ECA EIA-468-C-2008 Lead Taping of Components in the Radial Configuration for Automatic Handling.pdf

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1、 EIA STANDARD Lead Taping of Components in the Radial Configuration for Automatic Handling EIA-468-C (Revision of EIA-468-B ) October 2013 EIA-468-CANSI/EIA-468-C-2013 Approved: December 30, 2008 Reaffirmed: October 18, 2013 NOTICE EIA Engineering Standards and Publications are designed to serve the

2、 public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existence of such Standards

3、and Publications shall not in any respect preclude any member or nonmember of ECIA from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than ECIA members, wheth

4、er the standard is to be used either domestically or internationally. Standards and Publications are adopted by ECIA in accordance with the American National Standards Institute (ANSI) patent policy. By such action, ECIA does not assume any liability to any patent owner, nor does it assume any oblig

5、ation whatever to parties adopting the Standard or Publication. This EIA Standard is considered to have International Standardization implication, but the International Electrotechnical Commission activity has not progressed to the point where a valid comparison between the EIA Standard and the IEC

6、document can be made. This Standard does not purport to address all safety problems associated with its use or all applicable regulatory requirements. It is the responsibility of the user of this Standard to establish appropriate safety and health practices and to determine the applicability of regu

7、latory limitations before its use. (From Standards Proposal No. 5263, formulated under the cognizance of the Automated Component Handling Committee). Published by Electronic Components Industry Association 2013 Engineering Department 2214 Rock Hill Road, Suite 170 Herndon, VA 20170 PLEASE! DONT VIOL

8、ATE THE LAW! This document is copyrighted by the ECIA and may not be reproduced without permission. Organizations may obtain permission to reproduce a limited number of copies through entering into a license agreement. For information, contact: IHS 15 Inverness Way East Englewood, CO 80112-5704 or c

9、all USA and Canada (1-877-413-5184), International (303-397-7956) i Lead Taping of Components in the Radial Configuration for Automatic Handling CONTENTS SECTIONS PAGE 1. INTRODUCTION AND SCOPE 1 2. NORMATIVE REFERENCES 1 3. DIMENSIONS 1 4. REQUIREMENTS 5 5. ACKNOWLEDGEMENTS 9 FIGURES AND TABLES FIG

10、URE 1 Coordinate System 1 FIGURE 2 Lead Taping Dimensions 2 FIGURE 3 Component Pitch 4 FIGURE 4 Reference Plane 5 FIGURE 5 Reel Configuration 7 FIGURE 6 Fan Fold Box Configuration 7 FIGURE 7 Reel Label Location 8 FIGURE 8 Fan Fold Box Label and Marking Locations 8 TABLE 1 Lead Taping Dimensions 3 TA

11、BLE 2 Component Pitch 4 TABLE 3 Reel Dimensions 7 TABLE 4 Fan Fold Box Dimensions 7 EIA-468-C Page 1 LEAD TAPING OF COMPONENTS IN THE RADIAL CONFIGURATION FOR AUTOMATIC HANDLING Revision of EIA Standard 468-B, formulated under the cognizance of the EIA Automated Component Handling (ACH) Committee 1.

12、 INTRODUCTION AND SCOPE This standard was formulated to provide dimensions and tolerances necessary to lead tape components in the radial format (unidirectional leads) such that they may be automatically handled. Automatic handling includes insertion, preforming and other operations. The emphasis of

13、 this standard is on the requirements for high-speed automatic insertion. This standard covers the lead taping requirements for components having two or more radial configured leads, provided these components may be taped in accordance with the requirements of this document. 2. NORMATIVE REFERENCES

14、The following standards contain provisions which, through reference in this Standard, constitute provisions of this Standard. All normative documents are subject to revision. 2.1 ANSI/ESD S541-2003 “Packaging Materials for ESD Sensitive Items“ 2.2 ANSI/ESD S20.20-2007 “Protection of Electrical and E

15、lectronic Parts, Assemblies and Equipment” 2.3 IPC/JEDEC J-STD-020C “Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices” 2.4 IPC J-STD-033B “Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices” 2.5 BS EN ISO 14001:2004 Envi

16、ronmental Management 3. DIMENSIONS 3.1 The coordinate system common to tapes and taped components with radial configured leads shall be used. The abscissa is a straight line through the centers of the sprocket holes. The ordinate is a line perpendicular to the abscissa through the center of the spro

17、cket hole that follows the component to be checked. All dimensions referencing the component leads are to the centerline of the lead. EIA-468-C Page 2 EIA-468-C Page 3 Table 1: Lead Taping Dimensions (See Figures 2 and 3) SYMBOL DESCRIPTION DIMENSIONS (mm) REFERENCE A Component Body Height 23 maximu

18、m Requirement 4.3 D0Sprocket Hole Diameter 4.00.2 d0Lead diameter 0.36 minimum 0.86 maximum Requirements 4.4 and 4.5 d1Lead width (non-circular leads) 0.35 minimum 0.75 maximum Requirement 4.5 d2Lead thickness (non-circular leads) 0.35 minimum 0.75 maximum Requirement 4.5 d3Lead diagonal (non-circul

19、ar leads) 0.85 maximum Requirement 4.5 F 2 Leaded Component Lead Spacing See Table 2, +0.6, -0.2 F1, F23 Leaded Component Lead Spacing 2.50 +0.4, -0.1 or 2.54 +0.4, -0.1 Requirement 4.6 F3Minimum inner spacing between leads F= 2.5 1.65 minimum F= 5.0 4.19 minimum F= 7.5 6.73 minimum F4Maximum outer

20、spacing of leads F= 2.5 3.68 maximum F= 5.0 6.22 maximum F= 7.5 8.76 maximum H Height to Seating Plane (Straight Leads) 18-20 Requirement 4.8 H0Height to Seating Plane (Formed Leads) 16.00.5 Requirement 4.7 H1Overall Height Above Abscissa 38.5 maximum Requirement 4.3 h Front-to-Back Deviation 1.0 ma

21、ximum Requirement 4.9 L Cut Out Length 11 maximum L1Lead Protrusion 1.0 maximum P Component Pitch (Nominal Dimension) See Table 2 P0Sprocket Hole Pitch 12.70.3 or 15.00.3 Requirement 4.10 P1Ordinate to Adjacent Component Lead See Table 2, 0.7 Requirement 4.6 and Figure 3 P2Ordinate to Component Cent

22、er Lead (3 Leaded Components) P0= 12.7 6.350.7 Fig. 3, Table 2 and Requirement 4.6 P0= 15.0 7.50.7 P3Lead Deviation in Carrier Tape 1.0 maximum Requirement 4.21 p Side-to-Side Deviation 1.3 maximum Requirement 4.9 t Composite Tape Thickness 0.9 maximum Requirement 4.11 t1Overall Tape and Lead Thickn

23、ess 2.0 maximum Requirement 4.11 W Carrier Tape Width 18 +1, -0.5 Requirements 4.12 and 4.13 W0Hold Down Tape Width 5 minimum Requirements 4.12 and 4.13 W1Sprocket Hole Position 9 +0.75, -0.5 W2Adhesive Tape Position 3 maximum Requirement 4.12 EIA-468-C Page 4 3.2 Component Pitch: The component pitc

24、h P depends on the pitch of the sprocket holes P0and the size of the component body, B. The positioning of the components shall be symmetrical in relation to the sprocket holes on the tape. Table 2: Component Pitch Nominal Dimensions (See Table 1) HOLE PITCH P0COMPONENT PITCH P FIG. LEAD SPACING F (

25、Multiples of 2.5mm) P1LEAD SPACING F (Multiples of 2.54mm) P112.7 12.7 3A 1.50* 5.60 12.7 12.7 3A 2.00* 5.35 12.7 12.7 3A 2.50 5.10 2.54 5.08 12.7 12.7 3A 5.00 3.85 5.08 3.81 12.7 12.7 3A 7.50 2.60 7.62 2.54 12.7 12.7 3B 7.50 8.95 7.62 8.89 12.7 12.7 3B 10.00* 7.70 10.16* 7.62 12.7 25.4 3B 12.50* 6.

26、45 12.70* 6.35 12.7 25.4 3B 15.00* 5.20 15.24* 5.08 12.7 25.4 3B 17.50* 3.95 17.78* 3.81 12.7 25.4 3C 20.00* 9.05 20.32* 8.89 12.7 25.4 3C 22.50* 7.80 22.86* 7.62 15.0 15.0 3A 5.00 5.00 5.08 4.96 15.0 15.0 3A 7.50 3.75 7.62 3.69 15.0 15.0 3B 7.50 11.25 7.62 11.19 15.0 15.0 3B 10.00* 10.00 10.16* 9.9

27、2 15.0 15.0 3B 12.50* 8.75 12.70* 8.65 15.0 15.0 3B 15.00* 7.50 15.24* 7.38 15.0 30.0 3B 17.50* 6.25 17.78* 6.11 15.0 30.0 3B 20.00* 5.00 20.32* 4.84 15.0 30.0 3B 22.50* 3.75 22.86* 3.57 3.2.1 Lead spacings marked with an asterisk (*) are commonly available but may not be compatible with high-speed

28、automatic insertion machines. 3.2.2 Care shall be taken that the leads do not interfere with the sprocket holes. 3.2.3 The maximum body size dimension B shall be less than the nominal component pitch P. The component pitch may be increased by P0when necessary to provide clearance between components.

29、 3.2.4 Dimension F multiples of 2.54mm represent multiples of 0.100”. For new designs, multiples of 2.5 are recommended.EIA-468-C Page 5 4. REQUIREMENTS 4.1 Procurement documents and quotation requests should include the following information: (a) Reference to this Standard by title and number. (b)

30、Container type. (c) Component orientation (Requirement 3.x) (d) Dimension H, for straight-leaded components (Requirement 3.x) (e) Lead spacing and component pitch per Table x. (f) Shipping conditions, storage conditions, and storage time. (g) Container and/or reel marking requirements (including bar

31、 coding, if required). 4.2 The leads of the taped component shall be free of kinks or bends from the seating plane or reference plane downward to the carrier tape. 4.3 Taped components with dimensions exceeding A maximum and H1maximum are commonly available but may not be compatible with high-speed

32、automatic insertion machines. 4.4 Lead diameters outside the range of d0in Table 1 are commonly available but may not be compatible with high-speed automatic insertion machines. 4.5 Leads with cross-sections other than circular may be used. A circle with diameter d3going through the corners of the n

33、on-circular cross-section is considered to be the equivalent circular cross-section. 4.6 Dimensions F, F1, F2, F3, F4, P1and P2, are measured at the egress from the carrier tape, on the component side. 4.7 The method for determining the seating plane is as follows: 4.7.1 For components with straight

34、 leads, the seating plane is determined by the bottom of the component body, which includes the meniscus or any projections which support the component on the printed circuit board. The seating plane is a line parallel to the abscissa through the bottom of the component body nearest the tape (see Fi

35、gure 2, Dimension H). 4.7.2 For components with crimped (or otherwise preformed) leads, the seating plane depends on the profile of the crimp, the diameter of the leads and the hole size in the printed circuit board. For this reason, a reference plane is defined, for components with crimped leads on

36、ly, as follows: The line parallel to the abscissa through the lowest center of the radius of curvature of the bending of the crimp. 4.8 Dimension H will increase as the component height, thickness, or diameter increases. H dimensions outside the range shown in Table 1 may not function properly with

37、all taping, placement or preforming machines. 4.9 h and p are the deviation between the actual center of the component, measured at the top of the component, and the theoretical centerline determined at its emergence from the tape. h represents front-to-back deviation. p represents side-to-side devi

38、ation (see Figure 2). 4.10 Cumulative sprocket hole pitch tolerance shall not exceed 1.0mm over 20 consecutive pitches. 4.11 Splices shall be equal in strength to the original tape (15 newtons, minimum, break force) and shall not hamper the transport or the cutting of the tape. When splicing is appl

39、ied, the misalignment of the EIA-468-C Page 6 holes at each side of the splice shall not be more than 0.3mm in any direction. Splices shall not interfere with sprocket feed holes, nor shall the overall thickness (including lead wires) exceed dimension t1(see Table 1). Staples shall not be used. 4.12

40、 The hold-down tape shall not protrude beyond the carrier tape. No adhesive may be exposed. Two strips of adhesive hold-down tape may be used. 4.13 The components shall be held sufficiently in the tape so that their position remains within the permitted tolerances. The vertical extraction force for

41、components in the tape plane shall be greater than five (5) newtons. 4.14 All polarized components shall be oriented in one direction. Unless otherwise specified, the positive lead (i.e., anode or emitter) shall be the first lead off the reel or out of the box. The side of the fanfold box shall be m

42、arked to indicate the first lead out of the box when that side of the container is opened. Examples of marking include but are not limited to “+“ for positive lead, “-“ for negative lead, “E“ for emitter, “B“ for base, “C“ for collector, and “Pin 1” (see Figure 8). 4.15 Protection between layers of

43、components in reels only shall be provided for the length necessary to prevent component damage or lead distortion. All materials used for lead taping, container and packaging shall not cause deterioration of the component or diminish lead solderability. 4.16 The components and the outer cover on th

44、e reel shall not extend beyond the outside edge of the flange. 4.17 Empty places in the tape (i.e., missing components ) shall not exceed 0.1%, or one (1), whichever is greater, of the total components per container. No consecutive empty places are allowed. Empty places, such as programmed empty pla

45、ces at the bend of fan-fold packing, shall be by agreement between the supplier and the customer. 4.18 “Hairpin” devices are axial-leaded components which have one lead bent over such that it is essentially parallel to the other lead, thus forming a radial component for taping purposes (as in Figure

46、 2, the component marked “H”). It is recommended that these devices have standoffs or kinks formed on both leads, to provide a seating plane for the device. 4.19 For “hairpin” devices, the body shall be on the trailing side as the tape comes off the reel or out of the box. 4.20 The width of the reel

47、 or fan fold box shall allow the taped components to feed with adequate guidance and without interference. 4.21 Dimension P3limits outward deviation of leads in the carrier tape to prevent interference with tape cutting in high-speed automatic insertion machines. P3is measured from the lead center t

48、o the lead tip. There is no limit to inward deviation. 4.22 Devices with leads in more than one plane, as shown in Fig. 2 “Unguided Leads”, are permitted, but may not be compatible with high-speed automatic insertion machines. EIA-468-C Page 7 Table 3: Reel Dimensions SYMBOL DESCRIPTION DIMENSION a

49、Reel Diameter 370 maximum c Arbor Hole Diameter 14 38 n Hub Diameter 80 minimum w1Dimension Between Flanges (measured at hub) See Requirement 4.20 w2Width, including flanges and hubs 62 maximum Table 4: Fan Fold Box Dimensions SYMBOL DESCRIPTION MAXIMUM DIMENSION x Box Width 62 (See Requirement 4.20) y Box Length 372 z Box Height 372 EIA-468-C Page 8 EIA-468-C Page 9 ACKNOWLEDGEMENTS The following individuals made significant contributions to this standard Members of EIA-468 Review Task Force Bill Aldeen, Nu-Way Electronics, Task Force Chair Gene Bartlow, Universal Inst