DLA SMD-5962-96813 REV A-2007 MICROCIRCUIT DIGITAL ADVANCED CMOS HEX INVERTER SCHMITT TRIGGER TTL COMPATIBLE INPUTS MONOLITHIC SILICON《互补金属氧化物半导体 六角倒相施密特触发器 晶体管输入硅单片电路数字微电路》.pdf

《DLA SMD-5962-96813 REV A-2007 MICROCIRCUIT DIGITAL ADVANCED CMOS HEX INVERTER SCHMITT TRIGGER TTL COMPATIBLE INPUTS MONOLITHIC SILICON《互补金属氧化物半导体 六角倒相施密特触发器 晶体管输入硅单片电路数字微电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-96813 REV A-2007 MICROCIRCUIT DIGITAL ADVANCED CMOS HEX INVERTER SCHMITT TRIGGER TTL COMPATIBLE INPUTS MONOLITHIC SILICON《互补金属氧化物半导体 六角倒相施密特触发器 晶体管输入硅单片电路数字微电路》.pdf（24页珍藏版）》请在麦多课文档分享上搜索。

1、REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add appendix A, microcircuit die. Update the boilerplate to MIL-PRF-38535 requirements and to include radiation hardness assurance requirements. - jak 07-03-15 Thomas M. Hess REV SHET REV A A A A A A A A A SHEET 15 16 17 18 19 20 21 22 23 REV A A

2、A A A A A A A A A A A A REV STATUS OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Thanh V. Nguyen CHECKED BY Thanh V. Nguyen DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil APPROVED BY Thomas M. Hess DRAWING APPROVAL DATE 05-05-25 MICROCIRCUIT,

3、DIGITAL, ADVANCED CMOS, HEX INVERTER SCHMITT TRIGGER, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON SIZE A CAGE CODE 67268 5962-96813 STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A REVISION LEVEL A SHEET 1 OF 23 DSCC

4、FORM 2233 APR 97 5962-E244-07Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SIZE A 5962-96813 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. T

5、his drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Ra

6、diation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 F 96813 01 V X A Federal RHA Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) /

7、(see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with t

8、he appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54ACT14 Hex inverter Schmitt trigger, TTL compatible inputs 1.2.3 Device class designator. The devic

9、e class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V

10、Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X CDFP3-F14 14 Flat pack 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for

11、 device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SIZE A 5962-96813 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3

12、 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage range (VIN) -0.5 V dc to VCC + 0.5 V dc DC output voltage range (VOUT) . -0.5 V dc to VCC+ 0.5 V dc DC input/output clamp current (IIK, IOK) 20 mA DC output current (per p

13、in) (IOUT). 50 mA DC VCCor GND current (per output pin) (ICC, IGND) 100 mA Maximum power dissipation (PD) . 500 mW Storage temperature range (TSTG) . -65C to +150C Lead temperature (soldering, 10 seconds). +260C Thermal resistance, junction-to-case (JC). See MIL-STD-1835 Junction temperature (TJ) +1

14、75C 4/ 1.4 Recommended operating conditions. 2/ 3/ Supply voltage range (VCC) +4.5 V dc to +5.5 V dc Input voltage range (VIN) +0.0 V dc to VCCOutput voltage range (VOUT). +0.0 V dc to VCCMaximum high level output current (IOH) -24 mA Maximum low level output current (IOL) +24 mA Case operating temp

15、erature range (TC). -55C to +125C 1.5 Radiation features. Maximum total dose available (dose rate = 50 300 rads (Si)/s) 300 krads (Si) Single Event Latch-up (SEL) 93 MeV-cm2/mg 5/ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximu

16、m levels may degrade performance and affect reliability. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. 4/ Maximum junction temperature shall no

17、t be exceeded except for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. 5/ Limits are guaranteed by design or process, but not production tested unless specified by the customer through the purchase order or contract. Provided by IHSNot for Resal

18、eNo reproduction or networking permitted without license from IHS-,-,-SIZE A 5962-96813 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks

19、. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manu

20、facturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard

21、 Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The followin

22、g document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. ELECTRONIC INDUSTRIES ALLIANCE (EIA) JEDEC Standard No. 20 - Standard for Description of 54/74ACXXXX and 54/74ACTXXXX

23、Advanced High-Speed CMOS Devices. (Copies of this document is available online at www.eia.org/ or from the Electronics Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834). AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM) ASTM F1192 - Standard Guide for the Measurement of Single Ev

24、ent Phenomena (SEP) Induced by Heavy Ion Irradiation of semiconductor Devices. (Copies of these documents are available online at http:/www.astm.org or from ASTM International, 100 Barr Harbor Drive, P.O. Box C700, West Conshohocken, PA 19428-2959). 2.3 Order of precedence. In the event of a conflic

25、t between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requi

26、rements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requireme

27、nts for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.1.1 Microcircuit die. For the requirements of microcircuit die, see appendix A to this document. Provided by IHSNot for ResaleNo reproduction or networking permit

28、ted without license from IHS-,-,-SIZE A 5962-96813 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as sp

29、ecified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Trut

30、h table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Ground bounce load circuit and waveforms. The ground bounce load circuit and waveforms shall be as specified on figure 4. 3.2.6 Switching waveforms and test cir

31、cuit. The switching waveforms and test circuit shall be as specified on figure 5. 3.2.7 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon req

32、uest. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and post irradiation parameter limits are as specified in table IA and shall apply over the full case operating temperature range. 3.4

33、Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table IA. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked

34、. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in ac

35、cordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be

36、a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate o

37、f compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers produc

38、t meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class

39、M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any c

40、hange that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at t

41、he option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 36 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,

42、-SIZE A 5962-96813 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 TABLE IA. Electrical performance characteristics. Limits 4/ Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ 3/ -55C TC +125C +4.5 V V

43、CC +5.5 V unless otherwise specified Device type and device class VCCGroup A subgroups Min Max Unit Positive input clamp voltage 3022 VIC+ For input under test, IIN= 1.0 mA All Q, V 0.0 V 1 0.4 1.5 V Negative input clamp voltage 3022 VIC- For input under test, IIN= -1.0 mA All Q, V Open 1 -0.4 -1.5

44、V 4.5 V 4.4 IOH= -50 A All All 5.5 V 1, 2, 3 5.4 4.5 V 1, 2, 3 3.70 IOH= -24 mA All All 5.5 V 1, 2, 3 4.70 High level output voltage 3006 VOHFor all inputs affecting output under test, VIN= 2.0 V or 0.8 V For all other inputs, VIN= VCCor GND IOH= -50 mA 5/ All All 5.5 V 1, 2, 3 3.85 V 4.5 V 0.1 IOL=

45、 50 A All All 5.5 V 1, 2, 3 0.1 1 0.36 4.5 V 2, 3 0.50 1 0.36 IOL= 24 mA All All 5.5 V 2, 3 0.50 Low level output voltage 3007 VOLFor all inputs affecting output under test, VIN= 2.0 V or 0.8 V For all other inputs, VIN= VCCor GND IOL= 50 mA 5/ All All 5.5 V 1, 2, 3 1.65 V Positive-going theshold vo

46、ltage VT+ All All 4.5 V 1, 2, 3 2.0 V Negative-going theshold voltage VT- All All 4.5 V 1, 2, 3 0.8 V Hysteresis voltage (VT+- VT-) VT All All 4.5 V 1, 2, 3 0.4 1.2 V 1 0.1 Input leakage current high 3010 IIH For input under test, VIN= VCCFor all other inputs, VIN= VCCor GND All All 5.5 V 2, 3 1.0 A

47、 1 -0.1 Input leakage current low 3009 IIL For input under test, VIN= GND For all other inputs, VIN= VCCor GND All All 5.5 V 2, 3 -1.0 A 1 2.0 VIN= VCCor GND All All 5.5 V 2, 3 80.0 Quiescent supply current, output high 3005 ICCHM, D, P, L, R, F 6/ 01 Q, V 5.5 V 1 50.0 A See footnotes at end of tabl

48、e. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SIZE A 5962-96813 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 TABLE IA. Electrical performance characteristic

49、s - Continued. Limits 4/ Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ 3/ -55C TC +125C +4.5 V VCC +5.5 V unless otherwise specified Device type and device class VCCGroup A subgroups Min Max Unit 1 2.0 VIN= VCCor GND All All 5.5 V 2, 3 80.0 Quiescent supply current, output low 3005 ICCLM, D, P, L, R, F