ECA 513-1986 EIA NARM Standard Low Profile Relays for Circuit Board Mounting《EIA NARM标准 电路印制板安装的Low Profile中继》.pdf

《ECA 513-1986 EIA NARM Standard Low Profile Relays for Circuit Board Mounting《EIA NARM标准 电路印制板安装的Low Profile中继》.pdf》由会员分享，可在线阅读，更多相关《ECA 513-1986 EIA NARM Standard Low Profile Relays for Circuit Board Mounting《EIA NARM标准 电路印制板安装的Low Profile中继》.pdf（99页珍藏版）》请在麦多课文档分享上搜索。

1、 4, - t EIA 513 86 m 3234600 0072920 b m - - -4 % ANSI/EIA- 513 -1985 APPROVED: “BER 5, 1985 53 v) I U W - EIA STANDARD EIAINARM STANDARD LOW PROFILE RELAYS FOR CIRCUIT BOARD MOUNTING EIA-513 OCTOBER 1986 Engineeing Department ELECTRONIC INDUSTRIES ASSOCIATION EIA 533 Bb W 3234600 0072923 B m NOTICE

2、 EIA Engineering Standards and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the

3、 proper product for his particular need. Existence of such Standards and Pub- lications shall not in any respect preclude any member or non-member of EIA from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publicatio

4、ns preclude their voluntary use by those other than EIA members, whether the standard is to be used either domestically or internationally. . Recommended Standards and Publications are adopted by EIA without regard to whether or not their adoption may involve patents on articles, materials, or proce

5、sses. By such action, EIA does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the Recom- mended Standard or Publication. This EIA Recommended Standard is considered to have international stan- dardization implications, but the IEC activit

6、y has not progressed to the point where a valid comparison between the EIA Recommended Standard and the IEC Recommendation can be made. - Pub 1 ished by ELECTRONIC INDUSTRIES ASSOCIATION Engineering Department 2001 Eye Street, NW Washington, D.C. 20006 Copyright 19 86 ELECTRONIC INDUSTRIES ASSOCIATI

7、ON All rights reserved PRICE: $27.00 Y r EIA 513 Bb m 3234b00 0072922 T m EIA-5 13 1 . 2 . 3 . 4 . 5 . 6 . (b 7 . 8 . 9 . 1 o . 11 . 12 . EIA/NARI$ STANDARD LOW PROFILE RELAYS .FOR CIRCUIT BOARD MOUNTING CONTENTS SCOPE . APPLICABLE DOCUMENTS STANDARD TEST CONDITIONS 3.1 General . 3.2 Standard Refere

8、nce Conditions . 3.3 Accuracy of Measurements and Instruments 3.4 Performance of Tests . 3.5 Sequence of Tests . 3.6 Definitions (Use of ANSI C83.16 is recommended for definitions not listed below.). . QUALITY ASSURANCE PROVISIONS 4.1 General . 4.2 Quality Conformance Inspection 5.1 General . 5.2 Re

9、quirements 5.3 Procedure . PICKUP. NONPICKUP. HOLD AND DROPOUT CURRENT OR VOLTAGE . 6.1 General . 6.2 Requirements 6.3 Procedure . CONTACT RESISTANCE 7.1 General . 7.2 Requirements 7.3 Procedure . 8.1 Genera 8.2 Requirements 8.3 Procedure . 9.1 General . 9.2 Requirements 9.3 Procedure . 9.4 Precauti

10、ons . WINDING RESISTANCE 10.1 ene eral . 10.2 Requirements 10.3 Procedure . 10.4 Precautions . CONTACT BOUNCE 11.1 General . 11.2 Requirements 11.3 Procedure . FUNCTIONING TIME 12.1 Operate Time . 12.2 Release Time VISUAL AND MECHANICAL INSPECTION. INSULATION RESISTANCE . DIELECTRIC-WITHSTANDING VOL

11、TAGE . 3 9 9 9 10 10 10 11 12 12 12 12 15 15 15 16 17 17 17 17 17 17 18 18 18 19 19 19 20 21 23 23 23 23 25 25 26 e EIA 513 86 3234600 O072923 II EIA-513 13 . 14. . 15 . 16 . 17 . 18 . 19 . 20 . 21 . 22 . 23 . 24 . 25 . HIGH- 13.1 13.2 AND LOW-TEMPERATURE TESTS . 27 General . 27 Reauirements 27 a 13

12、.3 Procedure . 28 14.1 General . 29 14.2 Requirements 29 14.3 Procedure . 29 15.1 General . 30 15.2 Requirements 30 15.3 Procedure . 30 16.1 Purpose; 32 THERMAL SHOCK 29 MECHANICAL LIFE . 30 VIBRATION . 32 16.2 Requirements 33 16.3 Procedure . 33 16.4 Final Measurements 34 SHOCK . 37 17.1 General .

13、37 17.2 Requirements 37 17.3 Procedure . 37 17.4 Final Measurements 38 ACCELERATION 41 18.1 General . 41 18.2 Requirements 41 18.3 Procedure . 41 18.4 Final Measurements 42 HUMIDITY TESTS 44 19.1 General . 44 19.2 Requirements 44 19.3 Procedure . 44 WINDING CORROSION (POLARIZATION) 46 20.1 General .

14、 46 20.2 Requirements 46 20.3 Procedure . 47 CROSSTALK AND INSERTION LOSS 47 21.1 General . 47 21.2 Requirements 47 21.3 Procedure . 49 WINDING INDUCTANCE 49 22.1 General . 49 22.2 Requirements 49 22.3 Procedure . 50 WINDING TEMPERATURE RISE 52 23.1 General . 52 . 23.2 Requirements 52 23.3 Procedure

15、 . 52 24.2 Requirements 53 CAPACITANCE . 53 24.1 General . 53 24.3 Procedure . 53 CONTACT LIFE TEST . 54 25.1 General . 54 25.3 Procedure . 55 25.2 Requirements 54 I . L 7 EIA 513 86 m 323YbOO 007292q 3 m EIA-5 13 26 . 27 . 28 . 29 . 30 . 31 . 32 . 33 . 34 . 25.4 Rated-Load Test Procedure . 25.5 Mil

16、liampere-Range Test Procedure 25.6 Millivolt-Microampere-Range Test Frocedure CONTINUOUS-CONTACT-CURRENT TEST . 26.1 General . 26.2 Requirements . 26.3 Procedure OVERLOAD TEST . 27.1 General . 27.2 Requirements 27.3 Procedure . 28.1 General . -28.3 Procedure . THERMAL EMF . 29.1 General . 29.3 Proce

17、dure . 30.1 General . 30.2 Solder Bath . 30.3 Materials . 30.4 Procedure . 30.5 Requirements ENVIRONMENTAL SEAL 31.1 General 31.2 Requirements 31.3 Materials . 31.4 Apparatus . 31.5 Precautions . 31.6 Procedure . TERMINATION GRID PATTERN. SCHEMATIC. AND PHYSICAL DIMENSIONS 32.1 General . 32.2 Single

18、 Transfer . 32.3 Two Transfer 32.4 Four Transfer . 32.5 Six Transfer PREPARATION FOR DELIVERY 33.1 Packaging . 33.2 Labeling FCC REGISTRATION 34.1 General . CONTACT NOISE . 28.2 Requirements 29.2 Requirements SOLDERABILITY . 56 59 60 60 60 60 61 62 62 62 62 63 63 63 63 65 65 65 65 67 67 67 67 67 67

19、69 69 69 69 69 69 70 70 70 70 76 82 84 87 87 87 87 a7 I . 3 - - EIA 513 6 3234600 0072925 5 EIA-513 Page 1 LOW PROFILE RELAYS FOR CIRCUIT BOARD MOUNTING (From EIA Standards Proposal No. 1623, formulated under the cognizance of the P-12.2 Working Group on Relays.) 1. SCOPE This standard applies to ar

20、mature-type, circuit-board-mounted relays permitting board center spacings of less than 1 inch. These relays generally are classed in the load range of O to. 2 amperes. This document is intended to help define standard packages, footprints and test conditions so as to promote interchangeability. Rel

21、ays conforming to this standard are suitable for use in electrical and electronic equipment where application is within the stated limits of operation. Relays conforming to this standard may be tested as defined in applicable sections of EIA-407A, EIA/NARM Standard Testing Procedures for Relays for

22、Electrical and Electronic Equipment. This standard does not apply to either mercury-wetted or dry-reed relays. 2. APPLICABLE DOCUMENTS The following documents form a part of this standard to the extent noted herein. Military MIL-STD-105 - Sampling Procedures and Tables for MIL-STD-C45662 - Calibrati

23、on System Requirements Inspection by Attributes Commercia 1 EIA-407A - Testing Procedures for Relays for Electrical EIA-178 - Solderability Test Standard ANSI (33.16 - Definitions and Terminology for Relays for Electronic Equipment and Electronic Equipment EIA-513 Page 2 3. STANDARD TEST CONDITIONS

24、3.1 General 3.1.1 The methods nd measuring techniques described herein are generally accepted procedures. Equivalent methods may be used if agreed upon by the manufacturer and user. 3.1.2 The applicability of the tests and methods cited herein depends upon the type of relay and its intended function

25、. Requirements, applicable test procedures, and performance criteria, therefore, should be specified in the individual relay specifications. The specifications shall also indicate whether data are to be recorded on a variables or attribute basis and shall list disposition instructions for the test d

26、ata. 3.1.3 The values specified in this publication are those used and accepted in the industry. 3.2 Standard Reference Conditions The reference conditions for characteristics that are affected by atmospheric conditions shall be: (1) Temperature (2) Relative humidity 20-50 percent (3) Barometric pre

27、ssure 29.5 f 1 inch Hg. 73.43F f 5.4OF (23OC ? 3C) (749.3 f 25.4 mm Hg.) (0.999 f 0.034 kPa) Standard test conditions may be normal room ambient, provided measurements of characteristics affected by environment are corrected to standard reference conditions as applicable. 3.3 Accuracy of Measurement

28、s and Instruments Inaccuracies in measurements shall not be considered as effectively increasing the specified tolerances. Proper and efficient use of instruments of sufficient accuracy and suitable quality is essential. Instruments shall be calibrated and calibration records made available if requi

29、red. For pointer type instruments the required reading should reach at least 60 percent of the deflection range of the instrument to assure adequate reading resolution. 3.4 Performance of Tests Suitable visual or automatic means for monitoring all tests shall be provided to assure that tests are con

30、ducted in accordance with the specified requirements. EIA 513 8b m 3234600 0072927 9 m EIA-513 Page 3 e 3.5 Sequence of Tests The sequence of environmental tests can produce varied results. The detailed specifications, therefore, should indicate the required sequence as determined by relay design an

31、d usage. 3.6 Definitions (Use of.ANSI C83.16 is recommended for definitions not listed belo.) Ampere Turns (AT): The product of the number of turns of wire in an electromagnetic coil winding and the current in amperes passing through the winding. Armature: The moving magnetic member or members of an

32、 electromagnetic relay structure. Back Contact: Normally closed contact in a Form C switch (transfer switch). See Contact, Break-Before-Make. Bias, Electrical: An electrically produced force tending to move the armature towards a given position. Bias, Magnetic: A steady magnetic field (permanent mag

33、net) applied to the magnetic circuit of a relay to aid or impede operation of the armature. Bias, Mechanical: A mechanical force tending to move the armature towards a given position. Bobbin: Coil form or spool on which a coil is wound. Bounce, Contact: Internally caused intermittent and undesired o

34、pening of closed contacts, or closing of open contacts of a relay caused by: (1) impingement of mating contacts, or . (2) impact of the armature against the coil core on pickup or against the backstop on dropout, or (3) momentary hesitation, or reversal, of armature motion during pickup or dropout.

35、r EIA 513 Bb m 3234b00 0072928 O m Bridging: I (1) make-before-break contact action, as when a wiper touches two successive contacts simultaneously while moving from one to the other (Form D), (2) a result of contact erosion wherein a metallic protrusion or bridge is built up between opposite contac

36、t faces to cause an electrical path between them, or (3) a form of contact erosion occurring on the break of a low-voltage, low-inductance circuit, at the instant of separation, that results in melting and resolidifying of contact metal in the form of a metallic protrusion or bridge . Chatter, Conta

37、ct: Externally caused undesired vibration of mating contacts during which there may or may not be actual physical contact opening. A change in contact resistance without a physical separation of the contact surfaces is referred to as dynamic resistance and appears on the screen of an oscilloscope ha

38、ving adequate sensitivity and resolution as “grass“. Chatter may occur when the relay is subjected to external shock or vibration. Coil: An assembly consisting of one or more windings on a common bobbin. Coil Power Dissipation: The electrical power (watts) dissipated by the energized winding or wind

39、ings of a coil. Contacts: The current-carrying parts of a switch that engage or disengage to open or close electrical circuits. Contact, Break-Before-Make: A contact combination in which one contact opens its connection to another contact and then closes its connection to a third contact. Also, a co

40、ntact combination in which the opening contact opens before the closing contact closes. Form C contact; single pole, double throw (SPDT). Contact, Make-Before-Break, Continuity Transfer: -A contact combination in which the opening contact opens after the closing contact closes. Form D contact; singl

41、e pole, double throw (SPDT). Contact, Normally Closed: A contact combination which is closed when the relay is in its unoperated state. Form B contact; single pole, single throw (SPST). EIA 513 Ab m 3234600 0072929 2 m EIA-5 13 Page 5 Dielectric Withstanding Voltage: The voltage which may be applied

42、 between insulated parts of a relay without damage, arcing breakdown, or excessive leakage. Differential: The difference, expressed in voltage or current, between pickup and dropout values of a relay contact. Dropout (DO) Value, Measured: Dropout Value, Specified: See Operating Characteristics See O

43、perating Characteristics. Dropout Time: See Operating Characteristics. Dropout: Release; the return of a relay to its unoperated state on opening the energizing circuit. See Operating Characteristics. Duty Cycle: A statement of energized and de-energized time in repetitious operation, for example, o

44、ne second on, two seconds off (often expressed as the energized percentage of total cycle time, e.g., 33.3%). Dwell: Form C Contacts. The value of coil drive required to. open the normally closed circuit subtracted from the coil drive required to close the normally open contacts. Flux Fie1.d: The ma

45、gnetic lines of force produced by a coil and/or permanent magnet. Front Contact: Normally open contact in a Form C switch (transfer switch). See Contact, Break-Before-Make. Gap, Contact: The distance between mating contacts when the contacts are open. . Hold Value: See Operating Characteristics. . H

46、ysteresis: The amount of the magnetization of a ferrous material lags the magnetizing force due to molecular reluctance. Latching Relay (Bistable): A bistable, polarized relay is a two-position relay that will remain in its last operated position keeping the operated contacts closed after the operat

47、ing windingcs) is (are) de-energized Nonpickup Value: See Operating Characteristics. Operate: See Pickup. EIA 513 b m 3234b00 0072930 9 m EIA-5 13 Page 6 Operating Characteristics: Pickup, nonpickup, hold and dropout, voltage or current. Pickup and operate are equivalent terms as are dropout and rel

48、ease. dropout value. measured. As the current or voltage on an operated relav is decreased, the value at which all contacts restore to their unoperated position. dropout value, specified. As the current or voltage on an operated relay is decreased, the value at or above which all relay contacts must

49、 restore to their unoperated positions. hold value, specified. As the current or voltage on an operated relay is decreased, the value which must be reached before any contact change occurs. nonpickup value, specified. As the current or voltage on an unoperated relay is increased, the value which must be reached before any contact change occurs. nonoperate value. See nonpickup value. operate value. See pickup value. operate value, just. See pickup value, measured. operate value, must. See pickup value, specified. pickup value, measured. As .the current or voltage on