ECA EIA-540B0AA-A-2001 Detail Specification for Production Ball Grid Array (BGA) High Pin Count (1089 Pins and Greater) Socket for Use in Electronic Equipment (Revision of EIA-540B.pdf

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1、 EIA STANDARD Detail Specification for Production Ball Grid Array (BGA), High Pin Count (1089 Pins and Greater) Socket for Use in Electronic Equipment EIA-540B0AA-A (Revision of EIA-540-B0AA) October 2001 Stabilized: March 2014 EIA-540B0AA-A ANSI/EIA-540B0AA-A-2001 Approved: October 8, 2001 NOTICE E

2、IA Engineering Standards and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the p

3、roper product for his particular need. Existence of such Standards and Publications shall not in any respect preclude any member or nonmember of ECIA from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications p

4、reclude their voluntary use by those other than ECIA members, whether the standard is to be used either domestically or internationally. Standards and Publications are adopted by ECIA in accordance with the American National Standards Institute (ANSI) patent policy. By such action, ECIA does not ass

5、ume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the Standard or Publication. This EIA Standard is considered to have International Standardization implication, but the International Electrotechnical Commission activity has not progressed to the p

6、oint where a valid comparison between the EIA Standard and the IEC document can be made. This Standard does not purport to address all safety problems associated with its use or all applicable regulatory requirements. It is the responsibility of the user of this Standard to establish appropriate saf

7、ety and health practices and to determine the applicability of regulatory limitations before its use. (From Standards Proposal No. 5328.11, formulated under the cognizance of the CE-2.0 Committee on EIA National Connector and Socket Standards). Published by Electronic Components Industry Association

8、 2014 Engineering Department 2214 Rock Hill Road, Suite 265 Herndon, VA 20170 EIA-540BOAA-A Page 1 Systems Standard Organization ELECTRONICS INDUSTRIES ALLIANCE GENERIC SPECIFICATION NUMBER EIA-5400000-A Socket Outline Drawing See figures 1 and 2 for dimensional information. Tolerances: 2 0.13 mm (2

9、 0.005 in) on all figures except where noted. DETAIL SPECIFICATION NUMBER EIA-540BOAA-A SECTIONAL SPECIFICATION NUMBER EIA-540B000 BLANK DETAIL SPECIFICATION NUMBER None Product Description This specification is for use with BGA devices described in Annex F. Product Requirements The complete require

10、ments for the interconnect system shall consist of this Detail Specification and where applicable the latest issue of EIA-540B000. TYPICAL CONSTRUCTION Contact Material : Copper alloy Outermost Contact Finish: Tin-lead Termination Finish : Tin-lead Insulator Material : High temperature thermoplastic

11、 APPLICATION/ASSESSMENT LEVEL For use in commercial, computer, and communications equipment. EIA-540BOAA-A Page 2 1 Scope and purpose This specification covers interconnect systems typically used for production ball grid array (BGA) devices with pin counts of 1089 and greater. 1.2 Purpose The purpos

12、e of this detail specification is to provide all information required for the identification and assessment of the BGA socket described herein. The information, contained herein or by reference, is complete and sufficient for inspection purposes. 2 Normative references The following standards contai

13、n provisions that, through reference in this text, constitute provisions of this standard. At the time of publication, the editions indicated were valid. All standards are subject to revision, and parties to agreements based on this standard are encouraged to investigate the possibility of applying

14、the most recent editions of the standards indicated below. EIA-364-C, Electrical Connector Test Procedures Including Environmental Classifications (December, 1994). EIA-5400000-A , Generic Specification (August, 1996). EIA-540B000, Sectional Specification (November, 1997). Socket details Contact pla

15、ting The outermost plating of the contact area shall be tin-lead or tin-lead compatible and shall satisfy the requirements specified in the qualification test sequence. The contact plating systems utilized shall be compatible to the systems they are mated to, such as: a) Tin-lead b) Other NOTE: Gold

16、-plated contact surfaces mated to tin-lead plated contact surfaces are not an acceptable plating combination. EIA-540BOAA-A Page 3 3.2 Contact fiiish at the termination area shall be as indicated in Table 1. Contact finish at termination area Table 1 Contact finish at termination area Contact finish

17、 Tin-lead 3.3 Actuation method The actuation of the socket shall be as indicated in table 2. Table 2 Actuation type Actuation method ZIF with Lever Actuation 3.4 Mounting Method The mounting of the socket shall be as indicated in table 3. Table 3 Mounting method Mounting method Surface Mount Other E

18、IA-540BOAA-A Page 4 Atmospheric conditions General controlled 3.5 Socket dimensions Temperature Air Relative pressure humidity 15 OC to 35 OC 87 Wa to 107 Wa (59 OF to 95 OF) (650 mmHg to 800 mmHg) 80% or less The configuration of the BGA socket is optional within the limits of the dimensions within

19、 figure 1 and the mounting dimensions within figure 2. 3.6 Contact spacing The contact spacing shall be as indicated in table 4. Table 4 Contact spacing Contact spacing Other 4 Mating devices Mating devices shall be in accordance with JEDEC specifications. Said devices shall be internally wired in o

20、rder to perform the appropriate electrical measurements such as low-level circuit resistance (LLCR). 5 Atmospheric conditions for testing The interconnect system shall be tested at the atmospheric conditions as specified in table 5, general controlled. 40.64 (1.600) Surface Mount Amlication Solder T

21、ail Stvle 40.64 (1.600) Socket housing 33 x 33 Socket housing 50.80 (2.000) 50.80 (2.000) 25 x 25 Figure 1 Housing dimensions EIA-540BOAA-A Page 6 Socket outline I I I I I I I I I I I I I I I I I I I I I 0 o I I I I I I I I I I I I o o A Notes (Su rface mount application; a) SMT pad size b) SMT pad

22、plating : 0.86 mm +/- 0.05 mm diameter (0.034 in +/- 0.002 in diameter) : Tin-Lead Notes (Plated throuph hole annlication; a) Finished PTH size b) PTH plating : Tin-Lead : 0.86 mm +/- 0.05 mm diameter (0.034 in +/- 0.002 in diameter) Figure 2 - Recommended board pattern EIA-540BOAA-A Page 7 6 Test s

23、equence This test sequence shows all tests and the order in which they shall be carried out as well as the requirements to be met. The baseline test sequence (figure 3) illustrates the order of tests by group. In the following test sequence tables, where an EL4 test is specified without a letter suf

24、fix, the latest approved version of that test shall be used. EIA-540BOAA-A Page 8 DITIONING I LLCR SAMPLE PREPARATION LLCR DITIONING RESISTANCE I TOSOLDER LLCR HEAT I DURABILIY IR MECH. SHOCK MECH. SHOCK RANDOM VIBRATION LIFE SOLVENT THERMAL RESISTANCE I SHOCK LLCR LLCR ATC LLCR RANDOM LLCR VIBRATIO

25、N LLCR THERMAL LLCR MIXED MIXED FLOWING FLOWING GAS GAS AI BI CI DI LLCR : Low level circuit resistance ATC : Accelerated thermal cycling DWV : Dielectric withstanding voltage IR : Insulation resistance EI FI GI Figure 3 - Baseline test sequence rest phase 4P1 4P2 4P3 EIA-540BOAA-A Page 9 Table 6-Gr

26、oup AP EIA test ritle recondition vlechanical ;hock - EIA 364 no. !7 Severity or condition of test Performed on unmounted sockets and devices prior to test for 24 hours at 85“CI 2C (185 “FI 3 OF) See note 1. 20 mV 100 mA See annex C and note 1. Test cond. A 11.0 ms 3.4m/s (11.3 ft/s) Half sine wave,

27、 18 shocks total See note 2. 50 g Measurements to be performed Visual examination LLCR Visual examination Nanosecond event detection EIA 364 no. 18 23 Requirements for performance level No damage Record 18 87 No damage 2.0 nanosecond EIA-540BOAA-A Page 10 Table 6-Group AP Continued c EIA test itle V

28、ibration Accelerated thermal :ycling (ATCI EIA 364 no. 28 - Severity or condition of test Test cond. V Test letter B 7.3 grms50 Hz to 2000 Hz 45 minutes/ axis, 3 axis total See note 2. 20 mV 100 mA See annex C and note 1. o “C to 75 “C (32 OF to 167 OF) 2000 cycles Test is performed on all LLCR samp

29、les. See annex A. 20 mV 100 mA See annex C and note 1. Measurements to be performed Visual examination Nanosecond event detection LLCR Visual examination LLCR measured every 168 h EIA 364 no. 18 87 23 18 23 Requirements for performance level No damage 2.0 nanoseconds 20.0 m!2 maximum rise per contac

30、t pair No damage 20.0 m!2 maximum rise per contact pair NOTES 1. A sufficient number of sockets (minimum of 4) shall be tested to obtain a minimum of 500 daisy-chained data points (1000 contact interfaces) for low level circuit resistance measurements on the preconditioned (thermal-aged) samples and

31、 a minimum of 500 daisy chained data points (1000 contact interfaces) for low level circuit resistance measurements on the non-preconditioned (non-thermal-aged) samples. Nanosecond event detection shall be monitored on 2 preconditioned (thermal-aged) sample and 2 non-preconditioned (non-thermal-aged

32、) samples. (These are in addition to the low level circuit resistance samples.) 2. EIA-540BOAA-A Page 11 A 54 io. Table 7-Group BP Requirements for performance level rest hase 18 23 3P1 Nodamage 20.0 m!2 maximum rise per contact pair 3P2 3P3 BP4 23 EIA test 20.0 m!2 maximum rise per contact pair rit

33、le lurability rhermal ;hock zyclic mmidity EIA 364 no. - 9 - 32 31 Severity or condition Df test 20 mV 100 rnA See annex C and note 1. 20 cycles total See note 2 20 mV 100 mA See annex C l0c ycles 30 minutes at each temp. extreme -40 “C to +60 “C (-40 “F to +140 OF) 20 mV 100 mA See annex C and note

34、 1. Test cond.111 except 25 “C to 85 “C (77 “F to 185 OF) 80% I2% RH 25 “C 47% max. RH 85 “C 1000 hours omit subcycle 7a and 7b Cycle duration: 8 h. See annex E. 20 mV 100 mA See annex C and note 1. deasurements 3 be performed ,LCR visual xamination LLCR Visual 2xamination LLCR Visual examination LL

35、CR measured every 168 h I y rise per contact pair EIA-540BOAA-A Page 12 Table 7-Group BP Continued NOTES 1. A sufficient number of sockets (minimum of 4) shall be tested to obtain a minimum of 500 daisy-chained data points (1000 contact interfaces) for low-level circuit resistance measurements. 2. F

36、irst 15 cycles are performed with several BGA mating devices, last 5 cycles with actual BGA test devices (5 cycles of durability per BGA mating device). a) The first 15 cycles of durability is performed with 3 separate BGA test devices (5 cycles per test device). b) The last 5 cycles of durability i

37、s performed with a fourth BGA which is to be the test device and remains mated to the socket for the remainder of test. EIA-540BOAA-A Page 13 Table 8-Group CP EIA test Measurements to be performec Requirements for performance level ritle EIA 364 no. - Severity or condition of test rest phase ZP1 400

38、 Vac See note 2 Dielectric withstanding iroltage No flashover breakdown,etc. ZP2 100 Vdc See note 2 nsulation resistance 100 megohms minimum rhermal ;hock 32 - 31 Visual 2xamination No damage 10 cycles 30 minutes at each temp. extreme -40 “C to +60 “C (-40 “F to +140 OF) 400 Vac See note 2 ZP3 ZP4 D

39、ielectric withstanding voltage No flashover breakdown,etc. 100 Vdc See note 2 Insulation :esistanCe 100 megohms minimum Zyclic iumidity Visual 2xamination No damage Test cond.111 except 25 “C to 85 “C (77 “F to 185 OF) 80% I2% RH 25 “C 47% max. RH 85 “C 1000 hours omit subcycle 7a and b Cycle durati

40、on: 8 h. See annex E. 400 Vac See note 2 Dielectric withstanding iroltage No flashover breakdown,etc. 100 Vdc See note 2 nsulation resistance 100 megohms minimum VOTES 1. 2. Four unmounted/unmated sockets shall be subjected to the above tests. 25 adjacent contact pairs, randomly chosen, equally disp

41、ersed throughout the socket are tested. EIA-540BOAA-A Page 14 Table 9-Group DP EIA test deasurements o be performed IIA 64 LO. Requirements for performance level - ZIA 164 10. ritle Severity or condition of test Test performed on unmounted sockets and devices prior to test for 24 h. 85“CI 2C (185 “F

42、I 3 OF) See note. 20 mV 100 mA See annex C and note. Method A 85“CI 2C (185 “FI 3 OF) 500 hours Tisual !xamination No damage recondition 17 ,LCR 23 Record - 17 visual examination 18 No damage emperature life 23 - 18 - 23 20.0 m!2 maximum rise per contact pair 20 mV 100 mA See annex C LLCR neasured I

43、t 300 hours hours No damage 65A - Test conditions: C12 = (10 ? 3) ppb H2 S= (10 15) ppb NO2 = (200 I 50) PI: Temp: (30 I 2) “C (86I 3)“F R.H. : (70I 2) % Duration: 168 h mated so2 = (100 120) ppl Visual examination Mixed gas flowing 20.0 m!2 maximum rise per contact pair 20 mV 100 mA See annex C LLC

44、R EIA-540BOAA-A Page 15 Table 9-Group DP Continued NOTE- A sufficient number of sockets (minimum of 4) shall be tested to obtain a minimum of 500 daisy-chained data points (1000 contact interfaces) for low-level circuit resistance measurements on the preconditioned (thermal-aged) samples and a minim

45、um of 500 daisy- chained data points (1000 contact interfaces) for low-level circuit resistance measurements on the non-preconditioned (non-thermal-aged) samples. EIA-540BOAA-A Page 16 EIA 364 no. Table 10-Group EP Requirements for performance level EIA test ?hase 3?1 I Resistance to solder heat + t

46、o solvents - EIA 364 no. 56 11 Severity or condition of test Procedure 4 (vapor phase) Temp: 215 OC 419 OF Duration: 60 s to 65 s ;ee note 1 Table 1 solvents See note 2 Measurements to be performed Visual examination Visual examination I o evidence of deterioration to the socket housing or I NOTE- 1

47、. 2. Two unmounted/unmated samples shall be subjected to the above tests. Four unmounted/unmated samples shall be subjected to the above tests (one connector per solution). EIA-540BOAA-A Page 17 EIA 364 no. Table 11-Group FP Requirements for performance level rest phase 23 T1 Record 332 333 18 334 N

48、odamage EIA test 23 ritle 20.0 m!2 maximum rise per contact pair vlechanical ;hock Jibration 18 ower :ycling Nodamage EIA 364 no. 27 - 28 A3 Severity or condition of test Measurements to be performed 20 mV 100 mA See annex C and note. LLCR Test Cond. A 11.0 ms 3.4m/s (11.3 ft/s) Half sine wave 18 sh

49、ocks total See annex D. 50 g Test C0nd.V Test letter B 50 Hz to 2000 Hz 45 minutes/axis, 3 axis total See annex D. 7.3 grms 20 mV 100 mA and note. Visual examination Visual examination LLCR Temperature of socket/ device ranges (68 I 3) OF (203 I 7) OF Test is performed at room ambient. See annex B. 20 mV 100 mA See annex C and note. (20 I 3) OC to (95 I 5) OC. Visual examination LLCR measured every 168 hours. I y rise per contact pair VOTE-A sufficient number of sockets (minimum of 4) shall be tested to obtain a minimum of 500 daisy-chained data point