EN 60191-4-1999 en Mechanical standardization of semiconductor devices - Part 4 Coding system and classification into forms of package outlines for semiconductor device packages《半导.pdf

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1、BSI Standards PublicationMechanical standardization of semiconductor devicesPart 4: Coding system and classification into forms of package outlines for semiconductor device packagesBS EN 60191-4:2014National forewordThis British Standard is the UK implementation of EN 60191-4:2014. It is identical t

2、o IEC 60191-4:2013. It supersedes BS EN 60191-4:2000 which is withdrawn.The UK participation in its preparation was entrusted to TechnicalCommittee EPL/47, Semiconductors.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purpor

3、t to include all the necessary provisions ofa contract. Users are responsible for its correct application. The British Standards Institution 2014.Published by BSI Standards Limited 2014ISBN 978 0 580 71530 3ICS 31.080.01Compliance with a British Standard cannot confer immunity fromlegal obligations.

4、This British Standard was published under the authority of theStandards Policy and Strategy Committee on 31 March 2014.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS EN 60191-4:2014EUROPEAN STANDARD EN 60191-4 NORME EUROPENNE EUROPISCHE NORM March 2014 CENELEC Eur

5、opean Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B - 1000 Brussels 2014 CENELEC - All rights of exploitation in any form and by any means reserved wor

6、ldwide for CENELEC members. Ref. No. EN 60191-4:2014 E ICS 31.080 Supersedes EN 60191-4:1999 + A1:2002 + A2:2002 English version Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-

7、4:2013) Normalisation mcanique des dispositifs semiconducteurs - Partie 4: Systme de codification et classification en formes des botiers pour dispositifs semiconducteurs (CEI 60191-4:2013) Mechanische Normung von Halbleiterbauelementen - Teil 4: Codierungssystem fr Gehuse und Eingruppierung der Geh

8、use nach der Gehuseform fr Halbleiterbauelemente (IEC 60191-4:2013) This European Standard was approved by CENELEC on 2013-11-14. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national st

9、andard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A versio

10、n in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, C

11、roatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, T

12、urkey and the United Kingdom. BS EN 60191-4:2014EN 60191-4:2014 - 2 - Foreword The text of document 47D/837/FDIS, future edition 3 of IEC 60191-4, prepared by SC 47D, Semiconductor devices packaging, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved

13、 by CENELEC as EN 60191-4:2014. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2014-09-21 latest date by which the national standards conflicting with the EN have to be withd

14、rawn (dow) 2016-11-14 This European Standard supersedes EN 60191-4:1999 and its Amendments A1:2002 and A2:2002. EN 60191-4:2014 includes the following significant changes with respect to EN 60191-4:1999: a) Material code “S“ is added to indicate a silicon based package. b) Description of “WL“ is add

15、ed to be used for general use. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard

16、IEC 60191-4:2013 was approved by CENELEC as a European Standard without any modification. BS EN 60191-4:2014 2 60191-4 IEC:2013 CONTENTS 1 Scope . 5 2 Coding system of package outlines for semiconductor devices 5 3 Classification into forms of package outlines for semiconductor devices 5 4 Coding sy

17、stem for semiconductor-device packages . 6 4.1 General . 6 4.2 New descriptive codes . 6 4.3 Descriptive designators 6 4.3.1 General remarks 6 4.3.2 Minimum descriptive designator . 6 4.3.3 Terminal-position prefix 8 4.3.4 Package-body-material prefix . 8 4.3.5 Package-specific feature prefix 9 4.3.

18、6 Lead-form and terminal-count suffixes . 9 4.3.7 Detailed information field . 11 5 Coding system of package-outline styles . 12 Annex A (informative) Examples of descriptive coding system application . 15 Annex B (informative) Derivation and application of the descriptive coding system Common packa

19、ge names 22 Figure 1 Descriptive coding for semiconductor device packages . 7 Figure 2 Relationship of codes to profile . 10 Figure A.1 Typical package styles and descriptive coding system (1 of 4) . 17 Figure A.2 Examples of lead forms (or terminal shapes) . 21 Figure B.1 Descriptive coding system

20、for common name of semiconductor-device package 22 Table 1 Package-outline-style codes. 8 Table 2 Terminal-position prefixes 9 Table 3 Prefixes for predominant package-body material 10 Table 4 Prefixes for package-specific features 10 Table 5 Suffixes for lead form (or terminal shape) . 12 Table A.1

21、 Descriptive coding system application . 16 Table B.1 Basic package code and names 23 Table B.2 Common package name and descriptive code examples . 24 BS EN 60191-4:201460191-4 IEC:2013 5 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 4: Coding system and classification into forms of packa

22、ge outlines for semiconductor device packages 1 Scope This part of IEC 60191 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semic

23、onductor device packages. The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability. 2 Coding system of package outlines for semiconductor devices The following coding system will be used in the publications concerning mechanic

24、al standardization: first: a three-digit serial number (000 to 999); second: a single reference letter indicating the form as shown in Table 1; third: a two-digit serial number (00 to 99) to indicate a variant of an outline drawing. The use of prefix P to indicate a provisional drawing remains uncha

25、nged. Examples 101A00 050G13 P 101F01 3 Classification into forms of package outlines for semiconductor devices The package outline drawings for semiconductor devices are classified into forms according to the following scheme: form A: single-ended form B: heat-sink-mounted form C: stud-mounted form

26、 D: axial-leaded form E: surface-mounted form F: single-ended, heat-sink-mounted form G: dual and quad in-line form H: axial lead-less. BS EN 60191-4:2014 6 60191-4 IEC:2013 4 Coding system for semiconductor-device packages 4.1 General The standard coding system is a method for identifying the physi

27、cal features of an electronic device package family. The system is predicated upon a minimum two-character designator, which indicates the package outline style. This designator can be extended, through the use of optional, user-selected fields, to provide additional package information such as term

28、inal position and count, terminal form, package shape, and predominant body material. 4.2 New descriptive codes If a new package that does not conform to one of the designated field character codes is being proposed, a new code may be recommended for standardization. 4.3 Descriptive designators 4.3.

29、1 General remarks The package outline style code is the only compulsory field within this descriptive designation system. Additional information may be provided using optional prefixes and suffixes described by the system. In general, these fields are independent of one another. Unless otherwise ind

30、icated herein, the users of this system may pick and choose which of these fields they wish to implement for their specific application (see Figure 1). The descriptive designator may be extended with additional information, provided this information is separated from the descriptive designator by a

31、slash (/) (see 4.3.7). NOTE Basic package codes and names are presented in Table B.1. 4.3.2 Minimum descriptive designator The minimum descriptive designator is a two-letter code that classifies device packages into standard package outline styles. These styles identify general external physical fea

32、tures. Common two-letter descriptive codes or abbreviations are included, such as CC, FP, SO, GA. Figure A.1 shows two-letter codes for various device package outline styles and depicts examples of each. Table 1 lists the two-letter package-outline-style codes described in Clause 5. BS EN 60191-4:20

33、1460191-4 IEC:2013 7 Optional Optional Optional unless material prefix designator Minimum descriptive designator Optional Optional P S Q C C J 3 2 Material Features Position Package Form Count Figure 1 Descriptive coding for semiconductor device packages Terminal count (4.3.6.1, 4.3.6.2) A one-, two

34、-, or three-digit suffix Lead form (4.3.6.1, 4.3.6.2, Table 5, Figure A.2) A single-letter suffix Package outline style (4.3.2, Table 1, Figure A.1) A double-letter designator Terminal position (4.3.3, Table 2) A single-letter prefix Package-specific features (4.3.5, Table 4) A single-letter or mult

35、i- letter prefix Package-body material (4.3.4, Table 3) A single-letter prefix IEC 2560/13 BS EN 60191-4:2014 8 60191-4 IEC:2013 Table 1 Package-outline-style codes Form Code Outline style E CC Chip-carrier package B CP Clamped package (press-pack) A CY Cylinder or can package D/E DB Disk-button pac

36、kage F FM Flange-mount package A FO Fibre optic device package E FP Flatpack package G GA Grid-array package G IL In-line package. The preferred designator is IP. G IP In-line package or inserted package. Restrict to DIP/SIP/ZIP. D/H LF Long-form horizontal package MA Microelectronic assembly B MP P

37、ower module package MW Microwave package B PF Press-fit package C PM Post-(stud-) mount package E SO* Small-outline package A SS Special-shape package UC Uncased chip VP Vertical surface-mount package XA-XZ Non-defined family; vendor or user option * Industry practice sometimes uses “P“ for “package

38、“ in the location normally occupied by this field (except that there is no preceding hyphen), for example SOP. 4.3.3 Terminal-position prefix The two-letter, package-outline-style code may be supplemented with a single-letter prefix that identifies the physical terminal positions or, if applicable,

39、the interconnect land pattern. Examples of three-letter designators include common acronyms or abbreviations, such as DIP, LCC (QCC preferred), PGA, QFP, SIP, ZIP. NOTE 1 A terminal is defined as an externally available point of connection. NOTE 2 The proper terminal-position prefix is determined by

40、 the interconnect land structure. For example, the code for a single row of terminals formed into a staggered configuration would be “Z“. Table 2 gives a list of one-letter, terminal-position prefix codes. 4.3.4 Package-body-material prefix The three-letter descriptive designator (see 4.3.2) may be

41、further supplemented by a single-letter prefix that identifies the predominant package-body material. This prefix shall not be used unless the terminal-position prefix described in 4.3.2 is also used. Examples of such four-letter descriptive designators include common acronyms or abbreviations, such

42、 as CDIP, PDIP, PLCC (PQCC preferred), MELF, PQFP. Table 3 gives a list of one-letter package-body-material prefix codes. BS EN 60191-4:201460191-4 IEC:2013 9 If the package-body material is other than one of those defined in Table 3, the letter “X“ shall be used within the descriptive designator to

43、 signify a special or new material and shall later be replaced with an IEC-approved code. 4.3.5 Package-specific feature prefix Package-specific features may be described through the use of a multiletter prefix. The package-specific feature prefix shall be set off from the following portion of the d

44、escriptive designator by a dash (). Table 4 gives a list of package-specific feature prefix codes. Figure 2 shows the relationship of codes to profile and pitch. 4.3.6 Lead-form and terminal-count suffixes 4.3.6.1 General lead-form and number of terminals The general lead form (or terminal shape) an

45、d/or the number of terminals on a package may be described through the use of two fields, the lead-form suffix and the terminal-count suffix. These two fields shall be set off from the preceding portion of the descriptive designator by a dash (). Users of this system may choose to use the lead-form

46、suffix, or the terminal-count suffix, or both. If the lead-form suffix is used in conjunction with the terminal-count suffix, it shall precede the terminal-count suffix. Table 2 Terminal-position prefixes Code Name Position a) b)A Axial Terminals extend from both ends in the direction of the major a

47、xis of a cylindrical or elliptical package B Bottom Terminals extend from the bottom of the package D Double Terminals are on opposite sides of a square or rectangular package or located in two parallel rows E End Terminals are package endcaps having a circular or elliptical cross-section L Lateral

48、Terminals are on the four sides of a square or rectangular package The preferred name is “quad“, code Q P Perpendicular Terminals are perpendicular to the seating plane on a square or rectangular package. Restrict to PGA family Q Quad Terminals are on four sides of a square or rectangular package or

49、 located in four parallel rows R Radial Terminals extended radially from the periphery of a cylindrical or spherical package S Single Terminals are on one surface of a square or rectangular package in a single row T Triple Terminals are on three sides of a square or rectangular package U Upper Terminals are perpendicular to and opposite the seating plane, and are on one surface of a package X Other Terminal positions are other than those described Z Zig