DLA SMD-5962-99574 REV B-2008 MICROCIRCUIT MEMORY DIGITAL CMOS ELECTRICALLY ALTERABLE (IN-SYSTEM REPROGRAMMABLE) 1 124 022 GATES PROGRAMMABLE LOGIC DEVICE MONOLITHIC SILICON.pdf

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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Corrections to 1.3, 1.5, and Table I; added ceramic column grid array package designated. ksr 03-08-28 Raymond Monnin B Boilerplate update, part of 5 year review. ksr 08-12-15 Robert M. Heber REV B B B B SHEET 35 36 37 38 REV B B B B B B B B B B

2、B B B B B B B B B B SHEET 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 REV STATUS REV B B B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Kenneth Rice STANDARD MICROCIRCUIT DRAWING CHECKED BY Rajesh Pithadia DEFENSE SUPPLY CENTER COLUMBUS

3、COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL APPROVED BY Raymond Monnin DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 02 09 02 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, ELECTRICALLY ALTERABLE (IN-SYSTEM REPROGRAMMABLE), 1,124,022

4、GATES, PROGRAMMABLE LOGIC DEVICE, MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-99574 SHEET 1 OF 38 DSCC FORM 2233 APR 97 5962-E084-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 596

5、2-99574 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents three product assurance class levels consisting of space application (device class V), high reliability (device classes M and Q), and nontraditio

6、nal performance environment (device class N). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. For device class N, the user is cautioned

7、 to assure that the device is appropriate for the application environment. 1.2 PIN. The PIN is as shown in the following example: 5962 - 99574 01 Q X C Federal RHA Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see

8、1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes N, Q, and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are

9、marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function Access time 01 XQV1000-4 1124022 gate programmable array 1.0 ns 1.2.3 Device class designa

10、tor. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appe

11、ndix A N Certification and qualification to MIL-PRF-38535 with a nontraditional performance environment (encapsulated in plastic) Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descri

12、ptive designator Terminals Package style U LBGA-B-560 560 Ball grid array with five rows on each side (plastic) (JEDEC MO-192-BAV-1) X LCGA-B-560 560 Column grid array with five rows on each side (JEDEC MO-128) (ceramic) 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device

13、classes N, Q, and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-99574 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSC

14、C FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ Supply voltage range to ground potential (VCCINT) - -0.5 V dc to +3.0 V dc Supply voltage range to ground potential (VCCO) - -0.5 V dc to +4.0 V dc DC input voltage range ( VIN)Internal threshold- -0.5 V to 5.5V DC input voltage range (VIN) usin

15、g Ref - -0.5 V to 3.6 V Voltage applied to three-state output(VTS) - -0.5 V to 5.5V Lead temperature (soldering, 10 seconds) - +260C Power dissipation (PD ) - 2.0 W Thermal resistance, junction-to-case (JC): Case outlines U - 0.8C/W 3/ Case outlines X - 1.6C/W 3/ Junction temperature (TJ) for cerami

16、c packages- +150C 4/ Junction temperature (TJ) for plastic packages- +125C 4/ Storage temperature range - -65C to +150C 1.4 Recommended operating conditions. Supply voltage relative to ground(VCCINT) - +2.375 V dc minimum to +2.625 V dc maximum Supply voltage relative to ground(VCCO) - +1.2 V dc min

17、imum to +3.6 V dc maximum Input high voltage ( VIH) - 2.0 V dc minimum Input low voltage (VIL) - 0.8 V dc maximum Maximum input signal transition time (tIN) - 250 ns Case operating temperature range (TC) - -40C to +125C Junction operating temperature range (TJ) - -40C to +125C for Plastic packages 1

18、.5 Radiation features. Maximum total dose available (dose rate = 50 300 rads(Si)/s) 100Krads(Si) 1.6 Mechanical conditions. Maximum continuous load applied to part .4.0 grams/ball 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards,

19、and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPA

20、RTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these d

21、ocuments are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) _ 1/ All voltage values in this drawing are with respect to VSS2/ Stresses above the absolute maximum rating may cau

22、se permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 3/ When a thermal resistance for this case is specified in MIL-STD-1835 that value shall supersede the value indicated herein. 4/ Maximum junction temperature shall not be exce

23、eded except for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-99574 DEFENSE SUPPLY CENTER COLUMBUS COLUMB

24、US, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of the documents are the issues of the documents cited in the solicitation

25、. AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM) ASTM Standard F1192-00 - Standard Guide for the Measurement of Single Event Phenomena from Heavy Ion Irradiation of Semiconductor Devices. (Applications for copies of ASTM publications should be addressed to: ASTM International, PO Box C700, 100 Ba

26、rr Harbor Drive, West Conshohocken, PA 19428-2959; http:/www.astm.org.) ELECTRONICS INDUSTRIES ASSOCIATION (EIA) JEDEC Standard EIA/JESD78 - IC Latch-Up Test. JEDEC Publication EIA/JEP 95 - Registered and Standard Outlines for Semiconductor Devices (Applications for copies should be addressed to the

27、 Electronics Industries Association, 2500 Wilson Boulevard, Arlington, VA 22201; http:/www.jedec.org.) (Non-Government standards and other publications are normally available from the organizations that prepare or distribute the documents. These documents also may be available in or through librarie

28、s or other informational services.) 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exempti

29、on has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes N, Q, and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shal

30、l not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, constructio

31、n, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes N, Q, and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The te

32、rminal connections shall be as specified on figure 2. 3.2.3 Logic block diagram. The logic block diagram shall be as specified on figure 3. 3.2.4 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document revision level control and shall be made

33、 available to the preparing and acquiring activity upon request. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall a

34、pply over the full case operating or junction temperature range as applicable. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with th

35、e PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA de

36、signator shall still be marked. Marking for device classes N, Q, and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes N, Q, and V shall be a “Q

37、ML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-99574 DEFENSE SUPPLY CEN

38、TER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 3.6 Certificate of compliance. For device classes N, Q, and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 he

39、rein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing

40、shall affirm that the manufacturers product meets, for device classes N, Q, and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes

41、 N, Q, and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devi

42、ces acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore

43、documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 42 (see MIL-PRF-38535, appendix A). 4. VERIFICATION 4.1 Sampling and inspection. Fo

44、r device classes N, Q, and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sam

45、pling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes N, Q, and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device cl

46、ass M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Delete the sequence specified as initial (preburn-in) electrical parameters through interim (postbu

47、rn-in) electrical parameters of method 5004 and substitute lines 1 through 6 of table IIA herein. b. For device class M, the test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. For device class M, the test circuit shall specify the inputs, outputs, b