DLA SMD-5962-96756 REV B-2007 MICROCIRCUIT LINEAR RADIATION HARDENED ULTRA HIGH SPEED CURRENT FEEDBACK AMPLIFIER WITH OFFSET ADJUST MONOLITHIC SILICON《极可调整电流反馈放大器硅单片电路线型微电路》.pdf
《DLA SMD-5962-96756 REV B-2007 MICROCIRCUIT LINEAR RADIATION HARDENED ULTRA HIGH SPEED CURRENT FEEDBACK AMPLIFIER WITH OFFSET ADJUST MONOLITHIC SILICON《极可调整电流反馈放大器硅单片电路线型微电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-96756 REV B-2007 MICROCIRCUIT LINEAR RADIATION HARDENED ULTRA HIGH SPEED CURRENT FEEDBACK AMPLIFIER WITH OFFSET ADJUST MONOLITHIC SILICON《极可调整电流反馈放大器硅单片电路线型微电路》.pdf(17页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Make changes to the descriptive designator under 1.2.4. Change ratings values under 1.3. Editorial changes throughout. - lgt 99-08-06 R. MONNIN B Add low dose rate footnote to 1.5 and Table I. Delete Neutron and Latch-up parameters under 1.5. Del
2、ete Accelerated aging test, Neutron testing, and Dose rate induced latchup testing paragraphs under 4.4.4. - ro 07-04-24 R. HEBER REV SHET REV B B SHET 15 16 REV STATUS REV B B B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY RICK OFFICER DEFENSE SUPPLY C
3、ENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY RAJESH PITHADIA COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY MICHAEL FRYE AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 96-01-31 MICROCIRCUIT, LINEAR, RADIAT
4、ION HARDENED, ULTRA HIGH SPEED, CURRENT FEEDBACK AMPLIFIER WITH OFFSET ADJUST, MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-96756 SHEET 1 OF 16 DSCC FORM 2233 APR 97 5962-E321-07 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS
5、-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96756 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space
6、 application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 59
7、62 F 96756 01 V P A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified
8、 RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the c
9、ircuit function as follows: Device type Generic number Circuit function 01 HS1120RH Radiation hardened dielectric isolated (D.I.), ultra high speed current feedback amplifier with offset adjust 1.2.3 Device class designator. The device class designator is a single letter identifying the product assu
10、rance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outlin
11、e(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style P GDIP1-T8 or CDIP2-T8 8 Dual-in-line 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A
12、for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96756 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings.
13、1/ Voltage between +VSand -VS. 12 V dc Differential input voltage 5 V dc Voltage at either input terminal +VSand -VSOutput current (50% duty cycle) 55 mA Maximum package power dissipation (PD) at TA= +125C 0.44 W 2/ Junction temperature (TJ) +175C Storage temperature range (TSTG) . -65C to +150C Lea
14、d temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) 30C/W Thermal resistance, junction-to-ambient (JA) . 115C/W 1.4 Recommended operating conditions. Operating supply voltage (VS) . 5 V Load resistance (RL) 50 Ambient operating temperature range (TA) . -55C to +125C
15、 1.5 Radiation features. Maximum total dose available (dose rate = 50-300 rads (Si)/s) 300 Krads (Si) 3/ 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. U
16、nless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuit
17、s. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or
18、http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and aff
19、ect reliability. 2/ If device power exceeds package dissipation capability, provide heat sinking or derate linearly. The derating is based on JAat the following rate of 8.7 mW/C. 3/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects. Radi
20、ation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883, method 1019, condition A. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96756 DEFENSE SUPPLY
21、CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes appl
22、icable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Managemen
23、t (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction,
24、 and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein. 3.2.2 Te
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