DLA SMD-5962-95818 REV A-1998 MICROCIRCUIT DIGITAL RADIATION HARDENED CMOS 8-BIT INPUT OUTPUT PORT MONOLITHIC SILICON《抗辐射互补金属氧化物半导体8-BIT输入或输出端硅单片电路线型微电路》.pdf

《DLA SMD-5962-95818 REV A-1998 MICROCIRCUIT DIGITAL RADIATION HARDENED CMOS 8-BIT INPUT OUTPUT PORT MONOLITHIC SILICON《抗辐射互补金属氧化物半导体8-BIT输入或输出端硅单片电路线型微电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-95818 REV A-1998 MICROCIRCUIT DIGITAL RADIATION HARDENED CMOS 8-BIT INPUT OUTPUT PORT MONOLITHIC SILICON《抗辐射互补金属氧化物半导体8-BIT输入或输出端硅单片电路线型微电路》.pdf（26页珍藏版）》请在麦多课文档分享上搜索。

1、 SMD-59b2-9SL REV A 9999996 O121320 442 THIS REVISION DESCRIBED BELOW HAS BEEN AUTHORIZED FOR THE DOCUMENT LISTED. I NOTICE OF REVISION (NOR) ktr add “A“. Revisions description column; add Changes in accordance with NOR 59624301 8-98“. Revisionsdate column; add 98-02-10. Revision level block; add A.

2、 Rev status of sheets; for sheets 1,4, and 17 through 23, add “A“. Sheet 4: Add new paragraphwhich states; “3.1.1 Microcircuitdie. For the requirementsfor microcircuit die, see appendix A to this document. Revision level block; add “A. Sheets 17 through23: Add attached appendixA. CONTINUED ON NEXT S

3、HEETS f. DATE SIGNED (YYMMDD) 98-02-1 O c. DATE SIGNED (YYMMDD) 98-02-1 O DD Form 1695, APR 92 Previous editions are obsolete. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- SMD-5962-75818 REV A 999999b 0323723 389 APPENDIX A APPENDIX A FORMS A PAR

4、T OF SMD 5962-9581 8 Document No: 5962-95818 Revision: A Sheet: 2 of 8 NOR NO: 5962-R018-98 I lo- 10.1 Scope. This appendix establishes minimum requirements for microcircuit die to be supplied under the Qualified Manufacturers List (QML) Program. QML microcircuit die meeting the requirements of MIL-

5、PRF-38535 and the manufacturers approved QM plan for use in monolithic microcircuits, multichip modules (MCMs), hybrids, electronic modules, or devices using chip and wire designs in accordance with MIL-PRF-38534 are specified herein. Two product assurance classes consisting of military high reliabi

6、lity (device class Q) and space application (device Class V) are reflected in the Part or Identification Number (PIN). When available a choice of Radiation Hardiness Assurance (RHA) levels are reflected in the PIN. 10.2 m. The PIN shall be as shown in the following example: Federal RHA Device Device

7、 Die Die Stock class designator type class code Details designator (see 10.2.1) (see 10.2.2) designator (see 10.2.4) (see 10.2.3) * Drawing Number 10.2.1 RHA desianator. Device classes Q and V RHA identified die shall meet the MIL-PRF-38535 specified RHA levels. A dash (-) indicates a non-RHA die. 1

8、0.2.2 Device tvpels). The device type(s) shall identify the circuit function as follows: Device ivpe Generic number Circuit function o1 I 10.2.3 Device class desianator. Device class Cl orV 82C12RH Radiation Hardened, CMOS, 8-bit inpuoutput port Device requirements documentation Certification and qu

9、alification to the die requirements of MIL-PRF-38535. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO 43216-5000 P DSCC FORM 2234 APR 97 SIZE A 5962-9581 8 SHEET 17 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-APPENDIX

10、 A APPENDIX A FORMS A PART OF SMD 5962-9581 8 Document No: 5962-9581 8 Revision: A Sheet: 3 of 8 NOR NO: 5962-R018-98 10.2.4 Die Details. The die details designation shall be a unique letter which designates the dies physical dimensions, bonding pad location(s) and related electrical function(s), in

11、terface materials, and other assembly related information, for each product and variant supplied to this appendix. 10.2.4.1 Die Phvsical dimensions. Die TvDe Fiaure number O1 A- 1 10.2.4.2 Die Bondina Dad locations and Electrical functions. I Die TvDe o1 10.2.4.3 Interface Materials. Fiaure number A

12、- 1 Die TVDe Fiaure number I o1 A-1 10.2.4.4 Assembly related information. I o1 A- 1 10.3 Absolute maximum ratinas. See paragraph 1.3 within the body of this drawing for details. I 10.4 Recommended operatina conditions. See paragraph 1.4 within the body of this drawing for details. 20. APPLICABLE DO

13、CUMENTS 20.1 Government soecifications. standards, bulletin, and handbooks. Unless otherwise specified, the following specifications, standards, bulletin, and handbook of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the solicitation,

14、form a part of this drawing to the extent specified herein. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO 43216-5000 SIZE A REVISION LEVEL A 5962-9581 8 SHEET 18 DSCC FORM 2234 APR 97 Provided by IHSNot for ResaleNo reproduction or networking permitted without license

15、from IHS-,-,-SHD-5962-95818 REV A m 9977996 0121723 151 m , 30.2.4 Assemblv related information. The assembly related information shall be as specified in 10.2.4.4. and figure A-1 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-9581 8 SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38535 - Integrated Cir

16、cuits, Manufacturing, General Specification for. STAN DARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Methods and Procedures for Microelectronics. HANDBOOK DEPARTMENT OF DEFENSE MIL-HDBK-103 - List of Standardized Military Drawings (SMDs). Document No: 5962-95818 Revision: A Sheet: 4 of 8 NOR NO: 596

17、2-R018-98 (Copies of the specification, standards, bulletin, and handbook required by manufacturers in connection with specific acquisition functions should be obtained from the contracting activity or as directed by the contracting activity). 20.2 Order of DreCedenCe. In the event of a conflict bet

18、ween the text of this drawing and the references cited herein, the text of this drawing shall take precedence. 30. REQUIREMENTS 30.1 Item Reuuirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the

19、device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not effect the form, fit or function as described herein. 30.2 Desiun, construction and DhVSiCal dimensions. The design, construction and physical dimensions shall be as specified in MIL-PRF-38535 and the manufa

20、cturers QM plan, for device classes Q and V and herein. 30.2.1 Die Phvsical dimensions. The die physical dimensions shall be as specified in 10.2.4.1 and on figure A-1. 30.2.2 Die bondinq pad locations and electrical functions. The die bonding pad locations and electrical functions shall be as speci

21、fied in 10.2.4.2 and on figure A-1 . 30.2.3 Interface materials. The interface materials for the die shall be as specified in 10.2.4.3. and on figure A-1 . STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO 4321 6-5000 I DSCC FORM 2234 APR 97 SIZE A 5962-9581 8 SHEET 19 Pro

22、vided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-59b2-95818 REV A m 9999996 0121724 098 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-95818 Document No: 5962-9581 8 Revision: A Sheet: 5 of 8 NOR NO: 596243018-98 30.2.5 Truth Table. The truth table s

23、hall be as defined within paragraph 3.2.3 of the body of this document. 30.2.6 Radiation exposure circuit. The radiation exposure circuit shall be as defined within paragraph 3.2.6 of the body of this document. 30.3 Electrical performance characteristics and Dost- irradiation parameter limits. Unles

24、s otherwise specified herein, the electrical performance characteristics and post-irradiation parameter limits are as specified in table I of the body of this document. 30.4 Electrical test reauirements. The wafer probe test requirements shall include functional and parametric testing sufficient to

25、make the packaged die capable of meeting the electrical performance requirements in table I. 30.5 Markinq. As a minimum, each unique lot of die, loaded in single or multiple stack of carriers, for shipment to a customer, shall be identified with the wafer lot number, the certification mark, the manu

26、facturers identification and the PIN listed in 10.2 herein. The certification mark shall be a “QML“ or “Q“ as required by MIL-PRF-38535. 30.6 Certification of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply

27、 to the requirements of this drawing (see 60.4 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this appendix shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and the requi

28、rements herein. 30.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 shall be provided with each lot of microcircuit die delivered to this drawing. 40. QUALITY ASSURANCE PROVISIONS 40.1 Samplina and inspection. For device classes Q and

29、 V, die sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modifications in the QM plan shall not effect the form, fit or function as described herein. 40.2 Screeninq. For device classes Q and V, s

30、creening shall be in accordance with MIL-PRF-38535, and as defined in the manufacturersQM plan. As a minimum it shall consist of: a) Wafer Lot acceptance for Class V product using the criteria defined within MIL-STD-883 TM 5007. b) 100% wafer probe (see paragraph 30.4). c) 100% internal visual inspe

31、ction to the applicable class Q or V criteria defined within MIL-STD-883 TM2010 or the alternate procedures allowed within MIL-STD-883 TM5004. STAN DARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO 43216-5000 SIZE A 5962-9581 8 SHEET 20 DSCC FORM 2234 APR 97 Provided by IHSNot

32、 for ResaleNo reproduction or networking permitted without license from IHS-,-,- SMD-5962-75818 REV A 9999996 0121725 T2V APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-9581 8 Document No: 5962-95818 Revision: A Sheet: 6 of 8 NOR NO: 5962-R018-98 40.3 Conformance inspection. 40.3.1 Grou0 E inspectio

33、n. Group E inspection is required only for parts intended to be identified as radiation assured (see 0.5 herein). RHA levels for device classes Q and V shall be as specified in MIL-PRF-38535. End point electrical testing of ackaged die shall be as specified in table HA herein. Group E tests and cond

34、itions are as specified within paragraphs 4.4.4.1, .4.4.1.1., 4.4.4.2,4.4.4.3, and4.4.4.4. 50. DIE CARRIER 50.1 Die carrier reauirements. The requirements for the die carrier shall be in accordance with the manufacturers QM plan r as specified in the purchase order by the acquiring activity. The die

35、 carrier shall provide adequate physical, mechanical and lectrostatic protection. 60. NOTES 60.1 Intended use. Microcircuit die conforming to this drawing are intended for use in microcircuits built in accordance with AIL-PRF-38535 or MIL-PRF-38534 for government microcircuit applications (original

36、equipment), design applications and igistics purposes. 60.2 Comments. Comments on this appendix should be directed to DSCC-VA, Columbus, Ohio, 4321 6-5000 or telephone 61 4)-692-0536. 60.3 Abbreviations, symbols and definitions. The abbreviations, symbols, and definitions used herein are defined wit

37、h AIL-PRF-38535 and MIL-STD-1331. 60.4 Sources of SumIy for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535. he vendors listed within QML-38535 have submitted a certificate of compliance (see 30.6 herein) to DSCC-VA and have igreed to this drawing. STANDA

38、RD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO 43216-5000 SIZE A 5962-9581 8 SHEET 21 DSCC FORM 2234 APR 97 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-59b2-958L8 REV A 9999996 0121726 9b0 D APPENDIX A APPENDIX A FORMS

39、 A PART OF SMD 5962-9581 8 Document No: 5962-95818 Revision: A Sheet: 7 of 8 NOR NO: 5962-R018-98 FIGURE A-1 o DIE PHYSICAL DIMENSIONS Die Size: Die Thickness: 1930 x 2270 microns. 14 +/-1 mils. o DIE BONDING PAD LOCATIONS AND ELECTRICAL FUNCTIONS NOTE: Pad numbers reflect terminal numbers when plac

40、ed in Case Outlines J, X (see Figure 1). STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO 43216-5000 SIZE A REVISION LEVEL A 5962-9581 8 I sHEET22 DSCC FORM 2234 APR 97 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- SMD-

41、59b2-95818 REV A m 999999b 0121727 T7 m APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-9581 8 Document No: 5962-9581 8 Revision: A Sheet: 8 of 8 NOR NO: 596243018-98 9.OkA - 13.0kA o INTERFACE MATERIALS Top Metallization: AlSi Backside Metallization Gold Glassivation Type: si02 Thickness 7.0kA - 9.O

42、kA Substrate: Single crystal silicon. o ASSEMBLY RELATED INFORMATION Substrate Potential: Floating. Special assembly instructions: None. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO 43216-5000 SIZE A 5962-9581 8 SHEET 23 DSCC FORM 2234 APR 97 Provided by IHSNot for Re

43、saleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING BULLETIN Standard microcircuit drawing PIN 5962R9581801V9A DATE: 98-02-1 O Vendor Vendor CAGE similar number PIN 11 34371 HSO-82C12RH-Q Approved sources of supply for SMD 5962-9581 8 are listed bel

44、ow for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has

45、 been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. - 11 Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. Vendor CAGE number

46、34371 Vendor name and address Harris Semiconductor P.O. Box 883 Melbourne, FL 32902-0883 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin. Provided by IHSNot for ResaleNo reproduc

47、tion or networking permitted without license from IHS-,-,-DESC FORM 193 JUL 94 5962-E212-96 DISTRIBUTION STATEMENT A Approved for public release; distribution is unlimited. REV STATUS OF S?LrTC PMIC N/A I STANDARD MIC ROC1 RC UIT DRAWING LTR THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND A

48、GENCIES OF THE DEPARTMENT OF DEFENSE DESCRIPTION DATE (YFMO-DA) APPROVED AMSC NA DRAWING APPROVAL DATE 96-01-1 1 REVISION LEVEL Thomas M. Hess DEFENSEELECTRONICSSUPPLYCENTER DAYTON, OHIO 45444 5962-9581 8 SIZE CAGE CODE A 67268 SHEET I OF 16 CHECKED BY Thomas M. Hess MICROCIRCUIT, DIGITAL, RADIATION

49、 HARDENED, SILICON CMOS, 8-BIT INPUT/OUTPUT PORT, MONOLITHIC APPROVED BY Monica L. Poelking Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-95818 M 999399b 0083975 746 M STANDARD MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 I 1. SCOPE 1.1 m. This drawi