DLA SMD-5962-96641 REV C-2003 MICROCIRCUIT DIGITAL RADIATION HARDENED CMOS QUAD 2-INPUT NAND SCHMITT TRIGGER MONOLITHIC SILICON《抗辐射互补金属氧化物半导体四重2输入与非施密特触发器硅单片电路数字微电路》.pdf

《DLA SMD-5962-96641 REV C-2003 MICROCIRCUIT DIGITAL RADIATION HARDENED CMOS QUAD 2-INPUT NAND SCHMITT TRIGGER MONOLITHIC SILICON《抗辐射互补金属氧化物半导体四重2输入与非施密特触发器硅单片电路数字微电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-96641 REV C-2003 MICROCIRCUIT DIGITAL RADIATION HARDENED CMOS QUAD 2-INPUT NAND SCHMITT TRIGGER MONOLITHIC SILICON《抗辐射互补金属氧化物半导体四重2输入与非施密特触发器硅单片电路数字微电路》.pdf（21页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R219-97. 97-04-04 Monica L. Poelking B Changes in accordance with NOR 5962-R423-97. 97-08-08 Raymond Monnin C Incorporate revisions A and B. Update boilerplate to MIL-PRF-38535 requirements. Editorial changes t

2、hroughout. LTG 03-07-02 Thomas M. Hess REV SHET REV C C C C C C SHEET 15 16 17 18 19 20 REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Marcia B. Kelleher STANDARD MICROCIRCUIT DRAWING CHECKED BY Monica L. Poelking DEFENSE SUPPLY CENTE

3、R COLUMBUS COLUMBUS, OHIO 43216 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Monica L. Poelking AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 95-12-27 MICROCIRCUIT, DIGITAL, RADIATION HARDENED CMOS, QUAD 2-INPUT NAND SCHMITT TRIGGER, MONOL

4、ITHIC SILICON AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-96641 SHEET 1 OF 20 DSCC FORM 2233 APR 97 5962-E409-03 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-

5、,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96641 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space ap

6、plication (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962

7、 R 96641 01 V X C Federal stock class designator RHA designator (see 1.2.1) Devicetype (see 1.2.2) Device class designator Caseoutline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified R

8、HA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the cir

9、cuit function as follows: Device type Generic number Circuit function 01 4093B Radiation hardened CMOS, quad 2-input NAND schmitt trigger 02 4093BN Radiation hardened CMOS, quad 2-input NAND schmitt trigger with neutron irradiated die 1.2.3 Device class designator. The device class designator is a s

10、ingle letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualifi

11、cation to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C CDIP2-T14 14 Dual-in-line package X CDFP3-F14 14 Flat package 1.2.5 Lead finish. The lead finish is as specified in MIL

12、-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96641 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION L

13、EVEL C SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VDD) -0.5 V dc to +20 V dc Input voltage range .-0.5 V dc to VDD+ 0.5 V dc DC input current, any one input . 10 mA Device dissipation per output transistor . 100 mW Storage temperature range (TSTG) -65C

14、 to +150C Lead temperature (soldering, 10 seconds) +265C Thermal resistance, junction-to-case (JC): Case C 24C/W Case X 30C/W Thermal resistance, junction-to-ambient JA): Case C 74C/W Case X 116C/W Junction temperature (TJ). +175C Maximum power dissipation at TA= +125C (PD): 4/ Case C 0.68 W Case X

15、0.43 W 1.4 Recommended operating conditions. Supply voltage range (VDD) 3.0 V dc to +18 V dc Case operating temperature range (TC). -55C to +125C Input voltage (VIN) 0 V to VDDOutput voltage (VOUT). 0 V to VDDRadiation features: Total dose . 1 x 105Rads (Si) Single event phenomenon (SEP) effective l

16、inear energy threshold, no upsets or latchup (see 4.4.4.5) 75 MeV/(cm2/mg) 5/ Dose rate upset (20 ns pulse) . 5 x 108 Rads(Si)/s 5/ Dose rate latch-up 2 x 108Rads(Si)/s 5/ Dose rate survivability 5 x 1011Rads(Si)/s 5/ Neutron irradiated . 1 x 1014neutrons/cm26/ 2. APPLICABLE DOCUMENTS 2.1 Government

17、 specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and

18、 Standards (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the

19、maximum levels may degrade performance and affect reliability. 2/ Unless otherwise specified, all voltages are referenced to VSS. 3/ The limits for the parameters specified herein shall apply over the full specified VDDrange and case temperature range of -55C to +125C unless otherwise noted. 4/ If d

20、evice power exceeds package dissipation capability, provide heat sinking or derate linearly (the derating is based on JA) at the following rate: Case C. 13.5 mW/C Case X. 8.6 mW/C 5/ Guaranteed by design or process but not tested. 6/ Device type 02 only. Provided by IHSNot for ResaleNo reproduction

21、or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96641 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835

22、- Interface Standard Electronic Component Case Outlines. HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Sta

23、ndardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, superse

24、des applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality M

25、anagement (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.1.1 Microcircui

26、t die. For the requirements for microcircuit die, see appendix A to this document. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein

27、 for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Radiation test connections. The radiation test connections shall be as specified in table III herein. 3.

28、3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical

29、 test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked as listed

30、in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V

31、 shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device cl

32、ass M shall be a “C“ as required in MIL-PRF-38535, appendix A. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96641 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 5 DSCC FORM

33、 2234 APR 97 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from

34、 a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V

35、, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shal

36、l be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535,

37、appendix A. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the revi

38、ewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 36 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUI

39、T DRAWING SIZE A 5962-96641 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Limits Test Symbol Conditions -55C TC +125C unless otherwise specified Device type Group A subgroups Min Max Units 1, 3

40、 1/ 1.0 VDD= 5 V VIN= 0.0 V or VDDAll 2 1/ 30 1, 3 1/ 2.0 VDD= 10 V VIN= 0.0 V or VDDAll 2 1/ 60 1, 3 1/ 2.0 VDD= 15 V VIN= 0.0 V or VDDAll 2 1/ 120 1 2.0 VDD= 20 V, VIN= 0.0 V or VDDAll 2 200 M, D, P, L, R 2/ All 1 7.5 Supply current IDDVDD= 18 V, VIN= 0.0 V or VDDAll 3 2.0 A 1 0.53 2 1/ 0.36 VDD=

41、5 V VO= 0.4 V VIN= 0.0 V or VDDAll 3 1/ 0.64 1 1.4 2 1/ 0.9 VDD= 10 V VO= 0.5 V VIN= 0.0 V or VDDAll 3 1/ 1.6 1 3.5 2 1/ 2.4 Low level output current (sink) IOLVDD= 15 V VO= 1.5 V VIN= 0.0 V or VDDAll 3 1/ 4.2 mA See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networki

42、ng permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96641 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Limits Test Symbol Conditions -55C TC +125C unl

43、ess otherwise specified Device type Group A subgroups Min Max Units 1 -0.53 2 1/ -0.36 VDD= 5 V VO= 4.6 V VIN= 0.0 V or VDDAll 3 1/ -0.64 1 -1.8 2 1/ -1.15 VDD= 5 V VO= 2.5 V VIN= 0.0 V or VDDAll 3 1/ -2.0 1 -1.4 2 1/ -0.9 VDD= 10 V VO= 9.5 V VIN= 0.0 V or VDDAll 3 1/ -1.6 1 -3.5 2 1/ -2.4 High leve

44、l output current (source) IOHVDD= 15 V VO= 13.5 V VIN= 0.0 V or VDDAll 3 1/ -4.2 mA VDD= 5 V, no load 1/ 1, 2, 3 4.95 VDD= 10 V, no load 1/ 1, 2, 3 9.95 Output voltage, high VOHVDD= 15 V, no load 3/ All 1, 2, 3 14.95 V VDD= 5 V, no load 1/ 1, 2, 3 0.05 VDD= 10 V, no load 1/ 1, 2, 3 0.05 Output volta

45、ge, low VOLVDD= 15 V, no load All 1, 2, 3 0.05 V VDD= 5 V 4/ 1, 2, 3 2.2 3.6 VDD= 5 V 5/ 1, 2, 3 2.6 4.0 VDD= 15 V 6/ 1, 2, 3 6.8 10.8 VDD= 10 V 1/ 4/ 1, 2, 3 4.6 7.1 VDD= 10 V 1/ 5/ 1, 2, 3 5.6 8.2 Positive trigger threshold voltage VPVDD= 15 V 1/ 5/ All 1, 2, 3 6.3 12.7 V VDD= 5 V 4/ 1, 2, 3 0.9 2

46、.8 VDD= 5 V 5/ 1, 2, 3 1.4 3.2 VDD= 15 V 6/ 1, 2, 3 4.0 7.4 VDD= 10 V 1/ 4/ 1, 2, 3 2.5 5.2 VDD= 10 V 1/ 5/ 1, 2, 3 3.4 6.6 Negative trigger threshold voltage VNVDD= 15 V 1/ 5/ All 1, 2, 3 4.8 9.6 V See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted w

47、ithout license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96641 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 8 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Limits Test Symbol Conditions -55C TC +125C unless otherwise

48、specified Device type Group A subgroups Min Max Units VDD= 5 V 4/ 1, 2, 3 0.3 1.6 VDD= 5 V 5/ 1, 2, 3 0.3 1.6 VDD= 15 V 6/ 1, 2, 3 1.6 5.0 VDD= 10 V 1/ 4/ 1, 2, 3 1.2 3.4 VDD= 10 V 1/ 5/ 1, 2, 3 1.2 3.4 Hysteresis voltage VHVDD= 15 V 1/ 5/ All 1, 2, 3 1.6 5.0 V VIN= VDDor GND, VDD= 20 V 1 -100 VIN= VDDor GND, VDD = 20 V 2 -1000 Input leakage current, low IILVIN= VDDor GND, VDD= 18 V All 3 -100 VIN= VDDor GND, VDD= 20 V 1 100 VIN= VDDor GND, VDD = 20 V 2 1000 Input leakage current, high IIHVIN= VDDor GND, VDD = 18 V All 3 100 nA VDD= 10 V, ISS=