ECA 540H000-1998 Sectional Specification for Burn-In Sockets Used with Ball Grid Array Devices for Use in Electronic Equipment《电子设备用圆栅极阵列器件烧进插孔的分规范》.pdf

《ECA 540H000-1998 Sectional Specification for Burn-In Sockets Used with Ball Grid Array Devices for Use in Electronic Equipment《电子设备用圆栅极阵列器件烧进插孔的分规范》.pdf》由会员分享，可在线阅读，更多相关《ECA 540H000-1998 Sectional Specification for Burn-In Sockets Used with Ball Grid Array Devices for Use in Electronic Equipment《电子设备用圆栅极阵列器件烧进插孔的分规范》.pdf（21页珍藏版）》请在麦多课文档分享上搜索。

1、ANSI/EIA-54OHOOO-997 Approved: December 12, i997 EIA SPECIFICATION Sectional Specification for Burn-In Sockets Used with Ball Grid Array Devices for Use in Electronic Equipment EIA-540HOO0 JANUARY 1998 ELECTRONIC INDUSTRIES ASSOCIATION ENGINEERING DEPARTMENT NOTICE EL4 Engineering Standards and Publ

2、ications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular

3、need. Existence of such Standards and Publications shall not in any respect preclude any member or non-member of EM from manufacturing or seiling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by tho

4、se other than EIA members, whether the standard is to be used either domestidy or internationally. Standards and Publications are adopted by EIA in accordance with the American National Standards Institute (ANSI) patent policy. By such action, FU does not assume any liability to any patent owner, no

5、r does it assume any obligation whatever to parties adopting the Standard or Publication. This EL4 Specification is considered to have International Standardization implication, but the International Electrotechnical Commission activity has not propssed to the point where a valid comparison between

6、the EIA Specifcation and the IEC document can be made. This Specification does not purport to address ali safety problems associated with its use or all applicable regulatory requirements. It is the responsibility of the user of this Specification to establish appropriate safety and health pmctices

7、and to determine the applicability of regulatory limitations before its use. (From Standards Proposal No. 3641, formulated under the cognizance of the CE-3.0 Committee on Sockets.) Published by oELEcTRONIC INDUSTRIES ASSOCIATION 1998 Engineering Department 2500 Wilson Boulevard Arhgton, VA 22201 PRI

8、CE: Please refer to the current Catalog of EU, JEDEC, and TIA STANDARDS and ENGINEERING PUBLICATIONS or call Global Engineering Documents, USA and Canada (1-800-854-7179) International (303-397-7956) AU rights reserved Printed in U.S.A. Clause STD-EIA 540HUU-ENGL 1778 W 3234bUU 0587354 5bL EIA-540H0

9、00 SECTIONAL SPECIFICATION FOR USE IN ELECTRONIC EQUIPMENT BURN-IN SOCKETS USED WITH BALL GRID ARRAY DEVICES CONTENTS 1 1.1 1.2 2 2.1 2.2 2.3 2.4 2.5 3 3.1 3.2 3.3 3.4 3.5 4 4.1 4.2 4.3 4.4 5 Scope and object Scope Object General Related documents Terminology Marking Information to be given in the D

10、etail Specification Standard values Quality assessment procedures Qualification approval procedures Primary stage of manufacture Structurally similar sockets Quality conformance inspection Alternative test methods Test methods and procedures Test conditions Mechanical tests Electrical tests Environm

11、ental tests Packaging requirements Page 1 1 1 1 1 2 2 2 2 3 3 3 3 3 3 4 4 4 5 6 7 5.1 Unit packing 7 - STD-EIA 540H-ENGL 3798 P. 3234b00 0589355 4TB H CONTENTS (Concluded) Clause Table 1 2 Lot-by-lot inspection tests Sequential qualification approval inspection tests Annex A Typical LLCR setup B Sol

12、der ball deformation C Contact head coplanarity Page 8 11 12 14 15 -11- STD-EIA 540HO-ENGL 1778 II 3234b00 058715b 334 I$B EIA-540H000 Page 1 THIS SECTIONAL SPECIFICATION WAS PREPARED BY THE ELECTRONIC INDUSTRIES ASSOCIATIONS CE-3.0 COMMITTEE ON SOCKETS 1 Scope and object 1.1 Scope This sectional sp

13、ecification relates to the bum-in sockets for Ball Grid Array (BGA) devices of assessed quality. The purpose of this specification is to provide a means of interchangeability between qualified devices and compatibility between the board and the BGA device and to provide standard socket test methods,

14、 gauges and performance requirements. 1.2 Object The object of this specification is to define: - A unified numbering system to be used for BGA sockets standardized by the Electronic Industries Association (EIA). - Functional levels and standard test methods and gauges for use in the examination of

15、these sockets. - Appropriate reference dimensions of the mating devices and board layout to establish intermateability and interchangeability criteria as specified in the detail. Test severity and performance requirements prescribed in the detail specifications referring to this sectional specificat

16、ion shall be equal to or greater than those specified herein; degradation is not permitted. 2 General 2.1 Related documents The following documents of the issue in effect form a part of this specification to the extent specified herein: EIA-5400000-A Generic Specification for Sockets for Integrated

17、Circuit (IC) Packages for Use in Electronic Equipment. STD-EIA 540H000-ENGL 1998 II 3234b00 0589357 270 m EM- 540HOOO Page 2 2.2 Terminology Terminology shall be in accordance with the issue in effect of the following publications: EIA-5400000 Generic Specification for Sockets for Integrated Circuit

18、 (IC) Packages for Use in Electronic Equipment. 2.3 Marking The sockets shall be legibly marked with the following information: - Terminal identification whenever specified by the detail specification. - Manufacturers name, trademark, or code identification number. - Identifymg number (EIA part numb

19、er, manufacturers part number). Other markings may be applied to the sockets provided they do not interfere with, obscure, or confuse those markings specified above. Where size, surface conditions or other design considerations will not allow full marking on the part, the markings shall be in the or

20、der of preference shown above. Any required markings which cannot be applied to the sockets shall be applied to the package containing the sockets. 2.4 Information to be given in a detail specification The Detail Specification, based on the relative Blank Detail Specification, shall contain the comp

21、lete technical requirements for inspection and, if required, any additional quality conformance testing. If the technical requirements of the Generic andor Sectional Specification relative to inspection are not entirely suitable (either for Technical reasons or for special applications) to the compo

22、nent described in the Detail Specification, the Detail Specification shall set out clearly the various amendments which are to be made in these requirements. 2.5 Standard values The range for voltage shall not exceed 600 Vdc. The current rating shall not exceed 1 A. Specific voltage and current rati

23、ng shall be as defined in the Detail Specification. STD-EIA 54UHOOU-ENGL 377a 111 3234b00 0587358 307 lld EIA-540H000 Page 3 3 Quality assessment procedures 3.1 Qualification approval procedures The qualification approval procedures shall be in accordance with 3.1 of EIA-5400000-A and with the follo

24、wing additional requirements: 3.1.1 Qualification inspection tests: The qualification inspection tests are prescribed in table 1 herein. When additional Test Groups are prescribed by the detail specification, the identity of the test group, the sequence of tests, and the minimum sample quantity shal

25、l be in accordance with table 1. When the detail specification prescribes tests not in table 1, the detail specification shall include the additional tests either within an existing test group(s) or as an additional test group(s). No failures shall be permitted. 3.2 Primary stage of manufacture The

26、primary stage of manufacture is the first process subsequent to the manufacture of finished piece parts and subassemblies. A subassembly is defined as the permanent assembly of two or more piece parts. 3.3 Structurally similar sockets Structurally similar sockets shall be as prescribed by EIA-540000

27、0-A. 3.4 Quality conformance inspection Quality conformance inspection shall be as prescribed by EIA-5400000-A. 3.4.1 Lot-by-Lot inspection tests: The lot-by-lot inspection tests are prescribed in table 2 herein. The sequence of tests is optional unless otherwise specified by the detail specificatio

28、n. 3.4.2 Periodic inspection tests: The periodic inspection tests shall be performed on groups I through VI1 every 36 months. 3.5 Alternative test methods Alternative test methods shall be as described in EIA-5400000-A. EIA-540H000 Page 4 4 Test methods and procedures 4.1 Test conditions Unless spec

29、ifically stated otherwise, tests and examinations required by this Standard shall be conducted under conditions within the following ranges, in accordance with EIA 364: Temperature: 25 O C f 1 O O C Relative Humidity: 45% to 75% Barometric pressure: 86 kPa to 106 kPa (77F +18“F) 4.2 Mechanical tests

30、 4.2.1 Contact retention When an axial force, as specified in the detail specification, is applied in a direction to unseat the contact fiom the insulator, the contact shall not become unseated. 4.2.4 Vibration When tested, there shall be no evidence of mechanical failure of contacts, insulator, or

31、metal parts. Sockets shall be mounted in a normal manner on a printed wiring board whose thickness shall be 1.57 mm (0.062 in) nominally. A test package simulating a production unit shall be inserted into the socket. Alternate contacts of the test package and socket shall be connected to provide a s

32、eries circuit. The circuit shall be monitored with a contact chatter current interruption detection device capable of detecting interruptions of 1 .O ps. No retaining method other than nod contact pressure andor inherent package retention as applied shall be used. A maximum current of O. 1 ampere sh

33、all be applied. There shall be no interruptions in excess of 1 ps. Conditions shall be in accordance with Test Condition VI1 of EIA 364-28. The contacts shall be capable of passing the requirements of 4.3.3 of this specification. However, contacts used for contact resistance measurement shall not ha

34、ve been used for the series monitoring. 4.2.5 Mechanical shock When tested, there shall be no evidence of mechanical failure of contacts, insulator, or metai parts. Sockets shall be mounted in a nomal manner on a printed wiring board whose thickness shall be 1.57 mm (0.062 in) nominally. A test pack

35、age simulating a production unit shall be inserted into the socket. Alternate contacts of the test package and socket shall be connected to provide a series circuit. The circuit shall be monitored with a contact chatter current interruption detection device capable of detecting interruptions of 1 .O

36、 ps. No reaining method other than nod contact pressure andor inherent package retention as applied shall be used. A maximum current of O. 1 ampere shall be applied. There shall be no interruptions in excess of 1 ps. Conditions shall be in accordance with Test Condition VI1 of EIA 364-27B. The conta

37、cts shall STD-EIA 540H000-ENGL 1778 9 3234b00 05871b0 Bb5 Bsl EIA-540HOOO Page 5 be capable of passing the requirements of 4.3.3 of this specification. However, contacts used for contact resistance measurement shall not have been used for the series monitoring. 4.2.7 Examination of dimension - Socke

38、ts shall be examined to veri that the dimensions, design and construction are in a accordance with the detail specification. 4.2.8 Visual examinations Sockets shall be examined to veri that the marking and workmanship are in accordance with the related specification. 4.2.9 Mechanical Durability Sock

39、ets shall be actuated mechanically to their maximum cycle requirements. Initial LLCR measurements shall be made using a new test package. Subsequent cycles can be performed using a dummy device. The dummy device shall be cycled a maximum of 20 cycles. LLCR measurments after cycling shall be performe

40、d using a new test package. 4.2.10 Solder Ball Deformation See Annex B for recommended method. 4.2.11 Contact head coplanarity See Annex C for recommended method 4.3 Electrical tests 4.3.1 Insulation resistance When tested, initial insulation resistance shall be 1,000 MQ or greater. The insulation r

41、esistance after humidity shall be 1,000 Msz or greater. The applied test voltage shall be 100 VDC. Sample preparation - see test sequence. Insulation resistance shall not be measured on the same contact pairs as contact resistance (millivolt level method). twenty points of contact representing the c

42、losest pairs shall be tested. 43.2 Dielectric withstanding voltage (voltage proof) When tested, there shall be no evidence of breakdown of insulation or flashover. The following details shall apply: - Preparation - see test sequence. - Magnitude of test voltage shall be specified in detail. - Nature

43、 of potential - Vac 45 Hz - 60 Hz. STD-EIA 50HUUO-ENGL 1798 3234b00 05893b3 7TL 81 EM-54OHOOO Page 6 - Points of application - Twenty points of contact representing the closest pairs shall be tested. 43.3 Low-level contact resistance 4.3.3.1 Measurement technique Measurement shall be performed in ac

44、cordance with annex A. 4.3.3.2 Test package The test package shall be a mating device with appropriate circuitry and shall allow the actual resistance of the contact position to be measured. See annex A. 4.3.4 Capacitance The socket shall be tested at: -Test Cequency - 1 kHz - Polarization - not app

45、licable - Unmated and unmounted - Adjacent positions 4.4 Environmental tests 4.4.1 Solderability This test shall be performed on 10 individual contacts. The terminai shall be immersed to a depth sufficient to include ail portions of the terminai to which solder connections would normally be made. Th

46、e dipped surfaces of the terminal shall be at least 95% covered by continuous new solder coating and shall not have pin holes or voids which are concentrated in one area or exceed 5% of the dipped area. Terminals shall be examined using 1OX magnification. 4.4.2 Resistance to soldering heat When test

47、ed, there shall be no evidence of distortion of plastic or metai components or any other damage when examined under 3X magnification. The sockets shall be mounted to a typical e.g., 1.57 mm (0.062 in) thick printed wiring board. STD-EIA 540H000-ENGL 1778 m 3234b00 05891b2 b3 EIA-540H000 Page 7 4.4.3

48、 Temperaturehumidity Terminated sockets shall be tested at steady state humidity and accelerated temperature per the detail specification. Upon completion of the exposure period, the sockets shall be conditioned at room ambient for a period of 4 hours. The sockets shall meet the requirements of 4.3.

49、1,4.3.2 and 4.3.3 of this specification. 4.4.4 Temperature life The socket shall be mated with a test package. The mated socket shall be exposed to testing conditions per the detail specification. Upon completion of the exposure period, the sockets shall be conditioned at room ambient for a minimum of two hours. The socket contacts shall meet the requirements of 4.3.3 of this specification. 4.4.5 Rapid change of temperature (thermal shock) Sockets shall be tested using a test package and the retention feature, if app