DLA SMD-5962-96819 REV B-2009 MICROCIRCUIT DIGITAL ADVANCED HIGH SPEED CMOS OCTAL BUS TRANSCEIVER WITH THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf

《DLA SMD-5962-96819 REV B-2009 MICROCIRCUIT DIGITAL ADVANCED HIGH SPEED CMOS OCTAL BUS TRANSCEIVER WITH THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-96819 REV B-2009 MICROCIRCUIT DIGITAL ADVANCED HIGH SPEED CMOS OCTAL BUS TRANSCEIVER WITH THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf（18页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R358-97. - JAK 97-06-27 Monica L. Poelking B Redrawn with changes: Incorporate previous Notice of Revision (NOR). Correct output voltage range (VOUT) in section 1.3. Add information in footnotes 4/ of the Figur

2、e 5. Update the boilerplate paragraphs as specified in current MIL-PRF-38535 requirements. - MAA 09-02-04 Charles F. Saffle REV SHEET REV SHEET REV B B B SHEET 15 16 17 REV B B B B B B B B B B B B B B REV STATUS OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Joseph A. Kerby CH

3、ECKED BY Monica L. Poelking DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218 - 3990 http:/www.dscc.dla.mil APPROVED BY Monica L. Poelking DRAWING APPROVAL DATE 96-10-18 MICROCIRCUIT, DIGITAL, ADVANCED HIGH SPEED CMOS, OCTAL BUS TRANSCEIVER WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITH

4、IC SILICON SIZE A CAGE CODE 67268 5962-96819 STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A REVISION LEVEL B SHEET 1 OF 17 DSCC FORM 2233 APR 97 5962-E147-09 Provided by IHSNot for ResaleNo reproduction or network

5、ing permitted without license from IHS-,-,-SIZE A 5962-96819 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218 - 3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliab

6、ility (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN

7、is as shown in the following example: 5962 - 96819 01 Q R A Federal RHA Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marke

8、d devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device

9、type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54AHCT245 Octal bus transceiver with three-state outputs, TTL compatible inputs 1.2.3 Device class designator. The device class designator is a single letter identifying the product a

10、ssurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case ou

11、tline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line S GDFP2-F20 or CDFP3-F20 20 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish

12、is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SIZE A 5962-96819 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO

13、 43218 - 3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage range (VIN) -0.5 V dc to +7.0 V dc 4/ DC output voltage range (VOUT). -0.5 V dc to VCC+ 0.5 V dc 4/ DC input clamp current (IIK) (VIN

14、 0.0 V ) -20 mA DC output clamp current (IOK) (VOUT 0.0 V or VOUT VCC) 20 mA Continuous output current (IOUT) (VOUT= 0.0 V to VCC) 25 mA Continuous current through VCCor GND . 75 mA Maximum power dissipation at TA= +55C (in still air) (PD ) 700 mW Storage temperature range (TSTG) . -65C to +150C Lea

15、d temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC). See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. 2/ 3/ 5/ Supply voltage range (VCC) +4.5 V dc to +5.5 V dc Minimum high level input voltage (VIH) +2.0 V Maximum low level inp

16、ut voltage (VIL) . +0.8 V Input voltage range (VIN) +0.0 V dc to 5.5 V Output voltage range (VOUT) +0.0 V dc to VCCMaximum high level output current (IOH) -8 mA Maximum low level output current (IOL) +8 mA Maximum input rise or fall rate (t/V) 20 ns/V Case operating temperature range (TC) -55C to +1

17、25C 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ The limits of the parameters specified herein shall a

18、pply over the full specified VCCrange and case temperature range of -55C to +125C. Unused inputs must be held high or low 4/ The input and output voltage ratings may be exceeded provided that the input and output current ratings are observed. 5/ Unused inputs must be held high or low to prevent them

19、 from floating. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SIZE A 5962-96819 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218 - 3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Gove

20、rnment specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICA

21、TION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard

22、Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In

23、the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The

24、 individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The ind

25、ividual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 an

26、d herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table

27、shall be as specified on figure 2. 3.2.4 Block or Logic diagram. The block or logic diagram shall be as specified on figure 3. 3.2.5 Ground bounce load circuit and waveforms. The ground bounce load circuit and waveforms shall be as specified on figure 4. 3.2.6 Switching waveforms and test circuit. T

28、he switching waveforms and test circuit shall be as specified on figure 5. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SIZE A 5962-96819 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218 - 3990 REVISION LEVEL B SHE

29、ET 5 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics and post-irradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and post-irradiation parameter limits are as specified in table I and shall apply over the full case operating te

30、mperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN

31、 may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q a

32、nd V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for devic

33、e class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class

34、 M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the m

35、anufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 o

36、r for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is

37、 required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made ava

38、ilable onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 36 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without l

39、icense from IHS-,-,-SIZE A 5962-96819 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218 - 3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Limits 3/ Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C

40、TC +125C +4.5 V VCC +5.5 V unless otherwise specified VCCGroup A subgroups Min Max Unit IOH= -50 A 1, 2, 3 4.4 1 3.94 High level output voltage 3006 VOHFor all inputs affecting output under test, VIH= 2.0 V or VIL= 0.8 V For all other inputs, VIN= VCCor GND IOH= -8 mA 4.5 V 2, 3 3.8 V IOL= +50 A 1,

41、2, 3 0.1 1 0.36 Low level output voltage 3007 VOLFor all inputs affecting output under test, VIH= 2.0 V or VIL= 0.8 VFor all other inputs, VIN= VCCor GND IOL= +8 mA 4.5 V 2, 3 0.44 V 1 +0.25 Three - state output leakage current high 3021 IOZH 4/ m OE = 2.0 V For all other inputs, VIN= VCCor GND VOUT

42、= VCC5.5 V 2, 3 +2.5 A 1 -0.25 Three - state output leakage current low 3020 IOZL 4/ m OE = 2.0 V For all other inputs, VIN= VCCor GND VOUT= GND 5.5 V 2, 3 -2.5 A 1 +0.1 Input current high 3010 IIH 5/ For input under test, VIN= VCCFor all other inputs, VIN= VCCor GND 5.5 V 2, 3 +1.0 A 1 -0.1 Input c

43、urrent low 3009 IIL 5/ For input under test, VIN= GND For all other inputs, VIN= VCCor GND 5.5 V 2, 3 -1.0 A 1 4.0 Quiescent supply current ICCFor all inputs, VIN= VCCor GND IOUT= 0.0 A 5.5 V 2, 3 40.0 A 1 1.35 Quiescent supply current delta, TTL input levels 3005 ICC6/ For input at 3.4 V Other inpu

44、ts at VCCor GND 5.5 V 2, 3 1.5 mA Input capacitance 3012 CINTC= +25C, VIN= VCCor GND See 4.4.1c 5.0 V 4 10.0 pF I/O capacitance 3012 CI/OTC= +25C, VOUT= VCCor GND See 4.4.1c 5.0 V 4 12.0 pF Power dissipation capacitance CPD7/ CL= 50 pF minimum f = 1 MHz See 4.4.1c 5.0 V 4 14.0 pF See footnotes at en

45、d of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SIZE A 5962-96819 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218 - 3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance char

46、acteristics - Continued. Limits 3/ Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C +4.5 V VCC +5.5 V unless otherwise specified VCCGroup A subgroups Min Max Unit VOLP8/ 5.0 V 4 1750 mV Low level ground bounce noise VOLV8/ 5.0 V 4 -1500 mV VOHP8/ 5.0 V 4 700 mV High level

47、VCCbounce noise VOHV8/ VIH= 3.0 V, VIL= 0.0 V TA= +25C See 4.4.1d See figure 4 5.0 V 4 -1100 mV 4.5 V Functional test 3014 9/ VIN= VIHor VIL Verify output VOSee 4.4.1b 5.5 V 7, 8 L H 9 7.7 CL= 15 pF minimum See figure 5 11/ 4.5 V and 5.5 V 10, 11 1.0 10.0 9 8.7 tPLH 10/ CL= 50 pF minimum See figure

48、5 4.5 V and 5.5 V 10, 11 1.0 11.0 9 7.7 CL= 15 pF minimum See figure 5 11/ 4.5 V and 5.5 V 10, 11 1.0 10.0 9 8.7 Propagation delay time, An to Bn or Bn to An 3003 tPHL 10/ CL= 50 pF minimum See figure 5 4.5 V and 5.5 V 10, 11 1.0 11.0 ns 9 13.8 CL= 15 pF minimum RL= 1 K See figure 5 11/ 4.5 V and 5.5 V 10, 11 1.0 16.0 9 14.8 tPZH 10/ CL= 50 pF minimum RL= 1 K See figure 5 4.5 V and 5.5 V 10, 11 1.0 17.0 9 13.8 CL= 15 pF minimum RL= 1 K See figure 5 11/ 4.5 V and 5.5 V 10, 11 1.0 16.0 9 14.8 Propagation del