EN 123300-1992 en Sectional Specification Multilayer Printed Boards (Incorporates Amendment A1 1995)《分规范 多层印制电路板》.pdf

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1、BSI BS*EN*L23300 01 Lh24bh 05b2b49 O49 BRITISH STANDARD BS EN 123300 : 1992 Harmonized system of quality assessment for electronic components Incorporating 4Wmt No. 1 FIS CECC 2BO : 1989, Lnco7pomting 4mendntats Nos. 1 and 2, wnumbere Sectional specification: Multilayer printed boards The European S

2、tandard EN 123300 : 1992 has the status of a British Standard NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMmD BY COPYRIGHT LAW - bd+oppr and ihr. cccintinuour plaid coppr IS per- miitc pritvtdcd the cmardtrr not inter- rupi clcctrcal cirniinucly Remarks . _ . +See 2. -6- CECC 23 300 Issue 1 BSI B

3、S*EN*1,23300 01, m Lb24bb9 05b2bbL b4b m Rtr;ird -ihkkncss iii ihr. sone tif cdgc hiunl con- lillh I lolc Keil ut rcnwiii Whcrr newwin. ihir hiill hc wrifir.d h! Jinicnsitinsl cxumtniiiion. using lsi 2 :I Whew neccsar) this shall hc verifid hy dimensional cxaminotion. using Tesi ?a -7- CECC 23 300 I

4、ssue Spacing wnduc- nrs Miulignmcnt of hok and land Irnprfcctnmrsuch us voidror edge it si;tdard atmospheric ainititinr fiil hh Cu I (b Illh I Ih 12a I fe Iff 144 G 8 K ycJ : h/ markings Jouhifully kgiMc; i.c. podhk mistaking ti rimilor charricrs such as: R-P-U. E-F. C-G-O Micnwciuining will hc. dc

5、iw only when required in ihc rckvint rpcifiailin - 11 - CECC 23 300 Issue i? Change in n.sstanc of plated-through htlcr o Remrrks rhis is normally not mcas- ured. astk important fea- IUW is the rclaiionlip twiwrcn pattcrn and hdc. which ntntmls tk mini- mum radial land width. Wkn rpccially callcd fo

6、r. thc dcviotionn giwn in IEC Publication 326-3 rhull apply *See 2. CECC 23 300 Issu - 12 - BSI BS*EN*L23300 DL Lb24bb 0562bb7 Ob4 Characteristics Adhcrkm of plating. bur- nish methud POroYty, v, cxpwrc Porosity clmfognphic lest thkknco of piaiing(othcr amai than mntrt ar- cas) Rcquiir menu lkir sha

7、ll be no evickmce of Muwring or dcuchmcnt of the plating The rcquiicmcnts iprrikd in thc rcknni Thc rquircmcnts rpccifrd in the rckvrnt The thickncurhrlicomplywith the rckvrni rpccifuation dull k mct irgfcifuation shill k met qnxiritinn Remarks *See 2. CECC 23 300 Issue - 13 - BSI BS*EN*$23300 O1 m

8、1624669 05b2bb TTO R 6. Capability test programe For the characteristics to be verified and the requirements see 5, Tables I and II. For additional capability see 3.5.3 of CECC 23 000. For composite test pattern (CTP), specimens and multiple arrangements of test patterns see 8 and Fig. 2. Table III

9、Characteristic Visual Inspection Conformity Identif ication Appearance Work manship Plated-through holes Conductor defects Particles between conduc tors 0 i mensional examination Board dimensions Flatness Board thickness zone of Holes edge-board contacts Conductor width Conductor spacing M isaliqn m

10、 ent hole/land Electrical tests Change in resistanc plated-through holes Change in resistance interconnections Insulation resistance surface layer after damp heat Insulation resistance internal layers insulation resistance between layers Internal short circuit Test NO 1 1 la la la lb lb,lc 2 12a 2 2

11、 2a 2a Za 3c Jb,fc 6a 6b 6c la - Number f sil ures perm it ted of O O O O O O O 1 1 O O 1 1 O 1 1 1 O O 1 jpecimens nnd number 31 spccinans for test i n g Basic zapabi I i ty ,9 complete CTP before sub-division 9 complete CTP before sub-dipision 9 specimen K 9 specimen A 9 specimen F 9 specimen A 6

12、specimen D 6 specimen l. 5 specimen E 3 specimen J 3 specimen M 6 specimen C (lower part) Noter for Additional Caprbility arger board sir arger ratio oard thickness 3 hole diametei smaller width and/or spacings ,at elevated temperature CECC 23 300 Issue 1 - 14 - Table III continued Characteristic Me

13、chanical tests Peel strength Pull-out strength, landless plated- through holes Miscellaneous tests Adhesion of plating contact area Plating thickness, contact area Adhesion of plating other areas Delamination including microsection if applicable Solderability Conductors, and Holes as received, 0,2X

14、activated flux or Conductors, and Holes as received, non- activated flux Conductors, and Holes or after accelerated ageing, non-ac t i vated flux or Conductors, and Holes after accelerated ageing 0,29 activated flux Test No. 10a llb 13a 1 3f 13e 1 Sa 14a 14a 14a 14a 14a 14a 14a 14a Number fail ures

15、per mit ted of 1 O 1 O 1 O 1 1 1 1 1 1 1 1 Specimens and number of specinens for testing Basic Eapabi I i ty 3 specimen G 3 specimen B 3 specimen K 3 specimen K 3 specimen C (middle part) 3 specimen C (upper part) 9 specimen H 9 specimen A I Notes for A ddl t ional Capability 4 t elevated .emperatur

16、e 9 specimen H 9 specimen A 9 specimen H 9 specimen A 9 specimen H 9 specimen A Total number of failures permitted, all tests togehter : 3 CECC 23 300 Issue 1 - 15 - 7. Issue 2, September 1996 Quality conformance inspection For characteristics to be verified and the requirements see 5, Tables I and

17、II. . For definition of the inspection groups see 4.3 of CECC 23 000. For aggregating printed boards into inspection lots see 3.1 of CECC 23 OOO. For small lots and/or expensive printed boards see 4.2 Of CECC 23 000. For forming assessment level B (any intermediate level between A and C) see 5.2.5 o

18、f CECC 23 OOO. A further assessment level D may be formed using level C and specifying additional tests to be performed and/or more severe IL/AQL 8,see 5.2.5 of CECC 23 000. Table IV Inspection Croup Group A 5ub-Croup Al Sub-Group A2 Sub-Croup A3 In for mation to be included in the RCE Characteristi

19、c V Ir u al inspect i on. Confor mit y Identification Appearance W orkmanship Plated-through holes Conductor defects Misalignment of solder resist and land Particles between conductors O imensional examination Board dimensions Holes Slots, notches Conduct or width Conductor spacing Misaligrnent of h

20、ole and land Positional tolerance of hole centres Misalignment of solder resist of land Spare group for additional A Tests est NO. - 1 1 18 la 1. la la 1 b, IC - 2 2 2 2 2 2 2 2a - Level A IL - s2 88 U I 8t IL 88 U - s1 88 U 88 88 n U bb L Level 8 IL AQ O O O n o o w o O in hl M cy * s - 3 Q u C a U

21、 O o o o = 3 O Li - E Li 3 O s O t c I- rra 7 !% =I- - =a : I 2 g; Level C IL AB I 100% n (1 (I 88 88 JI I 54 2.5 $ k aru sa :m Q c-u a6s Db- Level O ILABL O O O m (Y o u W u O in - m 5 - 3 O o c 6 O o o 6 c U Q 2 - E Li O Q P O t- c i6 - CECC 23 300 Issue 1 BSI 1996 Issue 2, September 1996 Table IV

22、 continued lnrpec t ion Group t- Sub-Grou 63 t- Sub-Grou 54 r ISub-G roup B S Il Infor mation to be included in RCE BSI 1996 Characteristic Di mensional interchange- ability Board thickness in the zone of edge baord contacts F iatness Solderability Unconditioned After accelerated ageing - Thermal sh

23、ocktests Interlaminar bond Through-hole platings Heatsinkbond Mechanical tests Peel strength, standard atmor. conditions Pull-out strength ,landless plated through holes Surface finish tests Adhesion of plating Thicknessof edge Edge plating porosity Internal short circuit - est No. 2 12a - 14. 2 Oa

24、- 15a 19c 15a - I 0. llbj - I Sa 13f Wd, 13e 4a - - - Level O O O c. N o o u u O c ? Y 5 ih - 3 a 0 C ID O o o 0 Li Level C IL - s2 n - s3 il Level O IL/AQL O O O ?n hl o o u o c e 9 9 5 u+ c E a o c O o o c w c a - E L. L O a o O c CECC 23 300 Issue 1: BSI BS*EN*123300 01 1624669 0562672 Y21 Table

25、IV continued Issue 2, September 1996 Inspect ion Group roup c b-Group C1 ub-Group C2 ub-Croup C3 nfot mat ion o be Included n the RCE C harectetistic lests in 3 months intervals Insulation resistance within a layer Insulation resistance between layers Insulation resistance betweenheatsinkand subjace

26、ntcircuitry Insulation resistance betweenheatsinkand adjacent circuitry Process contamination Solvent resistance Resistance to solder Change in resistance Change in resistance lnterconnectiorts Seats in 12 months intervals n.a. plat ed-t hr oug h holes Spare graup for additional Intervals Results fr

27、om Sub-Group C1 rest No. 6b 6c 6c 6c # # # 3c 3b 9 AL Levei A NOTES z 1. The symbol#denotesthatthetestingdetailshallbeincludedinthe relevant Capability Detail Specification. 2. This listing may be subject to continuing review, as required by the publication of new Capability Detailspecications. Fig.

28、 1 - Length of defect - I8 - Level C 4 C o E -. - - o ou O0 o 2- 2 al .- 20 1:; 1:; 1:; “ n “ l:z “ 1:2 6 1:2 1:2 6 .1 “ 61 l a- 19 =“ E- 0 Leve O CECC 23 300 Issue 1 0 BSI 1996 i? i BSI BS*EN*123300 01 8. Test patterns - test boards A pattern used for carrying out a test is a test pattern. A test p

29、attern may consist of - a part of the conductive pattern on a production board (and used in the application of the printed board), or - a special test pattern particularly designed and prepared for the purpose of testing only. A test pattern may be located - on a test coupon (a portion of a printed

30、board or a panel usually cut - on a separate test board (see IEC 194 it. 05-02). off prior to using the printed board, aee IEC 194 it. 05-03), or 8.1 Application of test patterns and test boards 8.1 . 1 Capability approval tes tine Basic capability shall be tested using the composite test pattern gi

31、ven in 8.2 and the 6 layers structure given in 8.3. Where additional capability claims a higher number of layers, the 6 layer board with additional layers shall be used. All additional layers shall bear the same conductive .pattern shown in Fig. 26. The structure given in 8.3 shall be used. Where ad

32、ditional capability claims larger baord sizes (active area) than that of a test board bearing one composite test pattern (160 mm x 160 mm) multiple arrangements as shown in 8.4 may be used. See also 3.5 of CECC 23 000. 8.1.2 Quality conformance inspection The tests will normally be carried out on pr

33、oduction boards. The use of special test patterns, either based on parts of the composite test pattern shown in 8.2 or specially designed, may be agreed upon between manufacturer and user. 8.1 .3 Produc tion tes tinq For testing production any test pattern (either part of the conductive pattern on t

34、he production board or any special used at the discretion of the manufacturer. test pattern)may be - 19 - CECC 23 300 Issue 1 - BSI BSUENU123300 O1 D Lb24bb 0562674 2T4 8.2 Composite test pattern (CTP) The composite test pattern shall be used for testing capability, see 3.5 of CECC 23 000. Using the

35、 single test specimens of the composite test pattern Figure 2, the following tests can be made: Specimen A B C D E F G H J K L M Test Solderability of plated-through holes Pull-out strength, landless plated- Plating adhesion, delamination and through holes in terna1 short circuits Change of resistan

36、ce of plated- through holes insulation resistance (surface layers) Conductor definition Peel streng th Solderability of conduc tors insulation resistance (inner layers) Plating finishes Change of resistance of interconnections Insulation resistance between layers - ominal ole dia. m Nominal land dia

37、 mm I - 20 - CECC 23 300 Issue 1 BSI BS*EN*123300 O1 = 1bZitbb9 0562675 130 8.3 Structure of test boards fest M with: Uumkr of layers Toul board thickness nomiMi thickness conductive foil Laminate: thicloreU numkr of bonding sheets Insulation: Hokt Surface finish Remarks Six hytn IU IU six 1.6 mm t

38、0.2 mm Not lesr than 0.2 mm nominal 35 pm copper. boih side 0.1 mm minimum 2 minimum Mom ihm six yen r- x3, XS, etc o- X4, X6. etc 8-2 I2.E 1643-20-3. cic. (underlined numkrs arc prcfmcdi To k specified in the relevant specification All holer plried-thfough To k specified in the relevant specificati

39、on The patterns shall k comily orientated according io the method of Sufftcieni space shall k provided outside the pattern arca to accom- construction. modate a registration system. - 21 - CECC 23 300 Issue 1 _ BSI BS*EN*L23300 01 31624669 0562b7b 077 8.3 Multiple arrangements of the composite test

40、patterns Where the additional capability claims larger board sizes (active area) than that of a Single composite test pattern (160 mm x 160 mm) and if the manufacturer wishes to demonstrate the additional capability by using the composite test pat tern, adequa te mu1 tiple arrangements of the compos

41、ite test pattern may be used. The multiple arrangements shall be such that each corner of the active area of the multiple board Is occupied by a composite test pattern. Unoccupied areas between the composi te test patterns are permitted providing they do not exceed the dimensions of the composite te

42、st pattern. Examples of.multiple arrangements: Two composite test patterns: Four composite test patterns: Six composite test patterns: CTP CTP CTP - 22 - CECC 23 300 Issue 1 I i :BSI BS*EN*123300 01 1624667 0562677 TO3 BESTCOPY AVAILABLE -, ! J b E a LI -34 .%ore - b figure la est dcriintc a localis

43、er es tchar.:!oni dam eproue!ic cc,.pniitc. c!lc nr :mes3cn pas a iimpressm de la couche LI ler zones ba:hures dn tchrniil1sr.i A. B. D. G. 1 sort !n imprtrrioni de, caches S Pour ici xucher S de crhmi:llons C et M. boy fiprife Id. page FiEure :a IS yben to idemfi Ihc locatonr oiihc specimens IT. ;b

44、e composte !est prticrn. 11 Jmnt shcu rhc patte= ofla)cr Li. Crors.a:uchrC areas $heu3 on spcc:mn% 4 D G L a- Y !a!m p:em For S la!en of specimen5 C and 41 xe Figure 1 d. FIG. 2a - Place des impressions de Ieprou ettc composiw Composiic test paiirm locations. - 23 - CECC 23 300 Issue - BSI BS*EN*L23

45、300 01 M 1624669 0562678 94T =ST COPY AVAILABLE ECHIkTILLON A SPECihlEh A Cobci;es L1 ei L6 Layer, LI ara L6 ECHAhTILLON B SPECIMEN a Ccdnes L1 er L6 Ldyers L 1 ana L6 Couches L3. L4 et X Lavers L3, L4 and X ECHANTILLON D SPECIMEN O Cuuct.es L1 er L6 Ldvers L1 ana L6 Cocicnes L3. L4 et X Lavers L3. L4 arid X Fici-u 2b - 24 -