DLA SMD-5962-97629 REV C-2009 MICROCIRCUIT HYBRID H-BRIDGE PULSE WIDTH MODULATOR MOTOR DRIVER AMPLIFIER.pdf

《DLA SMD-5962-97629 REV C-2009 MICROCIRCUIT HYBRID H-BRIDGE PULSE WIDTH MODULATOR MOTOR DRIVER AMPLIFIER.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-97629 REV C-2009 MICROCIRCUIT HYBRID H-BRIDGE PULSE WIDTH MODULATOR MOTOR DRIVER AMPLIFIER.pdf（10页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add device type 02 and vendor CAGE 51651 Table I, add note 2. Update drawing boilerplate to the most current format. 03-02-28 Raymond Monnin B Update drawing to the latest requirements. -sld 06-08-01 Raymond Monnin C 1.3 and 1.4, supply voltage a

2、nd logic supply, correct : 80 V, 28 V and 16 V, 12 V to +80 V, +28 V and +16 V, +12 V. 1.3, power dissipation, add TC +25C. Figure 1, dimension D max, correct .770“ and 19.56 mm to .780“ and 19.81 mm. Add note to table II, Group C end-point test parameters. -gz 09-06-04 Joseph D Rodenbeck REV SHEET

3、REV SHEET REV STATUS REV C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY Gary Zahn DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Michael C. Jones COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil/ THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS

4、APPROVED BY Kendall A. Cottongim MICROCIRCUIT, HYBRID, H-BRIDGE, PULSE WIDTH MODULATOR MOTOR DRIVER/ AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 97-09-03 AMPLIFIER AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-97629 SHEET 1 OF 9 DSCC FORM 2233 APR 97 5962-E337-09 Provided

5、 by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97629 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents five product as

6、surance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN. 1.2 PIN. The PIN shall

7、 be as shown in the following example: 5962 - 97629 01 H X A Federal RHA Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 Radiation hardness assurance (RHA) designator.

8、RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 SA 51

9、M H-bridge, pulse width modulator motor driver/amplifier 02 MSK 4201B H-bridge, pulse width modulator motor driver/amplifier 1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level. All levels are defined by the requirements of MIL

10、-PRF-38534 and require QML Certification as well as qualification (Class H, K, and E) or QML Listing (Class G and D). The product assurance levels are as follows: Device class Device performance documentation K Highest reliability class available. This level is intended for use in space applications

11、. H Standard military quality class level. This level is intended for use in applications where non-space high reliability devices are required. G Reduced testing version of the standard military quality class. This level uses the Class H screening and In-Process Inspections with a possible limited

12、temperature range, manufacturer specified incoming flow, and the manufacturer guarantees (but may not test) periodic and conformance inspections (Group A, B, C, and D). E Designates devices which are based upon one of the other classes (K, H, or G) with exception(s) taken to the requirements of that

13、 class. These exception(s) must be specified in the device acquisition document; therefore the acquisition document should be reviewed to ensure that the exception(s) taken will not adversely affect system performance. D Manufacturer specified quality class. Quality level is defined by the manufactu

14、rers internal, QML certified flow. This product may have a limited temperature range. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97629 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LE

15、VEL C SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X See figure 1 8 Flange mount package 1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-385

16、34. 1.3 Absolute maximum ratings. 1/ Supply voltage (+VS). +80 V dc Logic supply (+VCC) +16 V dc Continuous output current 5 A Peak output current (T 100 ms). 7 A Input voltage (VIN). 0 V to +VCCTotal power dissipation (PD) TC +25C. 60 W/Transistor Thermal resistance (output to switches). 2.6C/W Jun

17、ction temperature (TJ) . +175C Storage temperature range -65C to +150C Lead temperature (soldering, 10 seconds). +300C 1.4 Recommended operating conditions. Supply voltage (+VS). +28 V dc Logic supply (+VCC) +12 V dc Disable input. 0 V to 5 V Pulse width modulator input . 0 V to 5 V Pulse width modu

18、lator input frequency. 500 kHz maximum Case operating temperature range (TC) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherw

19、ise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interfa

20、ce Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization

21、Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) _ 1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Provided by IHSNot for ResaleNo repr

22、oduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97629 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 2.2 Order of precedence. In the event of a conflict between the text of this drawing a

23、nd the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device class

24、es D, E, G, H, and K shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 shall include the performance of all tests herein or as designated in the device manufacturers Quality Management (QM) plan or as designated for the applicable device class. The manufacturer may eliminate,

25、modify or optimize the tests and inspections herein, however the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not affect the form, fit, or function of the device for the applicable device class.

26、3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connectio

27、ns shall be as specified on figure 2. 3.2.3 Schematic diagram. The schematic diagram shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full

28、specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38

29、534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers vendor similar PIN may also be marked. 3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described herein shall maintain the electrical test

30、data (variables format) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those which, if any, are guaranteed. This data shall be maintained under document revisio

31、n level control by the manufacturer and be made available to the preparing activity (DSCC-VA) upon request. 3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this drawing. The certificate of compliance (original copy) submitted to

32、DSCC-VA shall affirm that the manufacturers product meets the performance requirements of MIL-PRF-38534 and herein. 3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of microcircuits delivered to this drawing. 4. VERIFICATION 4.

33、1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. Provided by IHSNot for Res

34、aleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97629 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Limits Test Symbol Conditio

35、ns 1/ -55C TC+125C unless otherwise specified Group A subgroups Device type Min Max Unit Quiescent current IQ PWM not switching 1,2,3 01,02 18 mA 1 1.8 2 2.4 ON voltage VDSID= 5 A 3 01,02 1.2 V 1,3 25 OFF leakage IDSSOutput off, VDS= 70 V, no load 2 01,02 250 A Operating supply 2/ current IS PWM = 4

36、5 kHz TTL, TC= +25C 4 01,02 60 mA Input voltage 2/ threshold VINTHInput increased until AOUTand BOUT= change state 1,2,3 01,02 0.8 2.7 V Disable function DISDisable 3.6 V, PWM input = 45 kHz, verify no switching, TC= +25C 7 01,02 Pass/Fail 1/ +VCC= +12 V dc, +VS= +28 V dc, RSENSE = Disable = Ground,

37、 Load = 1 kohm, AOUTto BOUT, unless otherwise specified. 2/ Parameter shall be guaranteed to the limits specified in table I, if not tested. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97629 DEFENSE SUPPL

38、Y CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 Case outline X. Millimeters Inches Symbol Min Max Min Max A - 6.35 - .250 b 0.97 1.07 .038 .042 D - 39.22 - 1.544 D - 19.81 - .780 E - 25.65 - 1.010 F - 2.54 - .100 L 12.19 12.70 .480 .500 p 3.84 4.09 .151 .16

39、1 q 30.02 30.28 1.182 1.192 R 6.35 REF .250 REF s 15.06 REF .593 REF NOTE: 1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units

40、 shall rule. FIGURE 1. Case outline. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97629 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 Device types

41、01 and 02 Case outline X Terminal number Terminal symbol 1 2 3 4 5 6 7 8 +VSBOUT+VCCDISABLE Ground Input AOUTRSENSEFIGURE 2. Terminal connections. FIGURE 3. Schematic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAW

42、ING SIZE A 5962-97629 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 8 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-PRF-38534 test requirements Subgroups (in accordance with MIL-PRF-38534, group A test table) Interim electrical parameters 1 Final

43、 electrical parameters 1*, 2, 3, 4, 7 Group A test requirements 1, 2, 3, 4, 7 Group C end-point electrical parameters 1/ 1, 2, 3, 4, 7 End-point electrical parameters for Radiation Hardness Assurance (RHA) devices Not applicable * PDA applies to subgroup 1. 1/ As a minimum, for all Group C testing p

44、erformed after (Month-Day-Year) manufacturers shall perform subgroups 1, 2, and 3 from the Group A electrical test table (Table C-Xa of MIL-PRF-38534). 4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply: a. Pre-seal burn-in test, method

45、1030 of MIL-STD-883. (Optional for class H) (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify the

46、inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TAas specified in accordance with table I of method 1015 of MIL-STD-883. b. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test c

47、ircuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the in

48、tent specified in method 1015 of MIL-STD-883. (2) TAas specified in accordance with table I of method 1015 of MIL-STD-883. c. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Conformance and periodic inspections. Conformance inspectio