ECA EIA-364-96-2002 TP-96 Plated Through Hole Integrity Test Procedure for Electrical Connectors《TP-96 电连接器金属化孔完整性的试验方法》.pdf
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1、 EIA STANDARD TP-96 Plated Through Hole Integrity Test Procedure for Electrical Connectors EIA-364-96 ANSI/EIA-364-96-2002(R2009) Approved: November 19, 2002 Reaffirmed: December 2, 2009 EIA-364-96 NOVEMBER 2002 ELECTRONIC COMPONENTS, ASSEMBLIES see figure 1. 1.4.2 Longitudinal section A section tak
2、en perpendicular to the surface of a printed circuit board; see figure 2. 1.4.3 Radial hole distortion The measurement of how far the outside edge of the plated through hole has been distorted from the original hole contour as a result of the compliant section insertion. The measurement is taken fro
3、m the transverse cross-section; see figure 1. EIA-364-96 Page 2 1.4.4 Plated through hole wall damage Any damage such as cracked plating in the plated through hole. 1.4.5 Inner conductor layer damage Includes any stretching of the inner conductor layers due to movement of the metal in the plated tho
4、ugh hole as a result of compliant section insertion. This movement of the plated through hole metal may cause the inner conductor layers to “stretch” and/or “crack”. The evaluation is taken from a longitudinal cross-section; see figure 2. 2 Test resources 2.1 Equipment 2.1.2 Low speed cutting saw or
5、 equivalent 2.1.3 Polishing equipment 2.1.4 Microscope with applicable magnification capability, (approximately between 50 and 250 times), to measure or observe the requirements as specified. 2.1.5 Photographic capability if required. 2.2 Materials Material to mount the specimens as required. Typica
6、l materials are two-part metallurgical cold mount epoxy or one of several thermosets or thermoplastics, suitable for hot mounting. Cold mounting is the preferred method. 2.3 Fixtures No fixtures are required for this method. 3 Test specimen 3.1 Description 3.1.1 The specimen consists of a compliant
7、pin inserted into a PTH. The reference document should indicate if this method is to be performed on a pin inserted once into a PTH or when a third pin is inserted into the same PTH, (usually this is performed to demonstrate repairability). If this method is used when a third pin is inserted, the pr
8、evious two pins should each be new pins. EIA-364-96 Page 3 3.1.2 The printed circuit board shall be of a given thickness, with finished and drilled hole size as specified. If not specified, the board shall be four layer equidistant throughout the thickness. The hole pattern annular rings shall be sp
9、ecified in the reference document. The two inner layers shall consist of parallel traces interconnecting all contacts in each row. The trace width shall be 0.254 millimeter (0.010 inch) and the trace thickness shall be 17 m ( ounce) copper, unless otherwise specified in the referencing document. 3.2
10、 Preparation 3.2.1 The reference document shall specify the insertion depth of the pin into the PTH. 3.2.2 The pins shall be inserted oriented as normal for their application. If not specified the measurements shall be taken after the third insertion. NOTE The printed circuit board shall be adequate
11、ly supported during the insertion process to minimize any flexure of the printed circuit board. 3.2.3 Five specimens shall be sectioned transversely and five shall be sectioned longitudinally unless otherwise specified. 3.2.4 The specimens should be placed in the metallurgical mounting material. It
12、may be possible to fit more than one specimen in the same mount. 3.2.5 The reference document shall specify where the measurements are to be performed, (e.g., at the mid-plane, near the top, or bottom sections of the printed circuit board, (unless otherwise specified in the referencing document the
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