EN 60749-30-2005 en Semiconductor devices - Mechanical and climatic test methods Part 30 Preconditioning of non-hermetic surface mount devices prior to reliability testing (Incorpo.pdf
《EN 60749-30-2005 en Semiconductor devices - Mechanical and climatic test methods Part 30 Preconditioning of non-hermetic surface mount devices prior to reliability testing (Incorpo.pdf》由会员分享,可在线阅读,更多相关《EN 60749-30-2005 en Semiconductor devices - Mechanical and climatic test methods Part 30 Preconditioning of non-hermetic surface mount devices prior to reliability testing (Incorpo.pdf(16页珍藏版)》请在麦多课文档分享上搜索。
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4、l nullnullnullBS EN 60749-30:2005+A1:2011National forewordThis British Standard is the UK implementation of EN 60749-30:2005+A1:2011. It is identical to IEC 60749-30:2005, incorporating amendment 1:2011. It supersedes BS EN 60749-30:2005 which is withdrawn.The start and finish of text introduced or
5、altered by amendment is indicated in the text by tags. Tags indicating changes to IEC text carry the number of the IEC amendment. For example, text altered by IEC amendment 1 is indicated by !“.The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors.A list
6、 of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application.Compliance with a British Standard cannot confer immunity from legal
7、obligations.BS EN 60749-30:2005+A1:2011This British Standard waspublished under the authorityof the Standards Policy andStrategy Committee on 27 January 2006 BSI 2011Amendments/corrigenda issued since publicationDate Comments 30 September 2011 Implementation of IEC amendment 1:2011 with CENELEC endo
8、rsement A1:2011ISBN 978 0 580 68749 5EUROPEAN STANDARD EN 60749-30NORME EUROPENNEEUROPISCHE NORM July 2011CENELECEuropean Committee for ElectrotechnicalStandardizationComit Europen de Normalisation ElectrotechniqueEuropisches Komitee fr Elektrotechnische NormungCentral Secretariat: rue de Stassart 3
9、5, B-1050 Brussels ICS 31.080.01English versionSemiconductordevices -Mechanical andclimatic test methods Part 30: Preconditioning of non-hermetic surface mount devicesprior to reliability testing(IEC 60749-30:2005)Dispositifs semiconducteurs -Mthodes dessais mcaniques et climatiques Partie 30: Prcon
10、ditionnement des composants pour montageen surface non hermtiques avant les essais de fiabilit(CEI 60749-30:2005)Halbleiterbauelemente -Mechanische und klimatischePrfverfahrenTeil 30: Behandlung nicht hermetischverkappter oberflchenmontierbarer Bauelemente vor Zuverlssigkeitsprfungen(IEC 60749-30:20
11、05)This European Standard was approved by CENELEC on 2005-02-01. CENELECmembers arebound tocomply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this EuropeanStandard the status ofanational standard without any alteration.Up-to-date lists andbibliographical refer
12、ences concerning such national standards may be obtained onapplication to the Central Secretariator to any CENELEC member.This European Standard exists in threeofficial versions (English,French, German).Aversion in anyotherlanguage made by translation under the responsibility of aCENELEC member into
13、 its ownlanguage andnotified to the Central Secretariat has the same status as the official versions.CENELEC members are the national electrotechnical committees of Austria, Belgium,Cyprus, CzechRepublic,Denmark, Estonia, Finland, France, Germany,Greece,Hungary,Iceland, Ireland, Italy,Latvia,Lithuan
14、ia, Luxembourg, Malta, Netherlands, Norway,Poland, Portugal, Slovakia, Slovenia, Spain, Sweden,Switzerlandand United Kingdom. 2005CENELEC -All rights of exploitationinany form and by any means reserved worldwide for CENELECmembers.Ref. No. EN 60749-30:2005 E:2005+A1ForewordThe text of document 47/17
15、90/FDIS, future edition 1ofIEC 60749-30, prepared by IEC TC 47,Semiconductor devices, was submitted to the IEC-CENELECparallel vote and was approved byCENELECas EN 60749-30on 2005-02-01.The following dates were fixed:latest date by which the EN has to be implementedat national level by publication o
16、f an identicalnational standardor by endorsement (dop) 2005-11-01latest date by which the national standards conflictingwith theENhave to be withdrawn (dow) 2008-02-01AnnexZAhas been added by CENELEC._Endorsement noticeThe text of the International Standard IEC 60749-30:2005 was approved by CENELEC
17、as aEuropeanStandard without any modification._Foreword to amendment A1 The text of document 47/2019/CDV, future amendment 1 to IEC 60749-30:2005, prepared by IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as amendment A1 to EN 60749-30:2
18、005 on 2011-06-29. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent rights. The following dates were fixed: latest date by which the amendment has
19、 to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2012-03-29 latest date by which the national standards conflicting with the amendment have to be withdrawn (dow) 2014-06-29 Annex ZA has been added by CENELEC. _ Endorsement notice The text
20、of amendment 1:2011 to the International Standard IEC 60749-30:2005 was approved by CENELEC as an amendment to the European Standard without any modification. _ BS EN 60749-30:2005+A1:2011 EN 60749-30:2005+A1:2011 (E) 2 nullnullnullnullnullnullnullnullnullnullnullnullnullnullnullnullnullnullnullnull
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