DLA SMD-5962-96657 REV A-1997 MICROCIRCUIT DIGITAL RADIATION HARDENED CMOS PRESETTABLE UP DOWN COUNTERS MONOLITHIC SILICON《抗辐射互补金属氧化物半导体可预先调整的上下计数器硅单片电路数字微电路》.pdf

《DLA SMD-5962-96657 REV A-1997 MICROCIRCUIT DIGITAL RADIATION HARDENED CMOS PRESETTABLE UP DOWN COUNTERS MONOLITHIC SILICON《抗辐射互补金属氧化物半导体可预先调整的上下计数器硅单片电路数字微电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-96657 REV A-1997 MICROCIRCUIT DIGITAL RADIATION HARDENED CMOS PRESETTABLE UP DOWN COUNTERS MONOLITHIC SILICON《抗辐射互补金属氧化物半导体可预先调整的上下计数器硅单片电路数字微电路》.pdf（26页珍藏版）》请在麦多课文档分享上搜索。

1、NOTICE OF REVISION (NOR)THIS REVISION DESCRIBED BELOW HAS BEEN AUTHORIZED FOR THE DOCUMENT LISTED.1. DATE(YYMMDD)97-12-15Form ApprovedOMB No. 0704-0188Public reporting burden for this collection is estimated to average 2 hours per response, including the time for reviewinginstructions, searching exi

2、sting data sources, gathering and maintaining the data needed, and completing and reviewing thecollection of information. Send comments regarding this burden estimate or any other aspect of this collection of information,including suggestions for reducing this burden, to Department of Defense, Washi

3、ngton Headquarters Services, Directorate forInformation Operations and Reports, 1215 Jefferson Davis Highway, Suite 1204, Arlington, VA 22202-4302, and to the Office ofManagement and Budget, Paperwork Reduction Project (0704-0188), Washington, DC 20503.PLEASE DO NOT RETURN YOUR COMPLETED FORM TO EIT

4、HER OF THESE ADDRESSED. RETURN COMPLETEDFORM TO THE GOVERNMENT ISSUING CONTRACTING OFFICER FOR THE CONTRACT/ PROCURING ACTIVITYNUMBER LISTED IN ITEM 2 OF THIS FORM.2. PROCURINGACTIVITY NO.3. DODAAC4. ORIGINATORb. ADDRESS (Street, City, State, Zip Code)Defense Supply Center, Columbus3990 East Broad S

5、treetColumbus, OH 43216-50005. CAGE CODE672686. NOR NO.5962-R011-98a. TYPED NAME (First, Middle Initial,Last)7. CAGE CODE672688. DOCUMENT NO.5962-966579. TITLE OF DOCUMENTMICROCIRCUIT, DIGITAL, RADIATION HARDENED CMOS, PRESETTABLEUP/DOWN COUNTERS, MONOLITHIC SILICON10. REVISION LETTER11. ECP NO.No u

6、sers listed.a. CURRENT-b. NEWA12. CONFIGURATION ITEM (OR SYSTEM) TO WHICH ECP APPLIESAll13. DESCRIPTION OF REVISIONSheet 1: Revisions ltr column; add “A“.Revisions description column; add “Changes in accordance with NOR 5962-R011-98“.Revisions date column; add “97-12-15“.Revision level block; add “A

7、“.Rev status of sheets; for sheets 1, 4, and 15 through 23, add “A“.Sheet 4: Add new paragraph which states; “3.1.1 Microcircuit die. For the requirements for microcircuit die, see appendix A tothis document.“Revision level block; add “A“.Sheets 15 through 23: Add attached appendix A.CONTINUED ON NE

8、XT SHEETS14. THIS SECTION FOR GOVERNMENT USE ONLYa. (X one)X (1) Existing document supplemented by the NOR may be used in manufacture.(2) Revised document must be received before manufacturer may incorporate this change.(3) Custodian of master document shall make above revision and furnish revised d

9、ocument.b. ACTIVITY AUTHORIZED TO APPROVE CHANGE FORGOVERNMENTDSCC-VACc. TYPED NAME (First, Middle Initial, Last)MONICA L. POELKINGd. TITLECHIEF, CUSTOM MICROELECTRONICS TEAMe. SIGNATUREMONICA L. POELKINGf. DATE SIGNED(YYMMDD)97-12-1515a. ACTIVITY ACCOMPLISHING REVISIONDSCC-VACb. REVISION COMPLETED

10、(Signature)CHARLES F. SAFFLE, JR.c. DATE SIGNED(YYMMDD)97-12-15DD Form 1695, APR 92 Previous editions are obsolete.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGDEFENSE SUPPLY CENTER, COLUMBUSCOLUMBUS, OHIO 43216-5000SIZ

11、EA5962-96657REVISION LEVELASHEET15DSCC FORM 2234APR 97Document No: 5962-96657Revision: AAPPENDIX A NOR No: 5962-R011-98APPENDIX A FORMS A PART OF SMD 5962-96657 Sheet: 2 of 10 10. SCOPE10.1 Scope. This appendix establishes minimum requirements for microcircuit die to be supplied under the QualifiedM

12、anufacturers List (QML) Program. QML microcircuit die meeting the requirements of MIL-PRF-38535 and the manufacturersapproved QM plan for use in monolithic microcircuits, multichip modules (MCMs), hybrids, electronic modules, or devices usingchip and wire designs in accordance with MIL-PRF-38534 are

13、 specified herein. Two product assurance classes consisting ofmilitary high reliability (device class Q) and space application (device Class V) are reflected in the Part or Identification Number(PIN). When available a choice of Radiation Hardiness Assurance (RHA) levels are reflected in the PIN.10.2

14、 PIN. The PIN shall be as shown in the following example:5962 R 96657 01 V 9 AFederal RHA Device Device Die DieStock class designator type class code Detailsdesignator (see 10.2.1) (see 10.2.2) designator (see 10.2.4)(see 10.2.3) Drawing Number 10.2.1 RHA designator. Device classes Q and V RHA ident

15、ified die shall meet the MIL-PRF-38535 specified RHA levels. Adash (-) indicates a non-RHA die.10.2.2 Device type(s). The device type(s) shall identify the circuit function as follows:Device type Generic number Circuit function01 4510B Radiation Hardened, CMOS, presettableBCD up/down counter.02 4516

16、B Radiation Hardened, CMOS, presettablebinary up/down counter.03 4516BN Radiation Hardened, CMOS, presettablebinary up/down counter, neutron irradiated die.10.2.3 Device class designator.Device class Device requirements documentationQ or V Certification and qualification to the die requirements of M

17、IL-PRF-38535.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGDEFENSE SUPPLY CENTER, COLUMBUSCOLUMBUS, OHIO 43216-5000SIZEA5962-96657REVISION LEVELASHEET16DSCC FORM 2234APR 97Document No: 5962-96657Revision: AAPPENDIX A NOR

18、 No: 5962-R011-98APPENDIX A FORMS A PART OF SMD 5962-96657 Sheet: 3 of 10 10.2.4 Die Details. The die details designation shall be a unique letter which designates the dies physical dimensions,bonding pad location(s) and related electrical function(s), interface materials, and other assembly related

19、 information, for eachproduct and variant supplied to this appendix.10.2.4.1 Die Physical dimensions.Die Types Figure number01 A-102, 03 A-210.2.4.2 Die Bonding pad locations and Electrical functions.Die Types Figure number01 A-102, 03 A-210.2.4.3 Interface Materials.Die Types Figure number01 A-102,

20、 03 A-210.2.4.4 Assembly related information.01 A-102, 03 A-210.3 Absolute maximum ratings. See paragraph 1.3 within the body of this drawing for details.10.4 Recommended operating conditions. See paragraph 1.4 within the body of this drawing for details.20. APPLICABLE DOCUMENTS20.1 Government speci

21、fications, standards, bulletin, and handbooks. Unless otherwise specified, the following specifications,standards, bulletin, and handbook of the issue listed in that issue of the Department of Defense Index of Specifications andStandards specified in the solicitation, form a part of this drawing to

22、the extent specified herein.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGDEFENSE SUPPLY CENTER, COLUMBUSCOLUMBUS, OHIO 43216-5000SIZEA5962-96657REVISION LEVELASHEET17DSCC FORM 2234APR 97Document No: 5962-96657Revision:

23、AAPPENDIX A NOR No: 5962-R011-98APPENDIX A FORMS A PART OF SMD 5962-96657 Sheet: 4 of 10 SPECIFICATIONDEPARTMENT OF DEFENSEMIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.STANDARDSDEPARTMENT OF DEFENSEMIL-STD-883 - Test Methods and Procedures for Microelectronics.HANDBO

24、OKDEPARTMENT OF DEFENSEMIL-HDBK-103 - List of Standardized Military Drawings (SMDs).(Copies of the specification, standards, bulletin, and handbook required by manufacturers in connection with specificacquisition functions should be obtained from the contracting activity or as directed by the contra

25、cting activity).20.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the textof this drawing shall take precedence.30. REQUIREMENTS30.1 Item Requirements. The individual item requirements for device classes Q and V shall be in accorda

26、nce withMIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. Themodification in the QM plan shall not effect the form, fit or function as described herein.30.2 Design, construction and physical dimensions. The design, construction and physica

27、l dimensions shall be as specifiedin MIL-PRF-38535 and the manufacturers QM plan, for device classes Q and V and herein.30.2.1 Die Physical dimensions. The die physical dimensions shall be as specified in 10.2.4.1 and on figures A-1 and A-2.30.2.2 Die bonding pad locations and electrical functions.

28、The die bonding pad locations and electrical functions shall be asspecified in 10.2.4.2 and on figures A-1 and A-2.30.2.3 Interface materials. The interface materials for the die shall be as specified in 10.2.4.3. and on figures A-1 and A-2.30.2.4 Assembly related information. The assembly related i

29、nformation shall be as specified in 10.2.4.4. and figures A-1 andA-2.30.2.5 Truth Tables. The truth tables shall be as defined within paragraph 3.2.3 of the body of this document.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DR

30、AWINGDEFENSE SUPPLY CENTER, COLUMBUSCOLUMBUS, OHIO 43216-5000SIZEA5962-96657REVISION LEVELASHEET18DSCC FORM 2234APR 97Document No: 5962-96657Revision: AAPPENDIX A NOR No: 5962-R011-98APPENDIX A FORMS A PART OF SMD 5962-96657 Sheet: 5 of 10 30.2.6 Radiation exposure circuit. The radiation exposure ci

31、rcuit shall be as defined within paragraph 3.2.4. of the body ofthis document.30.3 Electrical performance characteristics and post- irradiation parameter limits. Unless otherwise specified herein, theelectrical performance characteristics and post-irradiation parameter limits are as specified in tab

32、le I of the body of thisdocument.30.4 Electrical test requirements. The wafer probe test requirements shall include functional and parametric testing sufficientto make the packaged die capable of meeting the electrical performance requirements in table I.30.5 Marking. As a minimum, each unique lot o

33、f die, loaded in single or multiple stack of carriers, for shipment to a customer,shall be identified with the wafer lot number, the certification mark, the manufacturers identification and the PIN listed in 10.2herein. The certification mark shall be a “QML” or “Q” as required by MIL-PRF-38535.30.6

34、 Certification of compliance. For device classes Q and V, a certificate of compliance shall be required from aQML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 60.4 herein). The certificate ofcompliance submitted to DSCC-VA prior to listing as an approved sour

35、ce of supply for this appendix shall affirm that themanufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and the requirements herein.30.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 shallbe pro

36、vided with each lot of microcircuit die delivered to this drawing.40. QUALITY ASSURANCE PROVISIONS40.1 Sampling and inspection. For device classes Q and V, die sampling and inspection procedures shall be in accordancewith MIL-PRF-38535 or as modified in the device manufacturers Quality Management (Q

37、M) plan. The modifications in the QMplan shall not effect the form, fit or function as described herein.40.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and as defined in themanufacturers QM plan. As a minimum it shall consist of:a) Wafer Lot acceptanc

38、e for Class V product using the criteria defined within MIL-STD-883 TM 5007.b) 100% wafer probe (see paragraph 30.4).c) 100% internal visual inspection to the applicable class Q or V criteria defined within MIL-STD-883 TM2010or the alternate procedures allowed within MIL-STD-883 TM5004.Provided by I

39、HSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGDEFENSE SUPPLY CENTER, COLUMBUSCOLUMBUS, OHIO 43216-5000SIZEA5962-96657REVISION LEVELASHEET19DSCC FORM 2234APR 97Document No: 5962-96657Revision: AAPPENDIX A NOR No: 5962-R011-98APPENDIX

40、A FORMS A PART OF SMD 5962-96657 Sheet: 6 of 10 40.3 Conformance inspection.40.3.1 Group E inspection. Group E inspection is required only for parts intended to be identified as radiation assured (see30.5 herein). RHA levels for device classes Q and V shall be as specified in MIL-PRF-38535. End poin

41、t electrical testing ofpackaged die shall be as specified in table IIA herein. Group E tests and conditions are as specified within paragraphs 4.4.4.1,4.4.4.1.1, 4.4.4.2, 4.4.4.3, 4.4.4.4 and 4.4.4.5.50. DIE CARRIER50.1 Die carrier requirements. The requirements for the die carrier shall be accordan

42、ce with the manufacturers QM plan oras specified in the purchase order by the acquiring activity. The die carrier shall provide adequate physical, mechanical andelectrostatic protection.60. NOTES60.1 Intended use. Microcircuit die conforming to this drawing are intended for use in microcircuits buil

43、t in accordance withMIL-PRF-38535 or MIL-PRF-38534 for government microcircuit applications (original equipment), design applications andlogistics purposes.60.2 Comments. Comments on this appendix should be directed to DSCC-VA, Columbus, Ohio, 43216-5000 or telephone(614)-692-0536.60.3 Abbreviations

44、, symbols and definitions. The abbreviations, symbols, and definitions used herein are defined withMIL-PRF-38535 and MIL-STD-1331.60.4 Sources of Supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535.The vendors listed within QML-38535 have submitted

45、 a certificate of compliance (see 30.6 herein) to DSCC-VA and haveagreed to this drawing.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGDEFENSE SUPPLY CENTER, COLUMBUSCOLUMBUS, OHIO 43216-5000SIZEA5962-96657REVISION LEVEL

46、ASHEET20DSCC FORM 2234APR 97Document No: 5962-96657Revision: AAPPENDIX A NOR No: 5962-R011-98APPENDIX A FORMS A PART OF SMD 5962-96657 Sheet: 7 of 10 FIGURE A-1o DIE PHYSICAL DIMENSIONSDie Size: 2413 x 2540 microns.Die Thickness: 20 +/-1 mils.o DIE BONDING PAD LOCATIONS AND ELECTRICAL FUNCTIONSNOTE:

47、 Pad numbers reflect terminal numbers when placed in Case Outlines E, X (see Figure 1).Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGDEFENSE SUPPLY CENTER, COLUMBUSCOLUMBUS, OHIO 43216-5000SIZEA5962-96657REVISION LEVELAS

48、HEET21DSCC FORM 2234APR 97Document No: 5962-96657Revision: AAPPENDIX A NOR No: 5962-R011-98APPENDIX A FORMS A PART OF SMD 5962-96657 Sheet: 8 of 10 o INTERFACE MATERIALSTop Metallization: Al 11.0kA - 14.0kABackside Metallization NoneGlassivationType: PSGThickness 10.4kA - 15.6kASubstrate: Single crystal silicono ASSEMBLY RELATED INFORMATIONSubstrate Potential: Floating or tied to VDD.Special assemblyinstructions: Bond pad #16 (VDD) first.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICRO