014 ICS 31.080.99 English Version Semiconductor devices - Micro-electromechanical devices - Part
5、21: Test method for Poissons ratio of thin film MEMSmaterials (IEC 62047-21:2014) Dispositifs semiconducteurs - Dispositifsmicrolectromcaniques - Partie 21: Mthode dessai relative au coefficient dePoisson des matriaux MEMS en couche mince (CEI 62047-21:2014) Halbleiterbauelemente - Bauelemente derMi
6、krosystemtechnik - Teil 21: Prfverfahren zur Querkontraktionszahl vonDnnschichtwerkstoffen der Mikrosystemtechnik (IEC 62047-21:2014) This European Standard was approved by CENELEC on 2014-07-24. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the condit
7、ions for giving this European Standard the status of a national standard without any alteration.Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exis
8、ts in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions.CENELEC members are the natio
9、nal electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Port
10、ugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization Comit Europen de Normalisation ElectrotechniqueEuropisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-100
11、0 Brussels 2014 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members. Ref. No. EN 62047-21:2014 E EN 62047-21:2014 - 2 - Foreword The text of document 47F/185/FDIS, future edition 1 of IEC 62047-21, prepared by SC 47F “Microelectromechanical systems”
12、 of IEC/TC 47 “Semiconductor devices“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 62047-21:2014. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsemen
13、t (dop) 2015-04-24 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2017-07-24 Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held responsible fo
14、r identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 62047-21:2014 was approved by CENELEC as a European Standard without any modification. BS EN 62047-21:2014- 3 - EN 62047-21:2014 Annex ZA (normative) Normative references to international publi
15、cations with their corresponding European publications The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenc
16、ed document (including any amendments) applies. NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here: w
17、ww.cenelec.eu Publication Year Title EN/HD Year IEC 62047-8 2011 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films EN 62047-8 2011 ASTM E132-04 2010 Standard test method for Poissons ratio at room temperature -
18、- BS EN 62047-21:2014 2 IEC 62047-21:2014 IEC 2014 CONTENTS 1 Scope 5 2 Normative references 5 3 Terms, definitions, symbols and designations 5 3.1 Terms and definitions 5 3.2 Symbols and designations 5 4 Test piece . 6 4.1 General . 6 4.2 Shape of the test piece . 7 4.3 Measurement of dimensions .
19、7 5 Testing method and test apparatus 7 5.1 Test principle 7 5.2 Test machine 7 5.3 Test procedure 7 5.3.1 Test procedure for type 1 test piece . 7 5.3.2 Test procedure for type 2 test piece . 8 5.4 Test environment 8 6 Test report . 8 Annex A (informative) Measurement example of Poissons ratio usin
20、g type 1 test piece . 9 A.1 Fabrication of the test piece 9 A.2 Dimensions of the test piece . 9 A.3 Test procedures 9 A.4 Test results . 10 Annex B (informative) Analysis of test results obtained from a type 2 test piece . 11 B.1 General . 11 B.2 Evaluation of stress and strain in circular and rect
21、angular membranes . 11 B.3 Evaluation of Poissons ratio . 12 Bibliography 13 Figure 1 Two types of test pieces for the measurement of Poissons ratio 6 Figure A.1 Optical images of markers for strain measurement by DIC 9 Figure A.2 Graphs of load and strain in the longitudinal and transverse directio
22、ns . 10 Table 1 Symbols and designations of a test piece 6 BS EN 62047-21:2014IEC 62047-21:2014 IEC 2014 5 SEMICONDUCTOR DEVICES MICRO-ELECTROMECHANICAL DEVICES Part 21: Test method for Poissons ratio of thin film MEMS materials 1 Scope This part of IEC 62047 specifies the determination of Poissons
23、ratio from the test results obtained by the application of uniaxial and biaxial loads to thin-film micro-electromechanical systems (MEMS) materials with lengths and widths less than 10 mm and thicknesses less than 10 m. 2 Normative references The following documents, in whole or in part, are normati
24、vely referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 62047-8:2011, Semiconductor devices Micro-electromechanical
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