EN 123300-1992 en Sectional Specification Multilayer Printed Boards (Incorporates Amendment A1 1995)《分规范 多层印制电路板》.pdf
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1、BSI BS*EN*L23300 01 Lh24bh 05b2b49 O49 BRITISH STANDARD BS EN 123300 : 1992 Harmonized system of quality assessment for electronic components Incorporating 4Wmt No. 1 FIS CECC 2BO : 1989, Lnco7pomting 4mendntats Nos. 1 and 2, wnumbere Sectional specification: Multilayer printed boards The European S
2、tandard EN 123300 : 1992 has the status of a British Standard NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMmD BY COPYRIGHT LAW - bd+oppr and ihr. cccintinuour plaid coppr IS per- miitc pritvtdcd the cmardtrr not inter- rupi clcctrcal cirniinucly Remarks . _ . +See 2. -6- CECC 23 300 Issue 1 BSI B
3、S*EN*1,23300 01, m Lb24bb9 05b2bbL b4b m Rtr;ird -ihkkncss iii ihr. sone tif cdgc hiunl con- lillh I lolc Keil ut rcnwiii Whcrr newwin. ihir hiill hc wrifir.d h! Jinicnsitinsl cxumtniiiion. using lsi 2 :I Whew neccsar) this shall hc verifid hy dimensional cxaminotion. using Tesi ?a -7- CECC 23 300 I
4、ssue Spacing wnduc- nrs Miulignmcnt of hok and land Irnprfcctnmrsuch us voidror edge it si;tdard atmospheric ainititinr fiil hh Cu I (b Illh I Ih 12a I fe Iff 144 G 8 K ycJ : h/ markings Jouhifully kgiMc; i.c. podhk mistaking ti rimilor charricrs such as: R-P-U. E-F. C-G-O Micnwciuining will hc. dc
5、iw only when required in ihc rckvint rpcifiailin - 11 - CECC 23 300 Issue i? Change in n.sstanc of plated-through htlcr o Remrrks rhis is normally not mcas- ured. astk important fea- IUW is the rclaiionlip twiwrcn pattcrn and hdc. which ntntmls tk mini- mum radial land width. Wkn rpccially callcd fo
6、r. thc dcviotionn giwn in IEC Publication 326-3 rhull apply *See 2. CECC 23 300 Issu - 12 - BSI BS*EN*L23300 DL Lb24bb 0562bb7 Ob4 Characteristics Adhcrkm of plating. bur- nish methud POroYty, v, cxpwrc Porosity clmfognphic lest thkknco of piaiing(othcr amai than mntrt ar- cas) Rcquiir menu lkir sha
7、ll be no evickmce of Muwring or dcuchmcnt of the plating The rcquiicmcnts iprrikd in thc rcknni Thc rquircmcnts rpccifrd in the rckvrnt The thickncurhrlicomplywith the rckvrni rpccifuation dull k mct irgfcifuation shill k met qnxiritinn Remarks *See 2. CECC 23 300 Issue - 13 - BSI BS*EN*$23300 O1 m
8、1624669 05b2bb TTO R 6. Capability test programe For the characteristics to be verified and the requirements see 5, Tables I and II. For additional capability see 3.5.3 of CECC 23 000. For composite test pattern (CTP), specimens and multiple arrangements of test patterns see 8 and Fig. 2. Table III
9、Characteristic Visual Inspection Conformity Identif ication Appearance Work manship Plated-through holes Conductor defects Particles between conduc tors 0 i mensional examination Board dimensions Flatness Board thickness zone of Holes edge-board contacts Conductor width Conductor spacing M isaliqn m
10、 ent hole/land Electrical tests Change in resistanc plated-through holes Change in resistance interconnections Insulation resistance surface layer after damp heat Insulation resistance internal layers insulation resistance between layers Internal short circuit Test NO 1 1 la la la lb lb,lc 2 12a 2 2
11、 2a 2a Za 3c Jb,fc 6a 6b 6c la - Number f sil ures perm it ted of O O O O O O O 1 1 O O 1 1 O 1 1 1 O O 1 jpecimens nnd number 31 spccinans for test i n g Basic zapabi I i ty ,9 complete CTP before sub-division 9 complete CTP before sub-dipision 9 specimen K 9 specimen A 9 specimen F 9 specimen A 6
12、specimen D 6 specimen l. 5 specimen E 3 specimen J 3 specimen M 6 specimen C (lower part) Noter for Additional Caprbility arger board sir arger ratio oard thickness 3 hole diametei smaller width and/or spacings ,at elevated temperature CECC 23 300 Issue 1 - 14 - Table III continued Characteristic Me
13、chanical tests Peel strength Pull-out strength, landless plated- through holes Miscellaneous tests Adhesion of plating contact area Plating thickness, contact area Adhesion of plating other areas Delamination including microsection if applicable Solderability Conductors, and Holes as received, 0,2X
14、activated flux or Conductors, and Holes as received, non- activated flux Conductors, and Holes or after accelerated ageing, non-ac t i vated flux or Conductors, and Holes after accelerated ageing 0,29 activated flux Test No. 10a llb 13a 1 3f 13e 1 Sa 14a 14a 14a 14a 14a 14a 14a 14a Number fail ures
15、per mit ted of 1 O 1 O 1 O 1 1 1 1 1 1 1 1 Specimens and number of specinens for testing Basic Eapabi I i ty 3 specimen G 3 specimen B 3 specimen K 3 specimen K 3 specimen C (middle part) 3 specimen C (upper part) 9 specimen H 9 specimen A I Notes for A ddl t ional Capability 4 t elevated .emperatur
16、e 9 specimen H 9 specimen A 9 specimen H 9 specimen A 9 specimen H 9 specimen A Total number of failures permitted, all tests togehter : 3 CECC 23 300 Issue 1 - 15 - 7. Issue 2, September 1996 Quality conformance inspection For characteristics to be verified and the requirements see 5, Tables I and
17、II. . For definition of the inspection groups see 4.3 of CECC 23 000. For aggregating printed boards into inspection lots see 3.1 of CECC 23 OOO. For small lots and/or expensive printed boards see 4.2 Of CECC 23 000. For forming assessment level B (any intermediate level between A and C) see 5.2.5 o
18、f CECC 23 OOO. A further assessment level D may be formed using level C and specifying additional tests to be performed and/or more severe IL/AQL 8,see 5.2.5 of CECC 23 000. Table IV Inspection Croup Group A 5ub-Croup Al Sub-Group A2 Sub-Croup A3 In for mation to be included in the RCE Characteristi
19、c V Ir u al inspect i on. Confor mit y Identification Appearance W orkmanship Plated-through holes Conductor defects Misalignment of solder resist and land Particles between conductors O imensional examination Board dimensions Holes Slots, notches Conduct or width Conductor spacing Misaligrnent of h
20、ole and land Positional tolerance of hole centres Misalignment of solder resist of land Spare group for additional A Tests est NO. - 1 1 18 la 1. la la 1 b, IC - 2 2 2 2 2 2 2 2a - Level A IL - s2 88 U I 8t IL 88 U - s1 88 U 88 88 n U bb L Level 8 IL AQ O O O n o o w o O in hl M cy * s - 3 Q u C a U
21、 O o o o = 3 O Li - E Li 3 O s O t c I- rra 7 !% =I- - =a : I 2 g; Level C IL AB I 100% n (1 (I 88 88 JI I 54 2.5 $ k aru sa :m Q c-u a6s Db- Level O ILABL O O O m (Y o u W u O in - m 5 - 3 O o c 6 O o o 6 c U Q 2 - E Li O Q P O t- c i6 - CECC 23 300 Issue 1 BSI 1996 Issue 2, September 1996 Table IV
22、 continued lnrpec t ion Group t- Sub-Grou 63 t- Sub-Grou 54 r ISub-G roup B S Il Infor mation to be included in RCE BSI 1996 Characteristic Di mensional interchange- ability Board thickness in the zone of edge baord contacts F iatness Solderability Unconditioned After accelerated ageing - Thermal sh
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